Include a file with the initial values for non-volatile UEFI variables
into the U-Boot binary. If this variable is set, changes to variable PK
will not be allowed.
Signed-off-by: NHeinrich Schuchardt <xypron.glpk@gmx.de>

To determine if a varible is on the of the authentication variables
PK, KEK, db, dbx we have to check both the name and the GUID.

Provide a function converting the variable-name/guid pair to an enum and
use it consistently.
Signed-off-by: NHeinrich Schuchardt <xypron.glpk@gmx.de>

The file based and the OP-TEE based UEFI variable store are mutually
exclusive. Define them as choice options in Kconfig.
Signed-off-by: NHeinrich Schuchardt <xypron.glpk@gmx.de>

Some distributions provide UEFI binaries like Shim that have been signed
using a Microsoft certificate. Provide the download paths for the public
keys.
Signed-off-by: NHeinrich Schuchardt <xypron.glpk@gmx.de>

Update the UEFI secure state when variable 'PK' is updated in the TEE
variables implementation.
Signed-off-by: NHeinrich Schuchardt <xypron.glpk@gmx.de>
Reviewed-by: NIlias Apalodimas <ilias.apalodimas@linaro.org>

When using secure boot functions needed both for file and TEE based UEFI
variables have to be moved to the common code module efi_var_common.c.
Signed-off-by: NHeinrich Schuchardt <xypron.glpk@gmx.de>

A previous commit adds support for displaying variables RO flag.
Let's add it on the TEE backed variable storage as well.
Signed-off-by: NIlias Apalodimas <ilias.apalodimas@linaro.org>
Reviewed-by: NHeinrich Schuchardt <xypron.glpk@gmx.de>

Skip messages should only be written if the setup is not suitable for
testing.

If DHCP is enabled, we should not write a skip message if no static network
configuration is supplied.

Likewise if a static network configuration is supplied, we should not write
a skip message if DHCP is not enabled.
Signed-off-by: NHeinrich Schuchardt <xypron.glpk@gmx.de>

In our Python tests we want to run 'bootefi hello'. Enable it by default
when compiling with CMD_BOOTEFI_SELFTEST.
Signed-off-by: NHeinrich Schuchardt <xypron.glpk@gmx.de>

Add missing includes.
Add CMD_LSBLK to sandbox_defconfig.
Signed-off-by: NHeinrich Schuchardt <xypron.glpk@gmx.de>

The `fitupd' command is not used by any board. The `dfu tftp' command
provides the same capabilities.

So let's drop the `fitupd' command.
Signed-off-by: NHeinrich Schuchardt <xypron.glpk@gmx.de>

- Make sure GRUB is copied to the right place for CI on GitLab/Azure
- Note in our GitHub PR template that you can use this to trigger Azure CI

The GRUB binaries are expected in $UBOOT_TRAVIS_BUILD_DIR.
Signed-off-by: NHeinrich Schuchardt <xypron.glpk@gmx.de>

The GRUB binaries are expected in $UBOOT_TRAVIS_BUILD_DIR.
Signed-off-by: NHeinrich Schuchardt <xypron.glpk@gmx.de>

While the general policy of not taking changes to the project via pull
requests directly on GitHub has not changed, it can be useful to submit
a PR there in order to trigger a CI run on Azure.  These are run
automatically and the results are populated back to GitHub.  Add a note
to the template to reflect this.
Signed-off-by: NTom Rini <trini@konsulko.com>

- Sync DMA and CPSW DT bindings for K3 devices
- Other minor fixes for mmc and other TI devices

Pull request for UEFI sub-system for efi-2020-10-rc1 (3)

Up to now UEFI variables where stored in U-Boot environment variables.
Saving UEFI variables was not possible without saving the U-Boot
environment variables. With this patch series file ubootefi.var in the
EFI system partition is used for saving UEFI variables. Furthermore the
UEFI variables are exposed for reading at runtime.

Code corrections for UEFI secure boot are provided.

A buffer overrun in the RSA library is fixed.

Replace the function spl_board_prepare_for_boot_linux by the correct
name of the weak function spl_board_prepare_for_linux defined in spl.h.
Signed-off-by: NPatrick Delaunay <patrick.delaunay@st.com>

In commit commit d2c05f50 ("mmc: omap_hsmmc: Set 3.3V for IO voltage")
was changed 3.0V IO voltage to 3.3V but it was not done on all places in
omap_hsmmc driver. That commit broke eMMC support on Nokia N900.

This patch fixes that problematic commit and changes 3.0V to 3.3V on all
remaining places in omap_hsmmc driver.

Fixes: d2c05f50 ("mmc: omap_hsmmc: Set 3.3V for IO voltage")
Signed-off-by: NPali Rohár <pali@kernel.org>
Acked-by: NPavel Machek <pavel@ucw.cz>
Reviewed-by: NFaiz Abbas <faiz_abbas@ti.com>

Buiding u-boot-spl-k3[_HS].its is currently unconditionally verbose
about what it does. Change that by wrapping the call to k3_fit_atf.sh
into a cmd, also using that chance to reduce duplicate lines of makefile
code - only IS_HS=1 is different when CONFIG_TI_SECURE_DEVICE is on.
Signed-off-by: NJan Kiszka <jan.kiszka@siemens.com>
Acked-by: NLokesh Vutla <lokeshvutla@ti.com>

At this point in time we can now remove our legacy code and switch to
enabling DM for USB and Ethernet.

