Since the R8A77990 SoC uses DU{0,1}, the range from the base address to
the 0x4000 address is used.
This patch fixed it.

Fixes: 13ee2bfc ("arm64: dts: renesas: r8a77990: Add display output support")
Signed-off-by: NTakeshi Kihara <takeshi.kihara.df@renesas.com>
Signed-off-by: NYoshihiro Kaneko <ykaneko0929@gmail.com>
Reviewed-by: NSimon Horman <horms+renesas@verge.net.au>
Reviewed-by: NLaurent Pinchart <laurent.pinchart@ideasonboard.com>
Signed-off-by: NSimon Horman <horms+renesas@verge.net.au>

Add the new renesas,companion property to the LVDS0 node to point to the
companion LVDS encoder LVDS1.
Signed-off-by: NLaurent Pinchart <laurent.pinchart+renesas@ideasonboard.com>
Reviewed-by: NJacopo Mondi <jacopo+renesas@jmondi.org>
Tested-by: NJacopo Mondi <jacopo+renesas@jmondi.org>
Reviewed-by: NKieran Bingham <kieran.bingham+renesas@ideasonboard.com>
Signed-off-by: NSimon Horman <horms+renesas@verge.net.au>

Describe the dynamic power coefficient of A53 CPUs.

Based on work by Gaku Inami <gaku.inami.xw@bp.renesas.com> and others.
Signed-off-by: NSimon Horman <horms+renesas@verge.net.au>

Setup a thermal zone driven by SoC temperature sensor.
Create passive trip points and bind them to CPUFreq cooling
device that supports power extension.

In R-Car Gen3, IPA is supported for only one channel
Reason:
  Currently, IPA controls base on only CPU temperature.
  And only one thermal channel is assembled closest
  CPU cores is selected as target of IPA.
  If other channels are used, IPA controlling is not properly.

A single cooling device is described for all A53 CPUs as this
reflects that physically there is only one cooling device present.

This patch improves on an earlier version by:

* Omitting cooling-max-level and cooling-min-level properties which
  are no longer present in mainline as of v4.17
* Removing an unused trip-point0 node sub-property from the trips
  property.
* Defers adding dynamic-power-coefficient properties to a separate patch as
  these are properties of the CPU.

The long signed-off by chain below reflects many revisions, mainly
internal, that this patch has been through.
Signed-off-by: NDien Pham <dien.pham.ry@renesas.com>
Signed-off-by: NTakeshi Kihara <takeshi.kihara.df@renesas.com>
Signed-off-by: NYoshihiro Kaneko <ykaneko0929@gmail.com>
Signed-off-by: NSimon Horman <horms+renesas@verge.net.au>

Since the commit 233da2c9 ("dt-bindings: phy: rcar-gen3-phy-usb2:
Revise #phy-cells property") revised the #phy-cells, this patch follows
the updated document for R-Car Gen3 and RZ/A2 SoCs.
Signed-off-by: NYoshihiro Shimoda <yoshihiro.shimoda.uh@renesas.com>
Signed-off-by: NSimon Horman <horms+renesas@verge.net.au>

This patch adds CMT{0|1|2|3} device nodes for r8a77990 SoC.
Signed-off-by: NCao Van Dong <cv-dong@jinso.co.jp>
Signed-off-by: NSimon Horman <horms+renesas@verge.net.au>

The compatible value renesas,rcar-gen3-csi2 was used while prototyping
the R-Car CSI-2 driver but was removed before the driver was merged.
Remove the only occurrence of the compatible value which manage to make
it upstream.

Fixes: ec70407a ("arm64: dts: renesas: r8a77990: Add VIN and CSI-2 device nodes")
Signed-off-by: NNiklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Reviewed-by: NGeert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: NSimon Horman <horms+renesas@verge.net.au>

According to Documentation/process/license-rules.rst, SPDX license
identifiers in DTS files should use C++ style comments.

