The power allocator governor uses ftrace to output a bunch of internal
data for debugging and tuning.  Currently, the requested power it
outputs is the "weighted" requested power, that is, what each cooling
device has requested multiplied by the cooling device weight.  It is
more useful to trace the real request, without any weight being
applied.

This commit only affects the data traced, there is no functional change.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: NJavi Merino <javi.merino@arm.com>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>

This file isn't getting removed while we unbind a device from thermal
zone. And this causes following messages when the device is registered
again:

WARNING: CPU: 0 PID: 2228 at /home/viresh/linux/fs/sysfs/dir.c:31 sysfs_warn_dup+0x60/0x70()
sysfs: cannot create duplicate filename '/devices/virtual/thermal/thermal_zone0/cdev0_weight'
Modules linked in: cpufreq_dt(+) [last unloaded: cpufreq_dt]
CPU: 0 PID: 2228 Comm: insmod Not tainted 4.2.0-rc3-00059-g44fffd9473eb #272
Hardware name: SAMSUNG EXYNOS (Flattened Device Tree)
[<c00153e8>] (unwind_backtrace) from [<c0012368>] (show_stack+0x10/0x14)
[<c0012368>] (show_stack) from [<c053a684>] (dump_stack+0x84/0xc4)
[<c053a684>] (dump_stack) from [<c002284c>] (warn_slowpath_common+0x80/0xb0)
[<c002284c>] (warn_slowpath_common) from [<c00228ac>] (warn_slowpath_fmt+0x30/0x40)
[<c00228ac>] (warn_slowpath_fmt) from [<c012d524>] (sysfs_warn_dup+0x60/0x70)
[<c012d524>] (sysfs_warn_dup) from [<c012d244>] (sysfs_add_file_mode_ns+0x13c/0x190)
[<c012d244>] (sysfs_add_file_mode_ns) from [<c012d2d4>] (sysfs_create_file_ns+0x3c/0x48)
[<c012d2d4>] (sysfs_create_file_ns) from [<c03c04a8>] (thermal_zone_bind_cooling_device+0x260/0x358)
[<c03c04a8>] (thermal_zone_bind_cooling_device) from [<c03c2e70>] (of_thermal_bind+0x88/0xb4)
[<c03c2e70>] (of_thermal_bind) from [<c03c10d0>] (__thermal_cooling_device_register+0x17c/0x2e0)
[<c03c10d0>] (__thermal_cooling_device_register) from [<c03c3f50>] (__cpufreq_cooling_register+0x3a0/0x51c)
[<c03c3f50>] (__cpufreq_cooling_register) from [<bf00505c>] (cpufreq_ready+0x44/0x88 [cpufreq_dt])
[<bf00505c>] (cpufreq_ready [cpufreq_dt]) from [<c03d6c30>] (cpufreq_add_dev+0x4a0/0x7dc)
[<c03d6c30>] (cpufreq_add_dev) from [<c02cd3ec>] (subsys_interface_register+0x94/0xd8)
[<c02cd3ec>] (subsys_interface_register) from [<c03d785c>] (cpufreq_register_driver+0x10c/0x1f0)
[<c03d785c>] (cpufreq_register_driver) from [<bf0057d4>] (dt_cpufreq_probe+0x60/0x8c [cpufreq_dt])
[<bf0057d4>] (dt_cpufreq_probe [cpufreq_dt]) from [<c02d03e4>] (platform_drv_probe+0x44/0xa4)
[<c02d03e4>] (platform_drv_probe) from [<c02cead8>] (driver_probe_device+0x174/0x2b4)
[<c02cead8>] (driver_probe_device) from [<c02ceca4>] (__driver_attach+0x8c/0x90)
[<c02ceca4>] (__driver_attach) from [<c02cd078>] (bus_for_each_dev+0x68/0x9c)
[<c02cd078>] (bus_for_each_dev) from [<c02ce2f0>] (bus_add_driver+0x19c/0x214)
[<c02ce2f0>] (bus_add_driver) from [<c02cf490>] (driver_register+0x78/0xf8)
[<c02cf490>] (driver_register) from [<c0009710>] (do_one_initcall+0x8c/0x1d4)
[<c0009710>] (do_one_initcall) from [<c05396b0>] (do_init_module+0x5c/0x1b8)
[<c05396b0>] (do_init_module) from [<c0086490>] (load_module+0xd34/0xed8)
[<c0086490>] (load_module) from [<c0086704>] (SyS_init_module+0xd0/0x120)
[<c0086704>] (SyS_init_module) from [<c000f480>] (ret_fast_syscall+0x0/0x3c)
---[ end trace 3be0e7b7dc6e3c4f ]---

