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  1. 17 10月, 2014 1 次提交
  3. 11 10月, 2014 2 次提交
    • J
      Thermal: int340x_thermal: expose acpi thermal relationship tables · 52b1c69d
      由 Jacob Pan 提交于 
      ACPI 4.0 introduced two thermal relationship tables via _ART
(active cooling) and  _TRT (passive cooling) objects. These
tables contain many to many relationships among thermal sensors
and cooling devices.

This patch parses _ART and _TRT and makes the result available to
the userspace via an misc device interface. At the same time,
kernel drivers can also request parsing results from internal
kernel APIs.

The results include source and target devices, influence, and
sampling rate in case of _TRT. For _ART, the result shows source
device, target device, and weight percentage.
Signed-off-by: NJacob Pan <jacob.jun.pan@linux.intel.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>
      52b1c69d
    • L
      Thermal: introduce int3403 thermal driver · 4384b8fe
      由 Lan Tianyu 提交于 
      ACPI INT3403 device object can be used to retrieve temperature date
from temperature sensors present in the system, and to expose
device' performance control.

The previous INT3403 thermal driver supports temperature reporting only,
thus remove it and introduce this new & enhanced one.
Signed-off-by: NLan Tianyu <tianyu.lan@intel.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>
      4384b8fe
  5. 10 10月, 2014 2 次提交
  7. 11 9月, 2014 1 次提交
    • Z
      ACPI: introduce ACPI int340x thermal scan handler · 3230bbfc
      由 Zhang Rui 提交于 
      Newer laptops and tablets that use ACPI may have thermal sensors and
other devices with thermal control capabilities outside the core CPU/SOC,
for thermal safety reasons.
They are exposed for the OS to use via
1) INT3400 ACPI device object as the master.
2) INT3401 ~ INT340B ACPI device objects as the slaves.

This patch introduces a scan handler to enumerate the INT3400
ACPI device object to platform bus, and prevent its slaves
from being enumerated before the controller driver being probed.
Signed-off-by: NZhang Rui <rui.zhang@intel.com>
      3230bbfc
  9. 15 7月, 2014 2 次提交
  11. 15 5月, 2014 1 次提交
    • S
      thermal: Intel SoC DTS thermal · bc40b5e3
      由 Srinivas Pandruvada 提交于 
      In the Intel SoCs like Bay Trail, there are 2 additional digital temperature
sensors(DTS), in addition to the standard DTSs in the core. Also they support
4 programmable thresholds, out of which two can be used by OSPM. These
thresholds can be used by OSPM thermal control. Out of these two thresholds,
one is used by driver and one user mode can change via thermal sysfs to get
notifications on threshold violations.

The driver defines one critical trip points, which is set to TJ MAX - offset.
The offset can be changed via module parameter (default 5C). Also it uses
one of the thresholds to get notification for this temperature violation.
This is very important for orderly shutdown as the many of these devices don't
have ACPI thermal zone, and expects that there is some other thermal control
mechanism present in OSPM. When a Linux distro is used without additional
specialized thermal control program, BIOS can do force shutdown when thermals
are not under control. When temperature reaches critical, the Linux thermal
core will initiate an orderly shutdown.
Signed-off-by: NSrinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>
      bc40b5e3
  13. 07 5月, 2014 1 次提交
  15. 03 3月, 2014 2 次提交
  17. 25 2月, 2014 1 次提交
  19. 02 1月, 2014 2 次提交
  21. 04 12月, 2013 2 次提交
    • E
      thermal: cpu_cooling: introduce of_cpufreq_cooling_register · 39d99cff
      由 Eduardo Valentin 提交于 
      This patch introduces an API to register cpufreq cooling device
based on device tree node.

The registration via device tree node differs from normal
registration due to the fact that it is needed to fill
the device_node structure in order to be able to match
the cooling devices with trip points.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: NEduardo Valentin <eduardo.valentin@ti.com>
      39d99cff
    • E
      thermal: introduce device tree parser · 4e5e4705
      由 Eduardo Valentin 提交于 
      This patch introduces a device tree bindings for
describing the hardware thermal behavior and limits.
Also a parser to read and interpret the data and feed
it in the thermal framework is presented.

This patch introduces a thermal data parser for device
tree. The parsed data is used to build thermal zones
and thermal binding parameters. The output data
can then be used to deploy thermal policies.

This patch adds also documentation regarding this
API and how to define tree nodes to use
this infrastructure.

Note that, in order to be able to have control
on the sensor registration on the DT thermal zone,
it was required to allow changing the thermal zone
.get_temp callback. For this reason, this patch
also removes the 'const' modifier from the .ops
field of thermal zone devices.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Acked-by: NMark Rutland <mark.rutland@arm.com>
Signed-off-by: NEduardo Valentin <eduardo.valentin@ti.com>
      4e5e4705
  23. 16 10月, 2013 1 次提交
  25. 09 10月, 2013 1 次提交
  27. 25 9月, 2013 1 次提交
  29. 03 9月, 2013 1 次提交
    • E
      thermal: hwmon: move hwmon support to single file · 0dd88793
      由 Eduardo Valentin 提交于 
      In order to improve code organization, this patch
moves the hwmon sysfs support to a file named
thermal_hwmon. This helps to add extra support
for hwmon without scrambling the code.

In order to do this move, the hwmon list head is now
using its own locking. Before, the list used
the global thermal locking. Also, some minor changes
in the code were required, as recommended by checkpatch.pl.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Acked-by: NDurgadoss R <durgadoss.r@intel.com>
Signed-off-by: NEduardo Valentin <eduardo.valentin@ti.com>
      0dd88793
  31. 13 8月, 2013 2 次提交
  33. 18 6月, 2013 2 次提交
  35. 28 5月, 2013 1 次提交
    • E
      thermal: introduce TI SoC thermal driver · eb982001
      由 Eduardo Valentin 提交于 
      This patch moves the ti-soc-thermal driver out of
the staging tree to the thermal tree.

Cc: Grant Likely <grant.likely@linaro.org>
Cc: Rob Herring <rob.herring@calxeda.com>
Cc: Rob Landley <rob@landley.net>
Cc: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <eduardo.valentin@ti.com>
Cc: J Keerthy <j-keerthy@ti.com>
Cc: Radhesh Fadnis <radhesh.fadnis@ti.com>
Cc: Cyril Roelandt <tipecaml@gmail.com>
Cc: devicetree-discuss@lists.ozlabs.org
Cc: linux-doc@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Cc: devel@driverdev.osuosl.org
Cc: linux-pm@vger.kernel.org
Signed-off-by: NEduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>
      eb982001
  37. 25 4月, 2013 1 次提交
  39. 14 4月, 2013 1 次提交
  41. 02 4月, 2013 3 次提交
  43. 08 2月, 2013 3 次提交
  45. 06 2月, 2013 2 次提交
  47. 04 1月, 2013 1 次提交
  49. 03 12月, 2012 1 次提交
  51. 22 11月, 2012 1 次提交
  53. 15 11月, 2012 1 次提交