Device tree binding information for DA9062 and DA9061 thermal junction
temperature monitor.

Binding descriptions for the DA9061 and DA9062 thermal TJUNC supervisor
device driver, using a single THERMAL_TRIP_HOT trip-wire and allowing for
a configurable polling period for over-temperature polling.

This patch also adds two examples, one for DA9062 and one for DA9061. The
DA9061 example uses a fall-back compatible string for the DA9062.
Acked-by: NRob Herring <robh@kernel.org>
Signed-off-by: NSteve Twiss <stwiss.opensource@diasemi.com>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>

This commit documents binding for thermal used in Northstar family SoCs.

There isn't any known Northstar device with active cooling system so DT
example has empty cooling-maps node. There is also no support for CPU
frequency throttling so I put only a critical trip in the example.
Signed-off-by: NRafał Miłecki <rafal@milecki.pl>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>

Add a thermal zone in order to make the example complete.
Signed-off-by: NStefan Wahren <stefan.wahren@i2se.com>
Acked-by: NRob Herring <robh@kernel.org>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>

For different types of SoC the sensor id and endianness may vary.
"#thermal-sensor-cells" is used to provide sensor id information.
"little-endian" property is to tell the endianness of TMU.
Signed-off-by: NJia Hongtao <hongtao.jia@nxp.com>
Acked-by: NRob Herring <robh@kernel.org>
Acked-by: NScott Wood <scottwood@freescale.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

This patch adds dt-binding documentation for zx2967 family thermal sensor.
Signed-off-by: NBaoyou Xie <baoyou.xie@linaro.org>
Acked-by: NRob Herring <robh@kernel.org>
Reviewed-by: NShawn Guo <shawnguo@kernel.org>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>

Signed-off-by: NHien Dang <hien.dang.eb@renesas.com>
Signed-off-by: NKhiem Nguyen <khiem.nguyen.xt@renesas.com>
Signed-off-by: NWolfram Sang <wsa+renesas@sang-engineering.com>
Signed-off-by: NNiklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>

"rockchip,hw-tshut-temp", "rockchip,hw-tshut-mode" and
"rockchip,hw-tshut-polarity" are not a required properties
actually as the code could also work by loading the default
settings there. So it is apprently misleading, although we
prefer to get these from DT. And it seems we miss the 'rockchip,grf'
here which should also be an optional property.
Acked-by: NRob Herring <robh@kernel.org>
Reviewed-by: NHeiko Stuebner <heiko@sntech.de>
Signed-off-by: NShawn Lin <shawn.lin@rock-chips.com>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>

Add dt-binding documentation for bcm2835 SOC thermal sensor.
Signed-off-by: NMartin Sperl <kernel@martin.sperl.org>
Acked-by: NEric Anholt <eric@anholt.net>
Acked-by: NRob Herring <robh@kernel.org>

Changelog:
 V1 -> V2: renamed file to follow naming conventions
 V2 -> V3: removed 0x in node name
Signed-off-by: NEric Anholt <eric@anholt.net>

STiH415/6 SoC's are being removed from the kernel. This
patch removes the compatibles from the dt doc and also
updates the example to a supported platform.
Signed-off-by: NPeter Griffin <peter.griffin@linaro.org>
Cc: <rui.zhang@intel.com>
Cc: <edubezval@gmail.com>
Cc: <robh+dt@kernel.org>
Acked-by: NRob Herring <robh@kernel.org>

Add HW throttle configuration sub-node for soctherm, which
is used to describe the throttle event, and worked as a
cooling device. The "hot" type trip in thermal zone can
be bound to this cooling device, and trigger the throttle
function.
Signed-off-by: NWei Ni <wni@nvidia.com>
Acked-by: NRob Herring <robh@kernel.org>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

This adds the device tree binding documentation for the mediatek thermal
controller found on Mediatek MT2701.
Signed-off-by: NDawei Chien <dawei.chien@mediatek.com>
Reviewed-by: NKeerthy <j-keerthy@ti.com>
Acked-by: NRob Herring <robh@kernel.org>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

Maxim Semiconductor MAX77620 supports alarm interrupts when
its die temperature crosses 120C and 140C. These threshold
temperatures are not configurable.

Add DT binding document to details out the DT property related
to MAX77620 thermal functionality.
Signed-off-by: NLaxman Dewangan <ldewangan@nvidia.com>
Acked-by: NRob Herring <robh@kernel.org>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

TSENS is Qualcomms' thermal temperature sensor device. It
supports reading temperatures from multiple thermal sensors
present on various QCOM SoCs.
Calibration data is generally read from a non-volatile memory
(eeprom) device.

