'interrupt-parent' is often documented as part of define bindings, but
it is really outside the scope of a device binding. It's never required
in a given node as it is often inherited from a parent node. Or it can
be implicit if a parent node is an 'interrupt-controller' node. So
remove it from all the binding files.

Cc: Mark Rutland <mark.rutland@arm.com>
Cc: devicetree@vger.kernel.org
Signed-off-by: NRob Herring <robh@kernel.org>

For platforms that has multiple copies of the TSENS hardware block it's
necessary to be able to specify the number of sensors per block in DeviceTree.
Signed-off-by: NBjorn Andersson <bjorn.andersson@linaro.org>
Reviewed-by: NAmit Kucheria <amit.kucheria@linaro.org>
Reviewed-by: NRob Herring <robh@kernel.org>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>

Update rcar thermal dt-binding to  add R8A77995 info.
Signed-off-by: NYoshihiro Kaneko <ykaneko0929@gmail.com>
Reviewed-by: NGeert Uytterhoeven <geert+renesas@glider.be>
Reviewed-by: NRob Herring <robh@kernel.org>
Reviewed-by: NSimon Horman <horms+renesas@verge.net.au>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>

The Exynos5440 is not actively developed, there are no development
boards available and probably there are no real products with it.
Remove wide-tree support for Exynos5440.
Signed-off-by: NKrzysztof Kozlowski <krzk@kernel.org>
[b.zolnierkie: ported over driver changes]
Signed-off-by: NBartlomiej Zolnierkiewicz <b.zolnierkie@samsung.com>
Reviewed-by: NRob Herring <robh@kernel.org>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>

Based on previous work by Ryo Kataoka <ryo.kataoka.wt@renesas.com>.
Signed-off-by: NNiklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Reviewed-by: NGeert Uytterhoeven <geert+renesas@glider.be>
Reviewed-by: NSimon Horman <horms+renesas@verge.net.au>
Reviewed-by: NRob Herring <robh@kernel.org>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>

Add a compatible string for thermal monitor implemented on
UniPhier PXs3 SoC.
Signed-off-by: NKunihiko Hayashi <hayashi.kunihiko@socionext.com>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>

This patch adds i.MX7 thermal sensor support, most
of the i.MX7 thermal sensor functions are same with
i.MX6 except the registers offset/layout, so we move
those registers offset/layout definitions to soc data
structure.

i.MX7 uses single calibration data @25C, the calibration
data is located at OCOTP offset 0x4F0, bit[17:9], the
formula is as below:

Tmeas = (Nmeas - n1) + 25; n1 is the fuse value for 25C.
Signed-off-by: NAnson Huang <Anson.Huang@nxp.com>
Signed-off-by: NBai Ping <ping.bai@nxp.com>
Acked-by: NDong Aisheng <aisheng.dong@nxp.com>
Acked-by: NShawn Guo <shawnguo@kernel.org>
Reviewed-by: NRob Herring <robh@kernel.org>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>

Add devicetree bindings for MediaTek MT7622 thermal controller

Changes v1 -> v2: add tag from Rob
Signed-off-by: NSean Wang <sean.wang@mediatek.com>
Signed-off-by: NShunli Wang <shunli.wang@mediatek.com>
Reviewed-by: NRob Herring <robh@kernel.org>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>

The datasheet has been expanded with more registers and the DT files
have been updated with the new size. This change updates the example so
writing new DT files can use the enhanced driver which uses the new
registers.
Signed-off-by: NNiklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Reviewed-by: NGeert Uytterhoeven <geert+renesas@glider.be>
Reviewed-by: NSimon Horman <horms+renesas@verge.net.au>
[robh: s/have/has/, s/enchanted/enhanced/]
Signed-off-by: NRob Herring <robh@kernel.org>

The "cooling-min-level" and "cooling-max-level" properties are not
parsed by any part of kernel currently and the max cooling state of a
CPU cooling device is found by referring to the cpufreq table instead.

Remove the unused bindings.
Signed-off-by: NViresh Kumar <viresh.kumar@linaro.org>
Reviewed-by: NRob Herring <robh@kernel.org>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>

Remove documentation for longer needed samsung thermal properties.
Signed-off-by: NBartlomiej Zolnierkiewicz <b.zolnierkie@samsung.com>
Reviewed-by: NRob Herring <robh@kernel.org>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>

Due to the old method has already been marked as deprecated in binding
doc, so obviously it's better to update the example to new bindings
as well.

Cc: Shawn Guo <shawn.guo@linaro.org>
Cc: Leonard Crestez <leonard.crestez@nxp.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: Rob Herring <robh+dt@kernel.org>
Cc: Mark Rutland <mark.rutland@arm.com>
Signed-off-by: NDong Aisheng <aisheng.dong@nxp.com>
Acked-by: NShawn Guo <shawnguo@kernel.org>
Signed-off-by: NRob Herring <robh@kernel.org>

Add compatible strings for AP806 and CP110 that are part of the Armada
8k/7k line of SoCs.

