Silences the following sparse warning:

drivers/thermal/cpu_cooling.c:67:31: warning:
symbol 'notify_device' was not declared. Should it be static?
Signed-off-by: NSachin Kamat <sachin.kamat@linaro.org>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

Problem of using this list is that the cpufreq_get_max_state callback will be
called when register cooling device by thermal_cooling_device_register, but
this list isn't ready at this moment. What's more, there is no need to maintain
such a list, we can get cpufreq_cooling_device instance by the private
thermal_cooling_device.devdata.
Signed-off-by: Nhongbo.zhang <hongbo.zhang@linaro.com>
Reviewed-by: NFrancesco Lavra <francescolavra.fl@gmail.com>
Reviewed-by: NAmit Daniel Kachhap <amit.kachhap@linaro.org>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

In the while loop for counting cpu frequencies, if table[i].frequency equals
CPUFREQ_ENTRY_INVALID, index i won't be increased, so this leads to an endless
loop, what's more the index i cannot be referred as cpu frequencies number if
there is CPUFREQ_ENTRY_INVALID case.
Signed-off-by: Nhongbo.zhang <hongbo.zhang@linaro.com>
Reviewed-by: NViresh Kumar <viresh.kumar@linaro.org>
Reviewed-by: NAmit Daniel Kachhap <amit.kachhap@linaro.org>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

The curly bracket should be aligned with corresponding if else statements.
Signed-off-by: Nhongbo.zhang <hongbo.zhang@linaro.com>
Reviewed-by: NViresh Kumar <viresh.kumar@linaro.org>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

devm_kfree and devm_iounmap should not have to be explicitly used
Signed-off-by: NKuninori Morimoto <kuninori.morimoto.gx@renesas.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

Fixes the following sparse warnings:
drivers/thermal/user_space.c:38:5: warning:
symbol 'notify_user_space' was not declared. Should it be static?
drivers/thermal/user_space.c:46:25: warning:
symbol 'thermal_gov_user_space' was not declared. Should it be static?
Signed-off-by: NSachin Kamat <sachin.kamat@linaro.org>
Acked-by: NDurgadoss R <durgadoss.r@intel.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

Fixes the following sparse warnings:
drivers/thermal/fair_share.c:80:5: warning:
symbol 'fair_share_throttle' was not declared. Should it be static?
drivers/thermal/fair_share.c:111:25: warning:
symbol 'thermal_gov_fair_share' was not declared. Should it be static?
Signed-off-by: NSachin Kamat <sachin.kamat@linaro.org>
Acked-by: NDurgadoss R <durgadoss.r@intel.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

Fixes the following sparse warnings:
drivers/thermal/step_wise.c:153:5: warning:
symbol 'step_wise_throttle' was not declared. Should it be static?
drivers/thermal/step_wise.c:172:25: warning:
symbol 'thermal_gov_step_wise' was not declared. Should it be static?
Signed-off-by: NSachin Kamat <sachin.kamat@linaro.org>
Acked-by: NDurgadoss R <durgadoss.r@intel.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

This patch fixes the following mutex and NULL pointer
problems in thermal_sys.c:

 * mutex_unlock fix in update_temperature function
 * mutex_unlock fix in bind_cdev function
 * Correct early return to continue in bind_cdev function
 * NULL check fix in bind_cdev function
 * NULL check fix in bind_tz function
Reported-by: NDan Carpenter <dan.carpenter@oracle.com>
Reported-by: NSedat Dilek <sedat.dilek@gmail.com>
Reported-by: NHugh Dickins <hughd@google.com>
Signed-off-by: NDurgadoss R <durgadoss.r@intel.com>
Signed-off-by: NSedat Dilek <sedat.dilek@gmail.com>
Signed-off-by: NHugh Dickins <hughd@google.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

This patch provides option to choose the default thermal
governor. If no option is provided, the step_wise
governor is selected by default.
Signed-off-by: NDurgadoss R <durgadoss.r@intel.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

This patch adds a notification API which the sensor drivers'
can use to notify the framework. The framework then takes
care of the throttling according to the configured policy.
Signed-off-by: NDurgadoss R <durgadoss.r@intel.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

