Intel PowerClamp driver performs synchronized idle injection across
all online CPUs. The goal is to maintain a given package level C-state
ratio.

Compared to other throttling methods already exist in the kernel,
such as ACPI PAD (taking CPUs offline) and clock modulation, this is often
more efficient in terms of performance per watt.

Please refer to Documentation/thermal/intel_powerclamp.txt for more details.
Signed-off-by: NArjan van de Ven <arjan@linux.intel.com>
Signed-off-by: NJacob Pan <jacob.jun.pan@linux.intel.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

This patch changes the function thermal_generate_netlink_event
to receive a thermal zone device instead of a originator id.

This way, the messages will always be bound to a thermal zone.
Signed-off-by: NEduardo Valentin <eduardo.valentin@ti.com>
Reviewed-by: NDurgadoss R <durgadoss.r@intel.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

This patch supports exynos's emulation mode with newly created sysfs node.
Exynos 4x12 (4212, 4412) and 5 series provide emulation mode for thermal
management unit. Thermal emulation mode supports software debug for TMU's
operation. User can set temperature manually with software code and TMU
will read current temperature from user value not from sensor's value.
This patch includes also documentary placed under Documentation/thermal/.
Signed-off-by: NJonghwa Lee <jonghwa3.lee@samsung.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

This patch adds documentation for thermal_bind_params
and thermal_zone_params structures. Also, adds details
on EXPORT_SYMBOL APIs.
Signed-off-by: NDurgadoss R <durgadoss.r@intel.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

This movement is needed because the hwmon entries and corresponding sysfs
interface is a duplicate of utilities already provided by
driver/thermal/thermal_sys.c.  The goal is to place it in thermal folder
and add necessary functions to use the in-kernel thermal interfaces.
Signed-off-by: NAmit Daniel Kachhap <amit.kachhap@linaro.org>
Acked-by: NGuenter Roeck <guenter.roeck@ericsson.com>
Cc: SangWook Ju <sw.ju@samsung.com>
Cc: Durgadoss <durgadoss.r@intel.com>
Cc: Len Brown <lenb@kernel.org>
Cc: Jean Delvare <khali@linux-fr.org>
Cc: Kyungmin Park <kmpark@infradead.org>
Cc: Kukjin Kim <kgene.kim@samsung.com>
Signed-off-by: NAndrew Morton <akpm@linux-foundation.org>
Signed-off-by: NAmit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

This patchset introduces a new generic cooling device based on cpufreq
that can be used on non-ACPI platforms.  As a proof of concept, we have
drivers for the following platforms using this mechanism now:

 * Samsung Exynos (Exynos4 and Exynos5) in the current patchset.
 * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal)

There is a small change in cpufreq cooling registration APIs, so a minor
change is needed for Freescale platforms.

Brief Description:

1) The generic cooling devices code is placed inside driver/thermal/*
   as placing inside acpi folder will need un-necessary enabling of acpi
   code.  This code is architecture independent.

2) This patchset adds generic cpu cooling low level implementation
   through frequency clipping.  In future, other cpu related cooling
   devices may be added here.  An ACPI version of this already exists
   (drivers/acpi/processor_thermal.c) .But this will be useful for
   platforms like ARM using the generic thermal interface along with the
   generic cpu cooling devices.  The cooling device registration API's
   return cooling device pointers which can be easily binded with the
   thermal zone trip points.  The important APIs exposed are,

   a) struct thermal_cooling_device *cpufreq_cooling_register(
        struct cpumask *clip_cpus)
   b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev)

3) Samsung exynos platform thermal implementation is done using the
   generic cpu cooling APIs and the new trip type.  The temperature sensor
   driver present in the hwmon folder(registered as hwmon driver) is moved
   to thermal folder and registered as a thermal driver.

A simple data/control flow diagrams is shown below,

Core Linux thermal <----->  Exynos thermal interface <----- Temperature Sensor
          |                             |
         \|/                            |
  Cpufreq cooling device <---------------

TODO:
*Will send the DT enablement patches later after the driver is merged.

This patch:

Add support for generic cpu thermal cooling low level implementations
using frequency scaling up/down based on the registration parameters.
Different cpu related cooling devices can be registered by the user and
the binding of these cooling devices to the corresponding trip points can
be easily done as the registration APIs return the cooling device pointer.
The user of these APIs are responsible for passing clipping frequency .
The drivers can also register to recieve notification about any cooling
action called.

