update zh-cn/device-dev/porting/porting-chip-prepare-process.md.

Signed-off-by: NAustin23 <liaozhiqi7@huawei.com>
Signed-off-by: NAustin <liaozhiqi7@huawei.com>

zh-cn/device-dev/porting/porting-chip-prepare-process.md

 # 编译构建适配流程
 
 
-编译构建的详细介绍请见[编译构建子系统介绍](../subsystems/subsys-build-mini-lite.md)。新增三方芯片时，编译相关的适配流程如下：
+编译构建的详细介绍请见[编译构建子系统介绍](../subsystems/subsys-build-all.md)。新增三方芯片时，编译相关的适配流程如下：
 
 
 ## 编译构建适配流程