Add a skeleton driver with all the necessary abstractions so
a variety of qcom device families which support TSENS can
add driver extensions.

Also add the required device tree bindings which can be used
to describe the TSENS device in DT.
Signed-off-by: NRajendra Nayak <rnayak@codeaurora.org>
Reviewed-by: NLina Iyer <lina.iyer@linaro.org>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

See the thermal code, the obvious typo from my editor.
Signed-off-by: NCaesar Wang <wxt@rock-chips.com>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

Sometimes, thermal sensors like NCT thermistors are connected to
the ADC channel. The temperature is read by reading the voltage
across the sensor resistance via ADC and referring the lookup
table for ADC value to temperature.

Add DT binding doc for the ADC based thermal sensor driver to
detail the DT property and provide the example for how to use it.
Signed-off-by: NLaxman Dewangan <ldewangan@nvidia.com>
Acked-by: NRob Herring <rob@kernel.org>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>

The Tango thermal driver provides support for the primitive temperature
sensor embedded in Tango chips since the SMP8758.

This sensor only generates a 1-bit signal to indicate whether the die
temperature exceeds a programmable threshold.
Signed-off-by: NMarc Gonzalez <marc_gonzalez@sigmadesigns.com>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>

The latest information that I have is that there is no thermal IP
block present on the r8a7794 SoC so remove the corresponding binding.

Cc: Geert Uytterhoeven <geert+renesas@glider.be>
Acked-by: NGeert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: NSimon Horman <horms+renesas@verge.net.au>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>

The "critical" type trip in thermal zone can be
set to SOC_THERM hardware, it can trigger shut down
or reset event from hardware.
Signed-off-by: NWei Ni <wni@nvidia.com>
Acked-by: NRob Herring <robh@kernel.org>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>

Device tree binding for NVIDIA Tegra have traditionally carried the
"nvidia," vendor prefix in the filename. A couple of odd ones don't, so
fix them up for consistency.

Also rename existing bindings to reflect the first compatible value that
they document. This wasn't done consistently either.
Acked-by: NStephen Warren <swarren@nvidia.com>
Signed-off-by: NThierry Reding <treding@nvidia.com>
Signed-off-by: NRob Herring <robh@kernel.org>

When Tegra124 support was first merged the unit-addresses of all devices
were listed with a "0," prefix to encode the reg property's second cell.
It turns out that this notation is not correct, and the "," separator is
only used to separate fields in the unit address (such as the device and
function number in PCI devices), not individual cells for addresses
with more than one cell.
Acked-by: NStephen Warren <swarren@nvidia.com>
Signed-off-by: NThierry Reding <treding@nvidia.com>
Signed-off-by: NRob Herring <robh@kernel.org>

The Exynos Thermal Management Unit binding says that the vtmu-supply
is optional but is listed in the required properties section. Add an
optional properties section and move the regulator property there.
Acked-by: NRob Herring <robh@kernel.org>
Reviewed-by: NKrzysztof Kozlowski <k.kozlowski@samsung.com>
Reviewed-by: NAndi Shyti <andi.shyti@samsung.com>
Signed-off-by: NJavier Martinez Canillas <javier@osg.samsung.com>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>

Document the number of configurable temperature thresholds (for
trip-points in interrupt-driven mode).
Acked-by: NRob Herring <robh@kernel.org>
Reviewed-by: NChanwoo Choi <cw00.choi@samsung.com>
Signed-off-by: NKrzysztof Kozlowski <k.kozlowski@samsung.com>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>

Commit 488c7455 ("thermal: exynos: Add the support for Exynos5433
TMU") added new compatible but forgot to update documentation.
Acked-by: NRob Herring <robh@kernel.org>
Reviewed-by: NChanwoo Choi <cw00.choi@samsung.com>
Signed-off-by: NKrzysztof Kozlowski <k.kozlowski@samsung.com>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>

This adds the device tree binding documentation for the mediatek thermal
controller found on Mediatek MT8173 and other SoCs.
Signed-off-by: NSascha Hauer <s.hauer@pengutronix.de>
Reviewed-by: NDaniel Kurtz <djkurtz@chromium.org>
Acked-by: NRob Herring <robh@kernel.org>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>

This patch enables to use thermal-zone on DT if it was calles as
"renesas,rcar-thermal-gen2".
Previous style (= non thermal-zone) is still supported by
"renesas,rcar-thermal" to keep compatibility for "git bisect".
Signed-off-by: NKuninori Morimoto <kuninori.morimoto.gx@renesas.com>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>