Add a note on the differences in the size of the control area in
different bindings. This is an existing difference between the Armada
375 binding and the other boards already supported. The new AP806 and
CP110 bindings are similar to the existing Armada 375 in this regard.
Signed-off-by: NBaruch Siach <baruch@tkos.co.il>
[<miquel.raynal@free-electrons.com>: reword, additional details]
Signed-off-by: NMiquel Raynal <miquel.raynal@free-electrons.com>
Reviewed-by: NRob Herring <robh@kernel.org>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>

Add thermal sensor support for r8a7743 SoC. The Renesas RZ/G1M
(r8a7743) thermal sensor module is identical to the R-Car Gen2 family.

No driver change is needed due to the fallback compatible value
"renesas,rcar-gen2-thermal".
Signed-off-by: NBiju Das <biju.das@bp.renesas.com>
Reviewed-by: NFabrizio Castro <fabrizio.castro@bp.renesas.com>
Reviewed-by: NGeert Uytterhoeven <geert+renesas@glider.be>
Reviewed-by: NRob Herring <robh@kernel.org>
Reviewed-by: NSimon Horman <simon.horman@netronome.com>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>

DT unit addresses should be lower case hex. Fix all the
binding examples.

Converted with the following command from Krzysztof Kozlowski:

sed -e 's/@\([a-fA-F0-9_-]*\) {/@\L\1 {/' -i $(find Documentation/devicetree/bindings -name '*.txt')
Signed-off-by: NRob Herring <robh@kernel.org>

Improve the binding example by removing all the leading 0x to fix the
following dtc warnings:

Warning (unit_address_format): Node /XXX unit name should not have leading "0x"

Converted using the following command:

find Documentation/devicetree/bindings -name "*.txt" -exec sed -i -e 's/([^ ])\@0x([0-9a-f])/$1\@$2/g' {} +

This is a follow up to commit 48c926cdSigned-off-by: NMathieu Malaterre <malat@debian.org>
Signed-off-by: NRob Herring <robh@kernel.org>

Add binding for Broadcom STB thermal.
Signed-off-by: NBrian Norris <computersforpeace@gmail.com>
Acked-by: NRob Herring <robh@kernel.org>
Signed-off-by: NMarkus Mayer <mmayer@broadcom.com>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>

Add a new compatible for thermal founding on RV1108 SoCs.
Acked-by: NRob Herring <robh@kernel.org>
Signed-off-by: NRocky Hao <rocky.hao@rock-chips.com>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>

In Tegra186, the BPMP (Boot and Power Management Processor) implements
an interface that is used to read system temperatures, including CPU
cluster and GPU temperatures. This binding describes the thermal sensor
that is exposed by BPMP.
Signed-off-by: NMikko Perttunen <mperttunen@nvidia.com>
Acked-by: NRob Herring <robh@kernel.org>
Signed-off-by: NThierry Reding <treding@nvidia.com>

This adds documentation of device tree bindings for the
thermal sensor controller of hi3660 SoC.
Signed-off-by: NKevin Wangtao <kevin.wangtao@linaro.org>
Signed-off-by: NDaniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: NRob Herring <robh@kernel.org>
Signed-off-by: NWei Xu <xuwei5@hisilicon.com>

On newer imx SOCs accessing OCOTP directly is wrong because the ocotp
clock needs to be enabled first. Add a binding for accessing the same
values through the imx-ocotp nvmem driver using nvmem-cells. This is
similar to other thermal drivers.

The old binding is preserved for compatibility and because it still
works fine on imx6qdl series chips.

In theory this problem could be solved by adding a reference to the
OCOTP clock instead but it is better to hide such details in a specific
nvmem driver.
Signed-off-by: NLeonard Crestez <leonard.crestez@nxp.com>
Acked-by: NRob Herring <robh@kernel.org>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

Pretty much any node can have a status property, so it doesn't need to
be in examples.

Converted with the following command and removed examples with SoC and
board specific splits:

git grep -l -E 'status.*=.*' Documentation/devicetree/ | xargs sed -i -E '/\sstatus.*=.*"(disabled|ok|okay)/d'
Acked-by: NMark Rutland <mark.rutland@arm.com>
Signed-off-by: NRob Herring <robh@kernel.org>

This adds the device tree binding documentation for the mediatek thermal
controller found on Mediatek MT2712.
Signed-off-by: NLouis Yu <louis.yu@mediatek.com>
Reviewed-by: NDawei Chien <dawei.chien@mediatek.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

attempt to new compatible for thermal founding on RK3328 SoC.
Signed-off-by: NRocky Hao <rocky.hao@rock-chips.com>
Acked-by: NRob Herring <robh@kernel.org>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

Add devicetree binding documentation for thermal monitor implemented on
Socionext UniPhier SoCs.
Signed-off-by: NKunihiko Hayashi <hayashi.kunihiko@socionext.com>
Acked-by: NRob Herring <robh@kernel.org>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

Add the missing .txt extension to the Broadcom Northstar binding document.
Signed-off-by: NMarkus Mayer <mmayer@broadcom.com>
Signed-off-by: NRob Herring <robh@kernel.org>

Device tree binding information for DA9062 and DA9061 thermal junction
temperature monitor.

