未验证 提交 5986560e 编写于 作者: Y Yinan Xu 提交者: GitHub

Update Artifact Evaluation badges to README.md (#1789)

* Update Artifact Evaluation badges to README.md
上级 8815ed52
......@@ -14,6 +14,20 @@ Copyright 2020-2022 by Peng Cheng Laboratory.
* Micro-architecture documentation of XiangShan has been published. Please check out https://xiangshan-doc.readthedocs.io
## Publications
### MICRO 2022: Towards Developing High Performance RISC-V Processors Using Agile Methodology
Our paper introduces XiangShan and the practice of agile development methodology on high performance RISC-V processors.
It covers some representative tools we have developed and used to accelerate the chip development process, including design, functional verification, debugging, performance validation, etc.
This paper is awarded all three available badges for artifact evaluation (Available, Functional, and Reproduced).
![Artifacts Available](https://github.com/OpenXiangShan/XiangShan-doc/raw/main/publications/images/artifacts_available_dl.jpg)
![Artifacts Evaluated — Functional](https://github.com/OpenXiangShan/XiangShan-doc/raw/main/publications/images/artifacts_evaluated_functional_dl.jpg)
![Results Reproduced](https://github.com/OpenXiangShan/XiangShan-doc/raw/main/publications/images/results_reproduced_dl.jpg)
[Paper PDF](https://github.com/OpenXiangShan/XiangShan-doc/blob/main/publications/micro2022-xiangshan.pdf) | IEEE Xplore (TBD) | ACM DL (TBD) | BibTeX (TBD)
## Follow us
Wechat/微信:香山开源处理器
......@@ -119,13 +133,3 @@ In the development of XiangShan, some sub-modules from the open-source community
| Diplomacy/TileLink | [Rocket-chip](https://github.com/chipsalliance/rocket-chip) | We reused the Diplomacy framework and TileLink utility that exist in rocket-chip to negotiate bus. |
We are grateful for the support of the open-source community and encourage other open-source projects to reuse our code within the scope of the [license](LICENSE).
## Publications
### MICRO 2022: Towards Developing High Performance RISC-V Processors Using Agile Methodology
Our paper introduces XiangShan and the practice of agile development methodology on high performance RISC-V processors.
It covers some representative tools we have developed and used to accelerate the chip development process, including design, functional verification, debugging, performance validation, etc.
This paper is awarded all three available badges for artifacts evaluation.
[Paper PDF](https://github.com/OpenXiangShan/XiangShan-doc/blob/main/publications/micro2022-xiangshan.pdf) | IEEE Xplore (TBD) | ACM DL (TBD) | BibTeX (TBD)
......@@ -14,6 +14,20 @@ English Readme is [here](README.md).
* 香山微结构文档已经发布,欢迎访问 https://xiangshan-doc.readthedocs.io
## 论文发表情况
### MICRO 2022: Towards Developing High Performance RISC-V Processors Using Agile Methodology
我们在 MICRO'22 会议上的论文介绍了香山处理器及敏捷开发实践经验,包括一些面向设计、功能验证、调试、性能评估等方面的敏捷开发工具。论文得到了 Artifact Evaluation 的所有三个徽章。
![Artifacts Available](https://github.com/OpenXiangShan/XiangShan-doc/raw/main/publications/images/artifacts_available_dl.jpg)
![Artifacts Evaluated — Functional](https://github.com/OpenXiangShan/XiangShan-doc/raw/main/publications/images/artifacts_evaluated_functional_dl.jpg)
![Results Reproduced](https://github.com/OpenXiangShan/XiangShan-doc/raw/main/publications/images/results_reproduced_dl.jpg)
[Paper PDF](https://github.com/OpenXiangShan/XiangShan-doc/blob/main/publications/micro2022-xiangshan.pdf) | IEEE Xplore (TBD) | ACM DL (TBD) | BibTeX (TBD)
## 关注我们
Wechat/微信:香山开源处理器
......@@ -114,11 +128,3 @@ make emu CONFIG=MinimalConfig EMU_THREADS=2 -j10
| Diplomacy/TileLink | [Rocket-chip](https://github.com/chipsalliance/rocket-chip) | 我们复用了来自 rocket-chip 的 Diplomacy 框架和 Tilelink 工具,来协商总线. |
我们深深地感谢来自开源社区的支持,我们也鼓励其他开源项目在[木兰宽松许可证](LICENSE)的范围下复用我们的代码。
## 论文发表情况
### MICRO 2022: Towards Developing High Performance RISC-V Processors Using Agile Methodology
我们在 MICRO'22 会议上的论文介绍了香山处理器及敏捷开发实践经验,包括一些面向设计、功能验证、调试、性能评估等方面的敏捷开发工具。论文得到了 Aritifact Evaluation 的所有三个徽章。
[Paper PDF](https://github.com/OpenXiangShan/XiangShan-doc/blob/main/publications/micro2022-xiangshan.pdf) | IEEE Xplore (TBD) | ACM DL (TBD) | BibTeX (TBD)
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