Fixes: db916513 ("thermal: export weight to sysfs")
Acked-by: NJavi Merino <javi.merino@arm.com>
Signed-off-by: NViresh Kumar <viresh.kumar@linaro.org>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>

This patch adds the support for hisilicon thermal sensor, within
hisilicon SoC. there will register sensors for thermal framework
and use device tree to bind cooling device.
Signed-off-by: NLeo Yan <leo.yan@linaro.org>
Signed-off-by: Nkongxinwei <kong.kongxinwei@hisilicon.com>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>

Most code already uses consts for the struct kernel_param_ops,
sweep the kernel for the last offending stragglers. Other than
include/linux/moduleparam.h and kernel/params.c all other changes
were generated with the following Coccinelle SmPL patch. Merge
conflicts between trees can be handled with Coccinelle.

In the future git could get Coccinelle merge support to deal with
patch --> fail --> grammar --> Coccinelle --> new patch conflicts
automatically for us on patches where the grammar is available and
the patch is of high confidence. Consider this a feature request.

Test compiled on x86_64 against:

	* allnoconfig
	* allmodconfig
	* allyesconfig

@ const_found @
identifier ops;
@@

const struct kernel_param_ops ops = {
};

@ const_not_found depends on !const_found @
identifier ops;
@@

-struct kernel_param_ops ops = {
+const struct kernel_param_ops ops = {
};

Generated-by: Coccinelle SmPL
Cc: Rusty Russell <rusty@rustcorp.com.au>
Cc: Junio C Hamano <gitster@pobox.com>
Cc: Andrew Morton <akpm@linux-foundation.org>
Cc: Kees Cook <keescook@chromium.org>
Cc: Tejun Heo <tj@kernel.org>
Cc: Ingo Molnar <mingo@kernel.org>
Cc: cocci@systeme.lip6.fr
Cc: linux-kernel@vger.kernel.org
Signed-off-by: NLuis R. Rodriguez <mcgrof@suse.com>
Signed-off-by: NRusty Russell <rusty@rustcorp.com.au>

In order to avoid having each driver adding their own
specific DT property to specify slope and offset,
this patch adds a basic coefficient reading from
DT thermal zone node. Right now, as the thermal
framework does not support multiple sensors,
the current coefficients apply only to the only
sensor in the thermal zone.

The supported equation is a simple linear model:
	slope * <sensor reading> + offset.

slope and offset are read from the coefficients
DT property. In the same way as it is described in
the DT thermal binding.

So, as of today, the thermal framework will support
only cases like:
                /* hotspot = 1 * adc + 6000 */
		coefficients =          <1      6000>;
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>

It is common to have a linear extrapolation from
the current sensor readings and the actual temperature
value. This is specially the case when the sensor
is in use to extrapolate hotspots.

This patch adds slope and offset constants for
single sensor linear extrapolation equation. Because
the same sensor can be use in different locations,
from board to board, these constants are added
as part of thermal_zone_params.

The constants are available through sysfs.

It is up to the device driver to determine
the usage of these values.
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>

In situations where there is an uneven number of cooling devices, the
division of power among them can lead to a milliwatt being dropped on
the floor due to rounding errors.  This doesn't sound like a lot, but
some devices only grant the lowest cooling device state for their
maximum power.  So for instance, if the granted_power is the maximum
power and all devices are getting their maximum power, one would get
max_power - 1, making it choose cooling device state 1, instead of 0.

Round the division to make the calculation more accurate.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: NJavi Merino <javi.merino@arm.com>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>

Improve the Armada 380 thermal sensor accuracy by using updated formula.
The updated formula is:
Temperature[C degrees] = 0.4761 * tsen_vsen_out - 279.1
Signed-off-by: NNadav Haklai <nadavh@marvell.com>
Signed-off-by: NGregory CLEMENT <gregory.clement@free-electrons.com>
Cc: <stable@vger.kernel.org> #v3.16
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>

There is a copy and paste bug, "->clk" vs "->pclk", so we return the
wrong error code here.

Fixes: cbac8f63 ('thermal: rockchip: add driver for thermal')
Signed-off-by: NDan Carpenter <dan.carpenter@oracle.com>
Reviewed-by: NCaesar Wang <wxt@rock-chips.com>
Reviewed-by: NDoug Anderson <dianders@chromium.org>
Tested-by: NCaesar Wang <wxt@rock-chips.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

Package C8 to C10 was introduced in newer Intel CPUs, we need to
include them in the package c-state residency calculation.
Otherwise, idle injection target is not accurately maintained by
the closed control loop.