This patch removes the throttling logic out of
thermal_sys.c; also refactors the code into smaller
functions so that are easy to read/maintain.
 * Seperates the handling of critical and non-critical trips
 * Re-arranges the set_polling and device_check methods, so
   that all related functions are arranged in one place.
 * Removes the 'do_update' and 'trip_update' method, as part
   of moving the throttling logic out of thermal_sys.c
Signed-off-by: NDurgadoss R <durgadoss.r@intel.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

This patch registers a governor which will let the
user land manage the platform thermals. Whenever a
trip happens, this governor just notifies the user
space using kobj_uevent().
Signed-off-by: NDurgadoss R <durgadoss.r@intel.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

This patch adds a simple step_wise governor to the
generic thermal layer. This algorithm throttles the
cooling devices in a linear fashion. If the 'trend'
is heating, it throttles by one step. And if the
thermal trend is cooling it de-throttles by one step.

This actually moves the throttling logic from thermal_sys.c
and puts inside step_wise.c, without any change.
Signed-off-by: NDurgadoss R <durgadoss.r@intel.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

This patch introduces a simple 'weight' based
governor named fair_share governor. Whenever the
thermal framework gets notified of the trip point
violation, this governor (if configured), throttles
the cooling devices associated with a thermal zone.

This mapping between a thermal zone and a cooling device
and the effectiveness of cooling are provided in the
platform layer.
Signed-off-by: NDurgadoss R <durgadoss.r@intel.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

This patch makes the thermal_cdev_update function as a
global one, so that other files can use it. This function
serves as a single arbitrator to set the state of a cooling
device.
Signed-off-by: NDurgadoss R <durgadoss.r@intel.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

This patch updates the binding logic in thermal_sys.c
It uses the platform layer data to bind a thermal zone
to a cdev for a particular trip point.

 * If we do not have platform data and do not have
   .bind defined, do not bind.
 * If we do not have platform data but .bind is
   defined, then use tz->ops->bind.
 * If we have platform data, use it to create binding.

The same logic sequence is followed for unbind also.
Signed-off-by: NDurgadoss R <durgadoss.r@intel.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

This patch adds a policy sysfs attribute to a thermal zone.
This attribute denotes the throttling governor used for the
zone. This is a RW attribute.
Signed-off-by: NDurgadoss R <durgadoss.r@intel.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

This patch creates a structure to hold platform
thermal governor information, and provides APIs
for individual thermal governors to register/unregister
with the Thermal framework.
Signed-off-by: NDurgadoss R <durgadoss.r@intel.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

This patch adds the thermal zone parameter as an argument to
the tzd_register() function call; and updates other drivers
using this function.
Signed-off-by: NDurgadoss R <durgadoss.r@intel.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

This patch adds the following API's to thermal_sys.c, that
can be used by other Thermal drivers.
 * get_tz_trend: obtain the trend of the given thermal zone
 * get_thermal_instance: obtain the instance corresponding
   to the given tz, cdev and the trip point.
Signed-off-by: NDurgadoss R <durgadoss.r@intel.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

This patch creates a thermal_core.h file which can contain
all defines used by the core thermal framework files. For
now, move the thermal_instance structure to thermal_core.h
This structure is used by files under drivers/thermal/.
Signed-off-by: NDurgadoss R <durgadoss.r@intel.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

Signed-off-by: NJonghwan Choi <jhbird.choi@samsung.com>
Reviewed-by: NAmit Daniel Kachhap <amit.kachhap@linaro.org>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

following were the errors reported

drivers/thermal/rcar_thermal.c: In function ‘rcar_thermal_probe’:
drivers/thermal/rcar_thermal.c:214:10: warning: passing argument 3 of ‘thermal_zone_device_register’ makes integer from pointer without a cast [enabled by default]
include/linux/thermal.h:166:29: note: expected ‘int’ but argument is of type ‘struct rcar_thermal_priv *’
drivers/thermal/rcar_thermal.c:214:10: error: too few arguments to function ‘thermal_zone_device_register’
include/linux/thermal.h:166:29: note: declared here
make[1]: *** [drivers/thermal/rcar_thermal.o] Error 1
make: *** [drivers/thermal/rcar_thermal.o] Error 2

with gcc version 4.6.3 (Ubuntu/Linaro 4.6.3-1ubuntu5)
Signed-off-by: NDevendra Naga <develkernel412222@gmail.com>
Signed-off-by: NKuninori Morimoto <kuninori.morimoto.gx@renesas.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