Fixes: f37a7767 ("arm64: dts: renesas: Add Renesas R8A77990 SoC support")
Fixes: 77049191 ("arm64: dts: renesas: Add Renesas Ebisu board support")
Signed-off-by: NGeert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: NSimon Horman <horms+renesas@verge.net.au>

According to the R-Car Gen3 Hardware Manual Errata for Rev 1.50 of Feb
12, 2019, the DMA channels for SCIF5 are corrected from 16..47 to 0..15
on R-Car E3.
Signed-off-by: NTakeshi Kihara <takeshi.kihara.df@renesas.com>
Fixes: a5ebe5e4 ("arm64: dts: renesas: r8a77990: Add SCIF-{0,1,3,4,5} device nodes")
Signed-off-by: NGeert Uytterhoeven <geert+renesas@glider.be>
Reviewed-by: NFabrizio Castro <fabrizio.castro@bp.renesas.com>
Signed-off-by: NSimon Horman <horms+renesas@verge.net.au>

This patch define OOP tables for all CPUs.
This allows CPUFreq to function.
Signed-off-by: NTakeshi Kihara <takeshi.kihara.df@renesas.com>
Signed-off-by: NYoshihiro Kaneko <ykaneko0929@gmail.com>
Tested-by: NSimon Horman <horms+renesas@verge.net.au>
Signed-off-by: NSimon Horman <horms+renesas@verge.net.au>

The 'arm,armv8' compatible string is only for software models. It adds
little value otherwise and is inconsistently used as a fallback on some
platforms. Remove it from those platforms.

This fixes warnings generated by the DT schema.
Reported-by: NMichal Simek <michal.simek@xilinx.com>
Cc: Mark Rutland <mark.rutland@arm.com>
Cc: Will Deacon <will.deacon@arm.com>
Acked-by: NAntoine Tenart <antoine.tenart@bootlin.com>
Acked-by: NNishanth Menon <nm@ti.com>
Acked-by: NMaxime Ripard <maxime.ripard@bootlin.com>
Acked-by: NManivannan Sadhasivam <manivannan.sadhasivam@linaro.org>
Acked-by: NChanho Min <chanho.min@lge.com>
Acked-by: NKrzysztof Kozlowski <krzk@kernel.org>
Acked-by: NMasahiro Yamada <yamada.masahiro@socionext.com>
Acked-by: NGregory CLEMENT <gregory.clement@bootlin.com>
Acked-by: NThierry Reding <treding@nvidia.com>
Acked-by: NHeiko Stuebner <heiko@sntech.de>
Acked-by: NSimon Horman <horms+renesas@verge.net.au>
Acked-by: NTero Kristo <t-kristo@ti.com>
Acked-by: NWei Xu <xuwei5@hisilicon.com>
Acked-by: NLiviu Dudau <liviu.dudau@arm.com>
Acked-by: NMatthias Brugger <matthias.bgg@gmail.com>
Acked-by: NMichal Simek <michal.simek@xilinx.com>
Acked-by: NScott Branden <scott.branden@broadcom.com>
Acked-by: NKevin Hilman <khilman@baylibre.com>
Acked-by: NChunyan Zhang <zhang.lyra@gmail.com>
Acked-by: NRobert Richter <rrichter@cavium.com>
Acked-by: NJisheng Zhang <Jisheng.Zhang@synaptics.com>
Acked-by: NDinh Nguyen <dinguyen@kernel.org>
Signed-off-by: NRob Herring <robh@kernel.org>
Signed-off-by: NArnd Bergmann <arnd@arndb.de>

SCIF2 on R-Car E3 can be used with both DMAC1 and DMAC2.
Signed-off-by: NGeert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: NSimon Horman <horms+renesas@verge.net.au>

Move the i2c nodes so that sub-nodes of the soc node are sorted by bus
address.
Signed-off-by: NGeert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: NSimon Horman <horms+renesas@verge.net.au>

Move the pciec0 node so that sub-nodes of the soc node are
sorted by bus address.

This change has no run-time affect.
Signed-off-by: NSimon Horman <horms+renesas@verge.net.au>
Reviewed-by: NGeert Uytterhoeven <geert+renesas@glider.be>

This patch adds the thermal device node and the thermal-zone for
the R8A77990 SoC.
Signed-off-by: NYoshihiro Kaneko <ykaneko0929@gmail.com>
Tested-by: NSimon Horman <horms+renesas@verge.net.au>
Signed-off-by: NSimon Horman <horms+renesas@verge.net.au>

This patch enables I2C DMA.