Binding descriptions for the DA9061 and DA9062 thermal TJUNC supervisor
device driver, using a single THERMAL_TRIP_HOT trip-wire and allowing for
a configurable polling period for over-temperature polling.

This patch also adds two examples, one for DA9062 and one for DA9061. The
DA9061 example uses a fall-back compatible string for the DA9062.
Acked-by: NRob Herring <robh@kernel.org>
Signed-off-by: NSteve Twiss <stwiss.opensource@diasemi.com>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>

This commit documents binding for thermal used in Northstar family SoCs.

There isn't any known Northstar device with active cooling system so DT
example has empty cooling-maps node. There is also no support for CPU
frequency throttling so I put only a critical trip in the example.
Signed-off-by: NRafał Miłecki <rafal@milecki.pl>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>

Add a thermal zone in order to make the example complete.
Signed-off-by: NStefan Wahren <stefan.wahren@i2se.com>
Acked-by: NRob Herring <robh@kernel.org>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>

For different types of SoC the sensor id and endianness may vary.
"#thermal-sensor-cells" is used to provide sensor id information.
"little-endian" property is to tell the endianness of TMU.
Signed-off-by: NJia Hongtao <hongtao.jia@nxp.com>
Acked-by: NRob Herring <robh@kernel.org>
Acked-by: NScott Wood <scottwood@freescale.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

This patch adds dt-binding documentation for zx2967 family thermal sensor.
Signed-off-by: NBaoyou Xie <baoyou.xie@linaro.org>
Acked-by: NRob Herring <robh@kernel.org>
Reviewed-by: NShawn Guo <shawnguo@kernel.org>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>

Signed-off-by: NHien Dang <hien.dang.eb@renesas.com>
Signed-off-by: NKhiem Nguyen <khiem.nguyen.xt@renesas.com>
Signed-off-by: NWolfram Sang <wsa+renesas@sang-engineering.com>
Signed-off-by: NNiklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>

"rockchip,hw-tshut-temp", "rockchip,hw-tshut-mode" and
"rockchip,hw-tshut-polarity" are not a required properties
actually as the code could also work by loading the default
settings there. So it is apprently misleading, although we
prefer to get these from DT. And it seems we miss the 'rockchip,grf'
here which should also be an optional property.
Acked-by: NRob Herring <robh@kernel.org>
Reviewed-by: NHeiko Stuebner <heiko@sntech.de>
Signed-off-by: NShawn Lin <shawn.lin@rock-chips.com>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>

Add dt-binding documentation for bcm2835 SOC thermal sensor.
Signed-off-by: NMartin Sperl <kernel@martin.sperl.org>
Acked-by: NEric Anholt <eric@anholt.net>
Acked-by: NRob Herring <robh@kernel.org>

Changelog:
 V1 -> V2: renamed file to follow naming conventions
 V2 -> V3: removed 0x in node name
Signed-off-by: NEric Anholt <eric@anholt.net>

STiH415/6 SoC's are being removed from the kernel. This
patch removes the compatibles from the dt doc and also
updates the example to a supported platform.
Signed-off-by: NPeter Griffin <peter.griffin@linaro.org>
Cc: <rui.zhang@intel.com>
Cc: <edubezval@gmail.com>
Cc: <robh+dt@kernel.org>
Acked-by: NRob Herring <robh@kernel.org>

Add HW throttle configuration sub-node for soctherm, which
is used to describe the throttle event, and worked as a
cooling device. The "hot" type trip in thermal zone can
be bound to this cooling device, and trigger the throttle
function.
Signed-off-by: NWei Ni <wni@nvidia.com>
Acked-by: NRob Herring <robh@kernel.org>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

This adds the device tree binding documentation for the mediatek thermal
controller found on Mediatek MT2701.
Signed-off-by: NDawei Chien <dawei.chien@mediatek.com>
Reviewed-by: NKeerthy <j-keerthy@ti.com>
Acked-by: NRob Herring <robh@kernel.org>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

Maxim Semiconductor MAX77620 supports alarm interrupts when
its die temperature crosses 120C and 140C. These threshold
temperatures are not configurable.

Add DT binding document to details out the DT property related
to MAX77620 thermal functionality.
Signed-off-by: NLaxman Dewangan <ldewangan@nvidia.com>
Acked-by: NRob Herring <robh@kernel.org>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

TSENS is Qualcomms' thermal temperature sensor device. It
supports reading temperatures from multiple thermal sensors
present on various QCOM SoCs.
Calibration data is generally read from a non-volatile memory
(eeprom) device.

Add a skeleton driver with all the necessary abstractions so
a variety of qcom device families which support TSENS can
add driver extensions.

Also add the required device tree bindings which can be used
to describe the TSENS device in DT.
Signed-off-by: NRajendra Nayak <rnayak@codeaurora.org>
Reviewed-by: NLina Iyer <lina.iyer@linaro.org>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

See the thermal code, the obvious typo from my editor.
Signed-off-by: NCaesar Wang <wxt@rock-chips.com>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>