This patch modifies TMU controller to add changes needed to work with
exynos5440 platform. This sensor registers 3 instance of the tmu controller
with the thermal zone and hence reports 3 temperature output. This controller
supports upto five trip points. For critical threshold the driver uses the
core driver thermal framework for shutdown.
Acked-by: NJonghwa Lee <jonghwa3.lee@samsung.com>
Acked-by: NKukjin Kim <kgene.kim@samsung.com>
Signed-off-by: NJungseok Lee <jays.lee@samsung.com>
Signed-off-by: NAmit Daniel Kachhap <amit.daniel@samsung.com>
Acked-by: NEduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: NEduardo Valentin <eduardo.valentin@ti.com>

This patch adds support to handle multiple instances of the TMU controllers.
This is done by removing the static structure to register with the core thermal
and creating it dynamically for each instance of the TMU controller. The
interrupt is made shared type to handle shared interrupts. Now since the ISR needs
the core thermal framework to be registered so request_irq is moved after the core
registration is done.
Also the identifier of the TMU controller is extracted from device tree alias. This
will be used for TMU specific initialisation.
Acked-by: NKukjin Kim <kgene.kim@samsung.com>
Acked-by: NJonghwa Lee <jonghwa3.lee@samsung.com>
Signed-off-by: NAmit Daniel Kachhap <amit.daniel@samsung.com>
Acked-by: NEduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: NEduardo Valentin <eduardo.valentin@ti.com>

This code simplifies the zone handling to use the trip information passed
by the TMU driver and not the hardcoded macros. This also helps in adding
more zone support.
Acked-by: NKukjin Kim <kgene.kim@samsung.com>
Acked-by: NJonghwa Lee <jonghwa3.lee@samsung.com>
Signed-off-by: NAmit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: NEduardo Valentin <eduardo.valentin@ti.com>

This patch renames member private_data to driver_data of the thermal
zone registration structure as this item stores the driver related
data and uses it to call the driver related callbacks.
Acked-by: NKukjin Kim <kgene.kim@samsung.com>
Acked-by: NJonghwa Lee <jonghwa3.lee@samsung.com>
Acked-by: NEduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: NAmit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: NEduardo Valentin <eduardo.valentin@ti.com>

This code modifies the thermal driver to have multiple thermal zone
support by replacing the global thermal zone variable with device data
member of thermal_zone_device.
Acked-by: NKukjin Kim <kgene.kim@samsung.com>
Acked-by: NJonghwa Lee <jonghwa3.lee@samsung.com>
Acked-by: NEduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: NAmit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: NEduardo Valentin <eduardo.valentin@ti.com>

This patch adds entries min_efuse_value, max_efuse_value, default_temp_offset,
trigger_type, cal_type, trim_first_point, trim_second_point, max_trigger_level
trigger_enable in the TMU platform data structure. Also the driver is modified
to use the data passed by these new platform memebers instead of the constant
macros. All these changes helps in separating the SOC specific data part from
the TMU driver.
Acked-by: NKukjin Kim <kgene.kim@samsung.com>
Acked-by: NJonghwa Lee <jonghwa3.lee@samsung.com>
Signed-off-by: NAmit Daniel Kachhap <amit.daniel@samsung.com>
Acked-by: NEduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: NEduardo Valentin <eduardo.valentin@ti.com>

This patch renames and moves include/linux/platform_data/exynos_thermal.h to
drivers/thermal/samsung/exynos_tmu.h. This file movement is needed as exynos
SOC's are not supporting non-DT based platforms and this file now just contains
exynos tmu driver related definations.
Also struct freq_clip_table is now moved to exynos_thermal_common.c as it fixes
the compilation issue occuring because now this new tmu header file is included
in tmu driver c file and not in the common thermal header file.
Acked-by: NKukjin Kim <kgene.kim@samsung.com>
Acked-by: NJonghwa Lee <jonghwa3.lee@samsung.com>
Acked-by: NEduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: NAmit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: NEduardo Valentin <eduardo.valentin@ti.com>

This code bifurcates exynos thermal implementation into common and sensor
specific parts. The common thermal code interacts with core thermal layer and
core cpufreq cooling parts and is independent of SOC specific driver. This
change is needed to cleanly add support for new TMU sensors.
Acked-by: NKukjin Kim <kgene.kim@samsung.com>
Acked-by: NJonghwa Lee <jonghwa3.lee@samsung.com>
Acked-by: NEduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: NAmit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: NEduardo Valentin <eduardo.valentin@ti.com>