arm: omap5: add U-Boot FIT signing and SPL image post-processing
Modify the SPL build procedure for AM57xx and DRA7xx high-security (HS) device variants to create a secure u-boot_HS.img FIT blob that contains U-Boot and DTB artifacts signed with a TI-specific process based on the CONFIG_TI_SECURE_DEVICE config option and the externally-provided image signing tool. Also populate the corresponding FIT image post processing call to be performed during SPL runtime. Signed-off-by: NDaniel Allred <d-allred@ti.com> Signed-off-by: NAndreas Dannenberg <dannenberg@ti.com> Reviewed-by: NTom Rini <trini@konsulko.com>
Showing
想要评论请 注册 或 登录