[akpm@linux-foundation.org: fix comment layout]
Signed-off-by: NAmit Daniel Kachhap <amit.kachhap@linaro.org>
Cc: Guenter Roeck <guenter.roeck@ericsson.com>
Cc: SangWook Ju <sw.ju@samsung.com>
Cc: Durgadoss <durgadoss.r@intel.com>
Cc: Len Brown <lenb@kernel.org>
Cc: Jean Delvare <khali@linux-fr.org>
Cc: Kyungmin Park <kmpark@infradead.org>
Cc: Kukjin Kim <kgene.kim@samsung.com>
Signed-off-by: NAndrew Morton <akpm@linux-foundation.org>
Signed-off-by: NAmit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

set upper and lower limits when binding
a thermal cooling device to a thermal zone device.
Signed-off-by: NZhang Rui <rui.zhang@intel.com>
Reviewed-by: NRafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: NEduardo Valentin <eduardo.valentin@ti.com>

With commit 6503e5df,
the value of /sys/class/thermal/thermal_zoneX/mode has been changed
from user/kernel to enabled/disabled.
Update the documentation so that users won't be confused.
Signed-off-by: NZhang Rui <rui.zhang@intel.com>
Signed-off-by: NLen Brown <len.brown@intel.com>

The Linux Thermal Framework does not support hysteresis
attributes. Most thermal sensors, today, have a
hysteresis value associated with trip points.

This patch adds hysteresis attributes on a per-trip-point
basis, to the Thermal Framework. These attributes are
optionally writable.
Signed-off-by: NDurgadoss R <durgadoss.r@intel.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>
Signed-off-by: NLen Brown <len.brown@intel.com>

Some of the thermal drivers using the Generic Thermal Framework
require (all/some) trip points to be writeable. This patch makes
the trip point temperatures writeable on a per-trip point basis,
and modifies the required function call in thermal.c. This patch
also updates the Documentation to reflect the new change.
Signed-off-by: NDurgadoss R <durgadoss.r@intel.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>
Signed-off-by: NLen Brown <len.brown@intel.com>

It doesn't seem right for the thermal subsystem to export a symbol
named generate_netlink_event. This function is thermal-specific and
its name should reflect that fact. Rename it to
thermal_generate_netlink_event.
Signed-off-by: NJean Delvare <khali@linux-fr.org>
Acked-by: NRafael J. Wysocki <rjw@sisk.pl>
Acked-by: NR.Durgadoss <durgadoss.r@intel.com>
Signed-off-by: NLen Brown <len.brown@intel.com>

This patch adds event notification support to the generic
thermal sysfs framework in the kernel. The notification is in the
form of a netlink event.
Signed-off-by: NR.Durgadoss <durgadoss.r@intel.com>
Signed-off-by: NLen Brown <len.brown@intel.com>

Values below 1000 milli-celsius don't make sense and can cause the
system to go into a thermal heart attack: the actual temperature
will always be lower and thus the system will be throttled down to
its lowest setting.

An additional problem is that values below 1000 will show as 0 in
/proc/acpi/thermal/TZx/trip_points:passive.

cat passive
0
echo -n 90 >passive
bash: echo: write error: Invalid argument
echo -n 90000 >passive
cat passive
90000
Signed-off-by: NFrans Pop <elendil@planet.nl>
Acked-by: NZhang Rui <rui.zhang@intel.com>
Signed-off-by: NAndrew Morton <akpm@linux-foundation.org>
Signed-off-by: NLen Brown <len.brown@intel.com>

Signed-off-by: NFrans Pop <elendil@planet.nl>
Acked-by: NZhang Rui <rui.zhang@intel.com>
Signed-off-by: NAndrew Morton <akpm@linux-foundation.org>
Signed-off-by: NLen Brown <len.brown@intel.com>

The document currently uses large indentations which make the text
too wide for easy readability. Also improve general consistency.
Signed-off-by: NFrans Pop <elendil@planet.nl>
Acked-by: NZhang Rui <rui.zhang@intel.com>
Signed-off-by: NAndrew Morton <akpm@linux-foundation.org>
Signed-off-by: NLen Brown <len.brown@intel.com>

Update the documentation for the thermal driver hwmon sys I/F.

Change the ACPI thermal zone type to be consistent with hwmon.
Signed-off-by: NZhang Rui <rui.zhang@intel.com>
Acked-by: NJean Delvare <khali@linux-fr.org>
Signed-off-by: NLen Brown <len.brown@intel.com>

From: Zhang Rui <rui.zhang@intel.com>

(reverting the previous sysfs patch also reverted a fix
 to the thermal units documentation, which is restored by this commit)

The generic thermal driver shows temperature in millidegree Celsius.
Signed-off-by: NZhang Rui <rui.zhang@intel.com>
Signed-off-by: NLen Brown <len.brown@intel.com>

This reverts commit 3152fb9f.

This broke libsensors.
Acked-by: NZhang Rui <rui.zhang@intel.com>
Acked-by: NJean Delvare <khali@linux-fr.org>
Signed-off-by: NLen Brown <len.brown@intel.com>

Signed-off-by: NZhang Rui <rui.zhang@intel.com>
Signed-off-by: NLen Brown <len.brown@intel.com>

Reviewed-by: NRandy Dunlap <randy.dunlap@oracle.com>
Signed-off-by: NLen Brown <len.brown@intel.com>

The Generic Thermal sysfs driver for thermal management.
Signed-off-by: NZhang Rui <rui.zhang@intel.com>
Signed-off-by: NThomas Sujith <sujith.thomas@intel.com>
Signed-off-by: NLen Brown <len.brown@intel.com>