NOTE: I2C7 DMA is not supported by R-Car Gen3 Hardware User's Manual
Rev.0.80E.
Signed-off-by: NTakeshi Kihara <takeshi.kihara.df@renesas.com>
Signed-off-by: NYoshihiro Kaneko <ykaneko0929@gmail.com>
Tested-by: NSimon Horman <horms+renesas@verge.net.au>
Reviewed-by: NGeert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: NSimon Horman <horms+renesas@verge.net.au>

This patch adds I2C-DVFS device node for the R8A77990 SoC.

v2
* Drop aliases update as in upstream it is not required to configure the
  BD9571 PMIC for DDR backup, nor is the use of i2c are aliases desired.
* Do not describe the device as compatible with "renesas,rcar-gen3-iic" or
  "renesas,rmobile-iic" fallback compat strings. The absence of automatic
  transmission registers leads us to declare the r8a77990 IIC controller as
  incompatible.

v2.1
* Reduced register range to reflect documentation
Signed-off-by: NTakeshi Kihara <takeshi.kihara.df@renesas.com>
Signed-off-by: NYoshihiro Kaneko <ykaneko0929@gmail.com>
Signed-off-by: NSimon Horman <horms+renesas@verge.net.au>
Reviewed-by: NGeert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: NSimon Horman <horms+renesas@verge.net.au>

This patch adds CAN0,1 and CANFD device nodes for the r8a77990 SoC
and enables CANFD connected to CN10 on the E3 Ebisu board using the
R8A77990 SoC.
Signed-off-by: NMarek Vasut <marek.vasut+renesas@gmail.com>
Acked-by: NWolfram Sang <wsa+renesas@sang-engineering.com>
Signed-off-by: NSimon Horman <horms+renesas@verge.net.au>

This patch adds PCI express channel 0 device node to the R8A77990 SoC
and enables PCIEC0 PCI express controller on the Ebisu board.
Signed-off-by: NTakeshi Kihara <takeshi.kihara.df@renesas.com>
Signed-off-by: NMarek Vasut <marek.vasut+renesas@gmail.com>
Signed-off-by: NSimon Horman <horms+renesas@verge.net.au>

The VIN driver bindings dictates fixed numbering for VIN endpoints connected
to CSI-2 endpoints, even when a single endpoint exists.

Without proper endpoint numbering the VIN driver fails to probe.

Based on a patch in BSP from Koji Matsuoka <koji.matsuoka.xm@renesas.com>

Fixes: ec70407a ("arm64: dts: renesas: r8a77990: Add VIN and CSI-2 device nodes")
Signed-off-by: NKoji Matsuoka <koji.matsuoka.xm@renesas.com>
Signed-off-by: NTakeshi Kihara <takeshi.kihara.df@renesas.com>
Signed-off-by: NJacopo Mondi <jacopo+renesas@jmondi.org>
Reviewed-by: NLaurent Pinchart <laurent.pinchart@ideasonboard.com>
Signed-off-by: NSimon Horman <horms+renesas@verge.net.au>

This patch adds SDHI{0,1,3} device nodes for the r8a77990 SoC
and enables SD card slot connected to SDHI0, micro SD card slot
connected to SDHI1 and eMMC connected to SDHI3 on the Ebisu board
using the R8A77990 SoC.
Signed-off-by: NTakeshi Kihara <takeshi.kihara.df@renesas.com>
Signed-off-by: NMarek Vasut <marek.vasut+renesas@gmail.com>
Cc: Geert Uytterhoeven <geert+renesas@glider.be>
Cc: Simon Horman <horms+renesas@verge.net.au>
Cc: Wolfram Sang <wsa@the-dreams.de>
Cc: Yoshihiro Shimoda <yoshihiro.shimoda.uh@renesas.com>
Cc: linux-renesas-soc@vger.kernel.org
Cc: linux-arm-kernel@lists.infradead.org
Acked-by: NWolfram Sang <wsa+renesas@sang-engineering.com>
Signed-off-by: NSimon Horman <horms+renesas@verge.net.au>

This patch adds the device nodes for all HSCIF serial ports to
the R8A77990 SoC.
Signed-off-by: NTakeshi Kihara <takeshi.kihara.df@renesas.com>
Signed-off-by: NYoshihiro Kaneko <ykaneko0929@gmail.com>
Signed-off-by: NSimon Horman <horms+renesas@verge.net.au>

This patch adds Audio-DMAC0 device node and Sound device node
for the R8A77990 SoC.

