This patch uses the device pointer stored in the configuration structure
and converts to dev_* prints and devm API's.
Acked-by: NKukjin Kim <kgene.kim@samsung.com>
Acked-by: NJonghwa Lee <jonghwa3.lee@samsung.com>
Acked-by: NEduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: NAmit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: NEduardo Valentin <eduardo.valentin@ti.com>

This code simplifies the zone handling to use the trip information passed
by the TMU driver and not the hardcoded macros. This also helps in adding
more zone support.
Acked-by: NKukjin Kim <kgene.kim@samsung.com>
Acked-by: NJonghwa Lee <jonghwa3.lee@samsung.com>
Signed-off-by: NAmit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: NEduardo Valentin <eduardo.valentin@ti.com>

This patch removes the error return in the bind/unbind routine
as the platform may not register any cpufreq cooling data.
Acked-by: NKukjin Kim <kgene.kim@samsung.com>
Acked-by: NJonghwa Lee <jonghwa3.lee@samsung.com>
Acked-by: NEduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: NAmit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: NEduardo Valentin <eduardo.valentin@ti.com>

This patch renames member private_data to driver_data of the thermal
zone registration structure as this item stores the driver related
data and uses it to call the driver related callbacks.
Acked-by: NKukjin Kim <kgene.kim@samsung.com>
Acked-by: NJonghwa Lee <jonghwa3.lee@samsung.com>
Acked-by: NEduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: NAmit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: NEduardo Valentin <eduardo.valentin@ti.com>

This code modifies the thermal driver to have multiple thermal zone
support by replacing the global thermal zone variable with device data
member of thermal_zone_device.
Acked-by: NKukjin Kim <kgene.kim@samsung.com>
Acked-by: NJonghwa Lee <jonghwa3.lee@samsung.com>
Acked-by: NEduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: NAmit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: NEduardo Valentin <eduardo.valentin@ti.com>

This patch renames and moves include/linux/platform_data/exynos_thermal.h to
drivers/thermal/samsung/exynos_tmu.h. This file movement is needed as exynos
SOC's are not supporting non-DT based platforms and this file now just contains
exynos tmu driver related definations.
Also struct freq_clip_table is now moved to exynos_thermal_common.c as it fixes
the compilation issue occuring because now this new tmu header file is included
in tmu driver c file and not in the common thermal header file.
Acked-by: NKukjin Kim <kgene.kim@samsung.com>
Acked-by: NJonghwa Lee <jonghwa3.lee@samsung.com>
Acked-by: NEduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: NAmit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: NEduardo Valentin <eduardo.valentin@ti.com>

This code bifurcates exynos thermal implementation into common and sensor
specific parts. The common thermal code interacts with core thermal layer and
core cpufreq cooling parts and is independent of SOC specific driver. This
change is needed to cleanly add support for new TMU sensors.
Acked-by: NKukjin Kim <kgene.kim@samsung.com>
Acked-by: NJonghwa Lee <jonghwa3.lee@samsung.com>
Acked-by: NEduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: NAmit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: NEduardo Valentin <eduardo.valentin@ti.com>