This patchset attempts to new compatible for thermal founding
on RK3228/RK3399 SoCs.
Signed-off-by: NCaesar Wang <wxt@rock-chips.com>
Acked-by: NRob Herring <robh@kernel.org>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>

Add bindings documentation for TMU (Thermal Monitoring Unit) on QorIQ
platform.
Signed-off-by: NJia Hongtao <hongtao.jia@freescale.com>
Reviewed-by: NScott Wood <scottwood@freescale.com>
Acked-by: NRob Herring <robh@kernel.org>
Signed-off-by: NScott Wood <scottwood@freescale.com>

This patchset attempts to new compatible for thermal founding
on RK3368 SoCs.
Signed-off-by: NCaesar Wang <wxt@rock-chips.com>
Acked-by: NRob Herring <robh@kernel.org>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>

The "init" pinctrl is defined we'll set
pinctrl to this state before probe and then "default" after probe.
Add the "init" and "sleep" pinctrl as the OTP gpio state, since we need
switch the pin to gpio state before the TSADC controller is reset.

AFAIK, the TSADC controller is reset, the tshut polarity will be
a *low* signal in a short period of time for some devices.

Says:
The TSADC get the temperature on rockchip thermal.

If T(current temperature) < (setting temperature), the OTP output the
*high* signal.
If T(current temperature) > (setting temperature), the OTP output the
*low* Signal.

In some cases, the OTP pin is connected to the PMIC, maybe the
PMIC can accept the reset response time to avoid this issue.

In other words, the system will be always reboot if we make the
OTP pin is connected the others IC to control the power.
Acked-by: NRob Herring <robh@kernel.org>
Signed-off-by: NCaesar Wang <wxt@rock-chips.com>
Reviewed-by: NDouglas Anderson <dianders@chromium.org>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>

Add OMAP36xx support to ti-soc-thermal driver. This
chip is also unreliable. The data provided here is
based on OMAP36xx TRM:
http://www.ti.com/lit/ug/swpu177aa/swpu177aa.pdfSigned-off-by: NEduardo Valentin <edubezva@gmail.com>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>

This adds support for OMAP3 chips to ti-soc-thermal. As requested by
TI people, it is marked unreliable and warning is printed.
Signed-off-by: NPavel Machek <pavel@ucw.cz>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>

The cooling-{min,max}-level properties are marked as optional in
Documentation/devicetree/bindings/cpufreq/cpufreq-dt.txt and the usage
in various device tree matches this, i.e., some cooling device in the
device trees provide these properties while others do not.

Make the bindings in
Documentation/devicetree/bindings/thermal/thermal.txt consistent with
the cpufreq-dt bindings by marking the cooling-*-level properties as
optional.
Signed-off-by: NPunit Agrawal <punit.agrawal@arm.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: Rob Herring <robh+dt@kernel.org>
Cc: Mark Rutland <mark.rutland@arm.com>
Cc: Ian Campbell <ijc+devicetree@hellion.org.uk>
Cc: Kumar Gala <galak@codeaurora.org>
Signed-off-by: NRob Herring <robh@kernel.org>

The device trees in the kernel as well as the binding description in
Documentation/devicetree/bindings/cpufreq/cpufreq-dt.txt use the
cooling-{min,max}-level property.

Fix the inconsistency with the binding description in
Documentation/devicetree/bindings/thermal/thermal.txt by changing
cooling-*-state properties to cooling-*-level.
Signed-off-by: NPunit Agrawal <punit.agrawal@arm.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: Rob Herring <robh+dt@kernel.org>
Cc: Mark Rutland <mark.rutland@arm.com>
Cc: Ian Campbell <ijc+devicetree@hellion.org.uk>
Cc: Kumar Gala <galak@codeaurora.org>
Signed-off-by: NRob Herring <robh@kernel.org>

This adds documentation of device tree bindings for the
thermal sensor controller of hi6220 SoC.
Signed-off-by: NLeo Yan <leo.yan@linaro.org>
Signed-off-by: Nkongxinwei <kong.kongxinwei@hisilicon.com>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>

Introduce an optional property called, sustainable-power, which
represents the power (in mW) which the thermal zone can safely
dissipate.

If provided the property is parsed and associated with the thermal
zone via the thermal zone parameters.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: NPunit Agrawal <punit.agrawal@arm.com>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>

Add support for the temperature alarm peripheral found inside
Qualcomm plug-and-play (QPNP) PMIC chips. The temperature alarm
peripheral outputs a pulse on an interrupt line whenever the
thermal over temperature stage value changes.