Cc: Derald D. Woods <woods.technical@gmail.com>
Cc: Adam Ford <aford173@gmail.com>
Signed-off-by: NTom Rini <trini@konsulko.com>
Tested-by: NDerald D. Woods <woods.technical@gmail.com>

There are two options that are currently whitelisted, but they
are redundant, because there are not necessary since Kconfig options
exist to basically state the same thing.

CONFIG_DIRECT_NOR_BOOT and CONFIG_USE_NOR are both set together and
only used by the da850 when booting from NOR, however the only time
CONFIG_MTD_NOR_FLASH is configured is when booting from NOR. Since
NOR doesn't need SPL, the options for SPL can be moved to a check for
building SPL instead of checking for NOR.

This patch removes the checks for these two config options and unifies
the checks around the Kconfig option of CONFIG_MTD_NOR_FLASH.

Since this board is the only board that uses these two config options,
they can be removed from the whitelist table.
Signed-off-by: NAdam Ford <aford173@gmail.com>

The documentation states that SPL is enabled in all config options
for the da850.  This incorrect, because devices booting from NOR
do not need the SPL to do the low level initializion because when
booting from NOR, the board is able to execute in place (XIP)

This also clarifies that SPL isn't only used for booting from SPI,
because it is also used for booting from MMC and NAND for those
devices supporting those boot options.
Signed-off-by: NAdam Ford <aford173@gmail.com>

Sync CPSW DT node from kernel and move it out of -u-boot.dtsi file.
Signed-off-by: NVignesh Raghavendra <vigneshr@ti.com>

Sync CPSW DT node from Kernel and move it out of -u-boot.dtsi file.
Signed-off-by: NVignesh Raghavendra <vigneshr@ti.com>

Kernel DT has CPSW ports under ethernet-ports subnode. Update the driver
to look for the same.
Signed-off-by: NVignesh Raghavendra <vigneshr@ti.com>

Force default thread to be used for RX as ALE is anyways set to Bypass
mode.
Signed-off-by: NVignesh Raghavendra <vigneshr@ti.com>

MDIO node is not referenced further, therefore drop the dead code.
Signed-off-by: NVignesh Raghavendra <vigneshr@ti.com>

We only request ring pairs via K3 DMA driver, switch to use the new
k3_ringacc_request_rings_pair() to simplify the code.

As a good side effect, all boot stages now use exposed RING mode which
avoid maintaining proxy mode for 32 bit R5 core.
Signed-off-by: NVignesh Raghavendra <vigneshr@ti.com>

In K3 UDMA architecture, RX rings are associated with RX flows rather
than RX channels, therefore move the ring pointers to udma_rflow struct
Signed-off-by: NVignesh Raghavendra <vigneshr@ti.com>

Encapsulate channel configuration in a separate struct so as to ease
resetting of these fields with memset() and also to increase readability
of the code.
Signed-off-by: NVignesh Raghavendra <vigneshr@ti.com>

In preparation of adding more K3 SoCs, separate soc specific
initialization add a SoC specific initialization hook.
Signed-off-by: NVignesh Raghavendra <vigneshr@ti.com>

Add new API k3_ringacc_request_rings_pair() to request pair of rings at
once, as in the most case Rings are used with DMA channels which required
to request pair of rings - one to feed DMA with descriptors (TX/RX FDQ) and
one to receive completions (RX/TX CQ). This will allow to simplify Ringacc
API users.
Signed-off-by: NVignesh Raghavendra <vigneshr@ti.com>

Move the free, occ, windex and rinfex under a struct.
We can use memset to zero them and it will allow a cleaner way to extend
the variables for duplex rings.
Signed-off-by: NVignesh Raghavendra <vigneshr@ti.com>

Sync DT bindings from kernel DT and move them to out of -u-boot.dtsi
files.
Signed-off-by: NVignesh Raghavendra <vigneshr@ti.com>
Reviewed-by: NGrygorii Strashko <grygorii.strashko@ti.com>

Update driver to use static PSIL endpoint Data instead of DT. This will
allow DT bindings to be in sync with kernel's DT.

Note that this patch breaks networking and OSPI boot as driver changes
are not backward compatible with existing DT. Subsequent commit will
update the DT to make it compatible with updated driver.
Signed-off-by: NVignesh Raghavendra <vigneshr@ti.com>
Reviewed-by: NGrygorii Strashko <grygorii.strashko@ti.com>

Much of PSIL endpoint configuration for a given SoC can be known at
compile time, therefore pass them for platform specific data instead of
DT.

Add per SoC's specific PSIL endpoint data. This is to bring driver in
sync with upstream DT.
Signed-off-by: NVignesh Raghavendra <vigneshr@ti.com>
Reviewed-by: NGrygorii Strashko <grygorii.strashko@ti.com>

- Enable DM_SPI on siemens omap boards (Jagan)
- Dropped some non-dm supported omap3 boards (Jagan)
- Dropped non-dm code in omap3 spi driver (Jagan)
- Dropped non-dm code in kirkwood spi driver (Bhargav)

As variable services are available at runtime we have to expect EFI_SUCCESS
when calling the services.
Signed-off-by: NHeinrich Schuchardt <xypron.glpk@gmx.de>

Enable UEFI variables at runtime.
Signed-off-by: NHeinrich Schuchardt <xypron.glpk@gmx.de>