Based on work by Takeshi Kihara and Hai Nguyen Pham.
Signed-off-by: NYoshihiro Kaneko <ykaneko0929@gmail.com>
[simon: dropped include update, which is already present]
Signed-off-by: NSimon Horman <horms+renesas@verge.net.au>

This patch adds/enables USB2.0 peripheral for R-Car [DE]3 boards.

R-Car E3 Ebisu board connects the ID pin to the SoC, so this adds
a group "usb0_id" into usb0_pins node. Also, to use SW15 pin 3 side,
this patch adds vbus0_usb2 node on r8a77990-ebisu.dts.

R-Car D3 Draak board doesn't connect the ID pin, so this adds
"renesas,no-otg-pins" property into usb2_phy0 node.
Signed-off-by: NYoshihiro Shimoda <yoshihiro.shimoda.uh@renesas.com>
Signed-off-by: NSimon Horman <horms+renesas@verge.net.au>

Hook up the R-Car E3 AVB device to IPMMU-DS0 16 as described in
the data sheet.
Signed-off-by: NMagnus Damm <damm@opensource.se>
Tested-by: NSimon Horman <horms+renesas@verge.net.au>
Signed-off-by: NSimon Horman <horms+renesas@verge.net.au>

This patch adds/enables USB3.0 peripheral device node for r8a77990
ebisu board.
Signed-off-by: NYoshihiro Shimoda <yoshihiro.shimoda.uh@renesas.com>
Signed-off-by: NSimon Horman <horms+renesas@verge.net.au>

This patch adds the device nodes for SCIF-{0,1,3,4,5} serial ports to
the R8A77990 SoC.
Signed-off-by: NTakeshi Kihara <takeshi.kihara.df@renesas.com>
Signed-off-by: NYoshihiro Kaneko <ykaneko0929@gmail.com>
Signed-off-by: NSimon Horman <horms+renesas@verge.net.au>

This patch adds DMA properties to the MSIOF device nodes of R8A77990 SoC.
Signed-off-by: NYoshihiro Kaneko <ykaneko0929@gmail.com>
Reviewed-by: NGeert Uytterhoeven <geert+renesas@glider.be>
Tested-by: NGeert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: NSimon Horman <horms+renesas@verge.net.au>

This patch adds a device node for the Interrupt Controller for External
Devices (INTC-EX) on R-Car E3, which serves external IRQ pins IRQ[0-5].
Signed-off-by: NTakeshi Kihara <takeshi.kihara.df@renesas.com>
Signed-off-by: NGeert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: NSimon Horman <horms+renesas@verge.net.au>

The R8A77990 (E3) platform has one RGB output and two LVDS outputs
connected to the DU. Add the DT nodes for the DU, LVDS encoders and
supporting VSP and FCP.
Signed-off-by: NLaurent Pinchart <laurent.pinchart+renesas@ideasonboard.com>
Tested-by: NJacopo Mondi <jacopo+renesas@jmondi.org>
Signed-off-by: NSimon Horman <horms+renesas@verge.net.au>

R-Car Gen3 SoCs need to enable/deassert clocks/resets of both usb 2.0
host (included phy) and peripheral. Otherwise, other side device
cannot work correctly. So, this patch revises properties of clocks
and resets. After that, each device driver can enable/deassert
clocks/resets by its self.