Commit 02361418 ("thermal: add generic cpufreq cooling
implementation") requires cpufreq_frequency_get_table(), but that
function is only defined for CONFIG_CPU_FREQ_TABLE resulting in the
following build error:

  drivers/built-in.o: In function `cpufreq_get_max_state':
  drivers/thermal/cpu_cooling.c:259: undefined reference to `cpufreq_frequency_get_table'
  drivers/built-in.o: In function `get_cpu_frequency':
  drivers/thermal/cpu_cooling.c:129: undefined reference to `cpufreq_frequency_get_table'

Fix it by selecting CONFIG_CPU_FREQ_TABLE for such a configuration.

It turns out CONFIG_EXYNOS_THERMAL also needs CONFIG_CPU_FREQ_TABLE, so
select it there as well.
Signed-off-by: NDavid Rientjes <rientjes@google.com>
Signed-off-by: NLinus Torvalds <torvalds@linux-foundation.org>

To avoid name conflicts:

  drivers/video/riva/fbdev.c:281:9: sparse: preprocessor token MAX_LEVEL redefined

While at it, also make the other names more consistent and add
parentheses.

[akpm@linux-foundation.org: repair fallout]
[sfr@canb.auug.org.au: IB/mlx4: fix for MAX_ID_MASK to MAX_IDR_MASK name change]
Signed-off-by: NFengguang Wu <fengguang.wu@intel.com>
Cc: Bernd Petrovitsch <bernd@petrovitsch.priv.at>
Cc: walter harms <wharms@bfs.de>
Cc: Glauber Costa <glommer@parallels.com>
Signed-off-by: NStephen Rothwell <sfr@canb.auug.org.au>
Cc: Roland Dreier <roland@purestorage.com>
Signed-off-by: NAndrew Morton <akpm@linux-foundation.org>
Signed-off-by: NLinus Torvalds <torvalds@linux-foundation.org>

exynos_unregister_thermal() is functional only when 'th_zone' is not
NULL (ensured by the NULL checks). However, in the event it is NULL, it
gets dereferenced in the for loop. This patch fixes this issue.
Signed-off-by: NSachin Kamat <sachin.kamat@linaro.org>

This patch fixes small bug on cpu_cooling. CPU cooling device has own
id generated with idr mathod. However in the previous version, it swapped
to all same id at last stage of probing as 0. This makes id's collision and
also occures error when it releases that id.
Signed-off-by: NJonghwa Lee <jonghwa3.lee@samsung.com>

devm_* functions are used to replace kzalloc, request_mem_region, ioremap
and request_irq functions in probe call. With the usage of devm_* functions
explicit freeing and unmapping is not required.
Signed-off-by: NSachin Kamat <sachin.kamat@linaro.org>
Signed-off-by: NSachin Kamat <sachin.kamat@samsung.com>
Signed-off-by: NAmit Daniel Kachhap <amit.kachhap@linaro.org>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

Add necessary default platform data support needed for TMU driver.  The
supplied dt/non-dt values are tested for origen exynos4210 and smdk exynos5250
platforms and only compile tested for exynos4412.
Signed-off-by: NAmit Daniel Kachhap <amit.kachhap@linaro.org>
Acked-by: NGuenter Roeck <guenter.roeck@ericsson.com>
Cc: SangWook Ju <sw.ju@samsung.com>
Cc: Durgadoss <durgadoss.r@intel.com>
Cc: Len Brown <lenb@kernel.org>
Cc: Jean Delvare <khali@linux-fr.org>
Cc: jonghwa lee <jonghwa3.lee@samsung.com>
Cc: Kyungmin Park <kmpark@infradead.org>
Cc: Kukjin Kim <kgene.kim@samsung.com>
Signed-off-by: NAndrew Morton <akpm@linux-foundation.org>
Signed-off-by: NAmit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

This code added creates a link between temperature sensors, linux thermal
framework and cooling devices for samsung exynos platform.  This layer
monitors the temperature from the sensor and informs the generic thermal
layer to take the necessary cooling action.