Register a thermal sensor. The temperature reported by this thermal
sensor device should reflect the actual PMIC die temperature if an
ADC is present on the given PMIC. If no ADC is present, then the
reported temperature should be estimated from the over temperature
stage value.

Cc: David Collins <collinsd@codeaurora.org>
Signed-off-by: NIvan T. Ivanov <iivanov@mm-sol.com>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>

r8a73a4 is R-Mobile APE6, not AP6.
Signed-off-by: NGeert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>

Align compatible strings for several IP blocks present on Tegra chips
with the latest doctrine from the DT maintainers:

http://marc.info/?l=devicetree&m=142255654213019&w=2

The primary objective here is to avoid checkpatch warnings, per:

http://marc.info/?l=linux-tegra&m=142201349727836&w=2

DT binding text files have been updated for the following IP blocks:

- PCIe
- SOR
- SoC timers
- AHB "gizmo"
- APB_MISC
- pinmux control
- UART
- PWM
- I2C
- SPI
- RTC
- PMC
- eFuse
- AHCI
- HDA
- XUSB_PADCTRL
- SDHCI
- SOC_THERM
- AHUB
- I2S
- EHCI
- USB PHY

N.B. The nvidia,tegra20-timer compatible string is removed from the
nvidia,tegra30-timer.txt documentation file because it's already
mentioned in the nvidia,tegra20-timer.txt documentation file.

This second version takes into account the following requests from
Rob Herring <robherring2@gmail.com>:

- Per-IP block patches have been combined into a single patch

- Explicit documentation about which compatible strings are actually
  matched by the driver has been removed.  In its place is implicit
  documentation that loosely follows Rob's prescribed format:

  "Must contain '"nvidia,<chip>-pcie", "nvidia,tegra20-pcie"' where
   <chip> is tegra30, tegra132, ..." [...]  "You should attempt to
   document known values of <chip> if you use it"
Signed-off-by: NPaul Walmsley <paul@pwsan.com>
Cc: Alexandre Courbot <gnurou@gmail.com>
Cc: Dylan Reid <dgreid@chromium.org>
Cc: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
Cc: Hans de Goede <hdegoede@redhat.com>
Cc: Ian Campbell <ijc+devicetree@hellion.org.uk>
Cc: Jingchang Lu <jingchang.lu@freescale.com>
Cc: John Crispin <blogic@openwrt.org>
Cc: Kumar Gala <galak@codeaurora.org>
Cc: Linus Walleij <linus.walleij@linaro.org>
Cc: Mark Rutland <mark.rutland@arm.com>
Cc: Mikko Perttunen <mperttunen@nvidia.com>
Cc: Murali Karicheri <m-karicheri2@ti.com>
Cc: Paul Walmsley <pwalmsley@nvidia.com>
Cc: Pawel Moll <pawel.moll@arm.com>
Cc: Peter De Schrijver <pdeschrijver@nvidia.com>
Cc: Peter Hurley <peter@hurleysoftware.com>
Cc: Sean Paul <seanpaul@chromium.org>
Cc: Stephen Warren <swarren@wwwdotorg.org>
Cc: Takashi Iwai <tiwai@suse.de>
Cc: Tejun Heo <tj@kernel.org>
Cc: "Terje Bergström" <tbergstrom@nvidia.com>
Cc: Thierry Reding <thierry.reding@gmail.com>
Cc: Tuomas Tynkkynen <ttynkkynen@nvidia.com>
Cc: Wolfram Sang <wsa@the-dreams.de>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: dri-devel@lists.freedesktop.org
Cc: linux-i2c@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Cc: linux-pci@vger.kernel.org
Cc: linux-pm@vger.kernel.org
Cc: linux-pwm@vger.kernel.org
Cc: linux-tegra@vger.kernel.org
Acked-by: NEduardo Valentin <edubezval@gmail.com>
Signed-off-by: NRob Herring <robh@kernel.org>

Add documentation for exynos7 thermal bindings including compatible
name and special clock properties.
Acked-by: NLukasz Majewski <l.majewski@samsung.com>
Signed-off-by: NAbhilash Kesavan <a.kesavan@samsung.com>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>

There are various issues with the examples in this documentation, some
of the DT labels are invalid and one of the macro THERMAL_NO_LIMITS
referenced is not available as well.

This patch attempts to fix such errors in the documentation.
Signed-off-by: NSrinivas Kandagatla <srinivas.kandagatla@linaro.org>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>