提交 1d6dedd5 编写于 作者: E ester.zhou

update docs

Signed-off-by: Nester.zhou <ester.zhou@huawei.com>
上级 e72c184d
......@@ -8,11 +8,11 @@ This document uses the process of porting a development board named **MyProduct
### Defining a Product<a name="section145mcpsimp"></a>
Create a config.json file in the directory with the name "//vendor/MyProductVendor/{product_name}. This file is used to describe the SoC used by the product and the required subsystems. configure the file as follows:
Create a **config.json** file in the directory **//vendor/MyProductVendor/*{product_name}***. This file is used to describe the SoC used by the product and the required subsystems.
For example, if **product_name** is **MyProduct**, configure the **//vendor/MyProductVendor/MyProduct/config.json** file as follows:
//vendor/MyProductVendor/MyProduct/config.json
```
{
"product_name": "MyProduct",
......@@ -39,29 +39,29 @@ Create a config.json file in the directory with the name "//vendor/MyProductVend
The main configurations are as follows:
product_name:The product name.Required
**product_name**: product name. This parameter is required.
version:version.Required
**version**: version. This parameter is required.
type:Configured at the system level, select from (mini, small, standard).Required
**type**: system level, which can be **mini**, **small**, or **standard**. This parameter is required.
target_cpu :The CPU type of the device (depending on the actual situation, the target_cpu here may also be arm64, riscv, x86, etc..).Required
**target_cpu**: CPU type of the device (depending on the actual situation, the target_cpu here may also be arm64, riscv, x86, etc..). This parameter is required.
ohos_version:Operating system version.Optional
**ohos_version**: operating system version. This parameter is optional.
device_company:device manufacturer name.Required
**device_company**: device manufacturer name. This parameter is required.
board:Board name.Required
**board**: board name. This parameter is required.
enable_ramdisk:Whether to start ramdisk.Required
**enable_ramdisk**: whether to enable the RAM disk. This parameter is required.
kernel_type and kernel_version: kernel_type with kernel_version is fixed in the standard and does not need to be written.Optional
**kernel_type** and **kernel_version**: fixed in the standard system. They are optional.
subsystems:The subsystem that the system needs to be enabled. Subsystems can simply understand a piece of function that is built independently. Required
**subsystems**: subsystem to enable. A subsystem can be treated as an independently built functional block. This parameter is required.
product_company:Not reflected in the configuration, but in the directory name, the next directory of the vendor is product_company, build.gn script can still be accessed.
**product_company**: device manufacturer name. It is not set in the configuration, but in the directory name, next to the vendor name. It can be accessed from **build.gn script**.
You can find available subsystems in **//build/subsystem\_config.json**. You can also customize subsystems.
You can find predefined subsystems in **//build/subsystem\_config.json**. You can also customize subsystems.
You are advised to copy the configuration file of Hi3516D V300 and delete the **hisilicon\_products** subsystem, which is used to compile the kernel for Hi3516D V300.
......
......@@ -61,19 +61,19 @@ The process to build OpenHarmony is as follows:
### Directory Structure<a name="section109065332264"></a>
```
/build # Primary directory
├── config # Build configuration items
/build # Primary directory
├── config # Build configuration items
├── core
│ └── gn # Build entry BUILD.gn configuration
├── loader # Loader of module configuration, which also generates a template for the module
├── ohos # Configuration of the process for building and packaging OpenHarmony
├── loader # Loader of module configuration, which also generates a template for the module
├── ohos # Configuration of the process for building and packaging OpenHarmony
│ ├── kits # Build and packaging templates and processing flow for kits
│ ├── ndk # NDK template and processing flow
│ ├── notice # Notice template and processing flow
│ ├── packages # Distribution packaging template and processing flow
│ ├── sa_profile # SA template and processing flow
│ ├── sdk # SDK template and processing flow, which contains the module configuration in the SDK
│ └── testfwk # Processing flow related to the test
│ └── testfwk # Processing flow related to the test
├── scripts # Build-related Python script
├── templates # C/C++ build templates
└── toolchain # Toolchain configuration
......@@ -207,7 +207,7 @@ The process to build OpenHarmony is as follows:
2. Add the module to the product configuration file.
Add the module to the product configuration file **//vendor/{product_company}/{product-name}/config.json**.
Add the module to the product configuration file **//vendor/{product_company}/{product-name}/config.json**.
Add "subsystem\_examples:partA" to the product configuration file. **partA** will be built and packaged into the distribution.
......
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