[akpm@linux-foundation.org: fix comment layout]
Signed-off-by: NAmit Daniel Kachhap <amit.kachhap@linaro.org>
Acked-by: NGuenter Roeck <guenter.roeck@ericsson.com>
Cc: SangWook Ju <sw.ju@samsung.com>
Cc: Durgadoss <durgadoss.r@intel.com>
Cc: Len Brown <lenb@kernel.org>
Cc: Jean Delvare <khali@linux-fr.org>
Cc: Kyungmin Park <kmpark@infradead.org>
Cc: Kukjin Kim <kgene.kim@samsung.com>
Signed-off-by: NAndrew Morton <akpm@linux-foundation.org>
Signed-off-by: NAmit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

Insert exynos5 TMU sensor changes into the thermal driver.  Some exynos4
changes are made generic for exynos series.

[akpm@linux-foundation.org: fix comment layout]
Signed-off-by: NSangWook Ju <sw.ju@samsung.com>
Signed-off-by: NAmit Daniel Kachhap <amit.kachhap@linaro.org>
Acked-by: NGuenter Roeck <guenter.roeck@ericsson.com>
Cc: Durgadoss <durgadoss.r@intel.com>
Cc: Len Brown <lenb@kernel.org>
Cc: Jean Delvare <khali@linux-fr.org>
Cc: Kyungmin Park <kmpark@infradead.org>
Cc: Kukjin Kim <kgene.kim@samsung.com>
Signed-off-by: NAndrew Morton <akpm@linux-foundation.org>
Signed-off-by: NAmit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

This movement is needed because the hwmon entries and corresponding sysfs
interface is a duplicate of utilities already provided by
driver/thermal/thermal_sys.c.  The goal is to place it in thermal folder
and add necessary functions to use the in-kernel thermal interfaces.
Signed-off-by: NAmit Daniel Kachhap <amit.kachhap@linaro.org>
Acked-by: NGuenter Roeck <guenter.roeck@ericsson.com>
Cc: SangWook Ju <sw.ju@samsung.com>
Cc: Durgadoss <durgadoss.r@intel.com>
Cc: Len Brown <lenb@kernel.org>
Cc: Jean Delvare <khali@linux-fr.org>
Cc: Kyungmin Park <kmpark@infradead.org>
Cc: Kukjin Kim <kgene.kim@samsung.com>
Signed-off-by: NAndrew Morton <akpm@linux-foundation.org>
Signed-off-by: NAmit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

This patchset introduces a new generic cooling device based on cpufreq
that can be used on non-ACPI platforms.  As a proof of concept, we have
drivers for the following platforms using this mechanism now:

 * Samsung Exynos (Exynos4 and Exynos5) in the current patchset.
 * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal)

There is a small change in cpufreq cooling registration APIs, so a minor
change is needed for Freescale platforms.

Brief Description:

1) The generic cooling devices code is placed inside driver/thermal/*
   as placing inside acpi folder will need un-necessary enabling of acpi
   code.  This code is architecture independent.

2) This patchset adds generic cpu cooling low level implementation
   through frequency clipping.  In future, other cpu related cooling
   devices may be added here.  An ACPI version of this already exists
   (drivers/acpi/processor_thermal.c) .But this will be useful for
   platforms like ARM using the generic thermal interface along with the
   generic cpu cooling devices.  The cooling device registration API's
   return cooling device pointers which can be easily binded with the
   thermal zone trip points.  The important APIs exposed are,

   a) struct thermal_cooling_device *cpufreq_cooling_register(
        struct cpumask *clip_cpus)
   b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev)

3) Samsung exynos platform thermal implementation is done using the
   generic cpu cooling APIs and the new trip type.  The temperature sensor
   driver present in the hwmon folder(registered as hwmon driver) is moved
   to thermal folder and registered as a thermal driver.

