1. 25 3月, 2011 1 次提交
    • G
      mmc: tmio: split core functionality, DMA and MFD glue · b6147490
      Guennadi Liakhovetski 提交于
      TMIO MMC chips contain an SD / SDIO IP core from Panasonic, similar to
      the one, used in MN5774 and other MN57xx controllers. These IP cores are
      included in many multifunction devices, in sh-mobile chips from Renesas,
      in the latter case they can also use DMA. Some sh-mobile implementations
      also have some other specialities, that MFD-based solutions don't have.
      This makes supporting all these features in a monolithic driver inconveniet
      and error-prone. This patch splits the driver into 3 parts: the core,
      the MFD glue and the DMA support. In case of a modular build, two modules
      will be built: mmc_tmio_core and mmc_tmio.
      Signed-off-by: NGuennadi Liakhovetski <g.liakhovetski@gmx.de>
      Acked-by: NPaul Mundt <lethal@linux-sh.org>
      Signed-off-by: NChris Ball <cjb@laptop.org>
      b6147490