Notes:
 - To work the renesas_usbhs driver correctly when host side drivers
   are disabled and the renesas_usbhs driver doesn't have multiple
   clock management, this patch doesn't change the order of the clocks
   property in each hsusb node.
 - This patch doesn't have any side-effects even if the renesas_usbhs
   driver doesn't have reset_control and multiple clock management.
Signed-off-by: NYoshihiro Shimoda <yoshihiro.shimoda.uh@renesas.com>
Signed-off-by: NSimon Horman <horms+renesas@verge.net.au>

For R-Car E3 hook up SYS-DMAC0, SYS-DMAC1 and SYS-DMAC2 to
IPMMU-DS0 and IPMMU-DS1 in same way as for R-Car H3.
This follows the R-Car Gen3 Rev.1.00 (April 2018) datasheet.
Signed-off-by: NMagnus Damm <damm@opensource.se>
Signed-off-by: NSimon Horman <horms+renesas@verge.net.au>

This patch adds SYS-DMAC{0,1,2} device nodes for the R8A77990 SoC.
Signed-off-by: NTakeshi Kihara <takeshi.kihara.df@renesas.com>
Signed-off-by: NYoshihiro Kaneko <ykaneko0929@gmail.com>
Reviewed-by: NGeert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: NSimon Horman <horms+renesas@verge.net.au>

Add device nodes for I2C ch[0-7] to R-Car E3 R8A77990 device tree.
Signed-off-by: NTakeshi Kihara <takeshi.kihara.df@renesas.com>
Signed-off-by: NJacopo Mondi <jacopo+renesas@jmondi.org>
Reviewed-by: NGeert Uytterhoeven <geert+renesas@glider.be>
Tested-by: NGeert Uytterhoeven <geert+renesas@glider.be>
Reviewed-by: NLaurent Pinchart <laurent.pinchart@ideasonboard.com>
Tested-by: NLaurent Pinchart <laurent.pinchart@ideasonboard.com>
Signed-off-by: NSimon Horman <horms+renesas@verge.net.au>

Add device nodes for VIN4, VIN5 and CSI40 to R-Car E3 R8A77990 device tree.
Signed-off-by: NKoji Matsuoka <koji.matsuoka.xm@renesas.com>
Signed-off-by: NTakeshi Kihara <takeshi.kihara.df@renesas.com>
Signed-off-by: NJacopo Mondi <jacopo+renesas@jmondi.org>
Reviewed-by: NLaurent Pinchart <laurent.pinchart@ideasonboard.com>
Tested-by: NLaurent Pinchart <laurent.pinchart@ideasonboard.com>
[simon: sorted nodes by bus address, then IP block]
Signed-off-by: NSimon Horman <horms+renesas@verge.net.au>

Add the device nodes for all MSIOF SPI controllers, incl. clocks, power
domains, and resets properties.
Signed-off-by: NGeert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: NSimon Horman <horms+renesas@verge.net.au>

Add the device node for the external SCIF_CLK, and describe the clock
inputs for the Baud Rate Generator for External Clock (BRG) for SCIF2,
which can increase serial clock accuracy.

The presence of the SCIF_CLK crystal and its clock frequency depend on
the actual board.
Signed-off-by: NTakeshi Kihara <takeshi.kihara.df@renesas.com>
[geert: Enhance patch description]
Signed-off-by: NGeert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: NSimon Horman <horms+renesas@verge.net.au>

Use the SoC-specific CPG/MSSR include file to allow future use of
R8A77990_CLK_* symbols.
Replace the hardcoded power domain indices by R8A77990_PD_* symbols.
Signed-off-by: NGeert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: NSimon Horman <horms+renesas@verge.net.au>

This patch adds PWM device nodes and enables PWM3 and PWM5 for
R-Car E3 Ebisu board. These devices are used for backlight control.
Signed-off-by: NYoshihiro Shimoda <yoshihiro.shimoda.uh@renesas.com>
Reviewed-by: NGeert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: NSimon Horman <horms+renesas@verge.net.au>

Browsing the DTS for all the R-Car SoCs with similar part numbers
makes my head hurt, so to improve the user friendliness of the
DTS code base include R-Car product name in each DTSI file.

Product names are derived from
Documentation/devicetree/bindings/arm/shmobile.txt
Signed-off-by: NMagnus Damm <damm+renesas@opensource.se>
Signed-off-by: NSimon Horman <horms+renesas@verge.net.au>