A simple data/control flow diagrams is shown below,

Core Linux thermal <----->  Exynos thermal interface <----- Temperature Sensor
          |                             |
         \|/                            |
  Cpufreq cooling device <---------------

TODO:
*Will send the DT enablement patches later after the driver is merged.

This patch:

Add support for generic cpu thermal cooling low level implementations
using frequency scaling up/down based on the registration parameters.
Different cpu related cooling devices can be registered by the user and
the binding of these cooling devices to the corresponding trip points can
be easily done as the registration APIs return the cooling device pointer.
The user of these APIs are responsible for passing clipping frequency .
The drivers can also register to recieve notification about any cooling
action called.

[akpm@linux-foundation.org: fix comment layout]
Signed-off-by: NAmit Daniel Kachhap <amit.kachhap@linaro.org>
Cc: Guenter Roeck <guenter.roeck@ericsson.com>
Cc: SangWook Ju <sw.ju@samsung.com>
Cc: Durgadoss <durgadoss.r@intel.com>
Cc: Len Brown <lenb@kernel.org>
Cc: Jean Delvare <khali@linux-fr.org>
Cc: Kyungmin Park <kmpark@infradead.org>
Cc: Kukjin Kim <kgene.kim@samsung.com>
Signed-off-by: NAndrew Morton <akpm@linux-foundation.org>
Signed-off-by: NAmit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

The type parameter in thermal_zone_device_register and
thermal_cooling_device_register can be NULL, indicating that no sysfs attribute
for the type should be created. Only call strlen() and strcpy() on type if it is
not NULL.

This patch addresses Coverity #102180 and #102182: Dereference before null check
Signed-off-by: NGuenter Roeck <linux@roeck-us.net>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

This patch add basic Renesas R-Car thermal sensor support.
It was tested on R-Car H1 Marzen board.
Signed-off-by: NKuninori Morimoto <kuninori.morimoto.gx@renesas.com>
Cc: Len Brown <len.brown@intel.com>
Cc: Joe Perches <joe@perches.com>
Cc: Jean Delvare <khali@linux-fr.org>
Cc: Guenter Roeck <guenter.roeck@ericsson.com>
Cc: Magnus Damm <magnus.damm@gmail.com>
Signed-off-by: NAndrew Morton <akpm@linux-foundation.org>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

temp_crit.name and temp_input.name have a length of 16 bytes.  Using
THERMAL_NAME_LENGTH (20) as length parameter for snprintf() may result in
out-of-bounds memory accesses.  Replace it with sizeof().

Addresses Coverity #115679
Signed-off-by: NGuenter Roeck <linux@roeck-us.net>
Cc: Len Brown <lenb@kernel.org>
Cc: "Brown, Len" <len.brown@intel.com>
Signed-off-by: NAndrew Morton <akpm@linux-foundation.org>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

we need to go over all the thermal_instance list of a cooling device
to decide which cooling state to put the cooling device to.

But at this time, as a cooling device may be referenced in multiple
thermal zones, we need to lock the list first in case
another thermal zone is updating this cooling device.
Signed-off-by: NZhang Rui <rui.zhang@intel.com>
Reviewed-by: NRafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: NEduardo Valentin <eduardo.valentin@ti.com>

Remove thermal_zone_device_passive(). And use
thermal_zone_trip_update() and thermal_zone_do_update()
for both active and passive cooling.
Signed-off-by: NZhang Rui <rui.zhang@intel.com>
Reviewed-by: NRafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: NEduardo Valentin <eduardo.valentin@ti.com>

This fixes the problem that a cooling device may be referenced by
by multiple trip points in multiple thermal zones.

With this patch, we have two stages for updating a thermal zone,
1. check if a thermal_instance needs to be updated or not
2. update the cooling device, based on the target cooling state
   of all its instances.

Note that, currently, the cooling device is set to the deepest
cooling state required.
Signed-off-by: NZhang Rui <rui.zhang@intel.com>
Reviewed-by: NRafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: NEduardo Valentin <eduardo.valentin@ti.com>