Also cleaned up the code to make it scale better with large number
of c-states.
Reported-by: NKristen Carlson Accardi <kristen@linux.intel.com>
Signed-off-by: NJacob Pan <jacob.jun.pan@linux.intel.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

Broadwell server has support for package C-states, idle injection works
as expected on this platform.
Signed-off-by: NJacob Pan <jacob.jun.pan@linux.intel.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

Mark the module init / exit functions with __init / __exit accodingly.
This allows making the intel_powerclamp_ids[] array __initconst, too, as
it only gets referenced from powerclamp_probe(). This is safe as
file2alias doesn't care about the section, but the symbol name for the
MODULE_DEVICE_TABLE alias.

Cc: Arjan van de Ven <arjan@linux.intel.com>
Cc: Jacob Pan <jacob.jun.pan@linux.intel.com>
Signed-off-by: NMathias Krause <minipli@googlemail.com>
Acked-by: NJacob Pan <jacob.jun.pan@linux.intel.com>
Acked-by: NJacob Pan <jacob.jun.pan@linux.intel.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

DESCRIPTION

Spurious Thermal Alert: Talert can happen randomly while the device remains
under the temperature limit defined for this event to trig. This spurious
event is caused by a incorrect re-synchronization between clock domains.
The comparison between configured threshold and current temperature value
can happen while the value is transitioning (metastable), thus causing
inappropriate event generation. No spurious event occurs as long as the
threshold value stays unchanged. Spurious event can be generated while a
thermal alert threshold is modified in
CONTROL_BANDGAP_THRESHOLD_MPU/GPU/CORE/DSPEVE/IVA_n.

WORKAROUND

Spurious event generation can be avoided by performing following sequence
when the threshold is modified:
1. Mask the hot/cold events at the thermal IP level.
2. Modify Threshold.
3. Unmask the hot/cold events at the thermal IP level.
Signed-off-by: NKeerthy <j-keerthy@ti.com>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>

Bandgap Temperature read Dtemp can be corrupted

DESCRIPTION
        Read accesses to registers listed below can be corrupted due to
	incorrect resynchronization between clock domains.

        Read access to registers below can be corrupted :
                • CTRL_CORE_DTEMP_MPU/GPU/CORE/DSPEVE/IVA_n (n = 0 to 4)
        • CTRL_CORE_TEMP_SENSOR_MPU/GPU/CORE/DSPEVE/IVA_n

WORKAROUND
    Multiple reads to CTRL_CORE_TEMP_SENSOR_MPU/GPU/CORE/DSPEVE/IVA[9:0]:
    BGAP_DTEMPMPU/GPU/CORE/DSPEVE/IVA is needed to discard false value and
    read right value:
       1. Perform two successive reads to BGAP_DTEMP bit field.
               (a) If read1 returns Val1 and read2 returns Val1, then
       	right value is Val1.
               (b) If read1 returns Val1, read 2 returns Val2, a third
       	read is needed.
       2. Perform third read
               (a) If read3 returns Val2 then right value is Val2.
               (b) If read3 returns Val3, then right value is Val3.

    The above in gist means if val1 and val2 are the same then we can go
    ahead with that value else we need a third read which will be right
    since synchronization will be complete by then.
Signed-off-by: NKeerthy <j-keerthy@ti.com>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>

This patch adds the support for Exynos5433's TMU (Thermal Management Unit).
Exynos5433 has a little different register bit fields as following description:
- Support the eight trip points for rising/falling interrupt by using two registers
- Read the calibration type (1-point or 2-point) and sensor id from TRIMINFO register
- Use a little different register address

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: Lukasz Majewski <l.majewski@samsung.com>
Signed-off-by: NChanwoo Choi <cw00.choi@samsung.com>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>

Ensure that the CPU for which the frequency is being requested
is online. If none of the CPUs are online the requested power is
returned as 0.
Acked-by: NJavi Merino <javi.merino@arm.com>
Signed-off-by: NKapileshwar Singh <kapileshwar.singh@arm.com>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>

It was initially understood that an update to the cpu_device
(cached in cpufreq_cooling_device) was required to ascertain the
correct operating point of the device on a cpufreq policy->cpu update
or creation or deletion of a cpufreq policy.
(e.g. when the existing policy CPU goes offline).

This update is not required and it is possible to ascertain the OPPs
from the leading CPU in a cpufreq domain even if the CPU is hotplugged out.

Fixes: e0128d8ab423 ("thermal: cpu_cooling: implement the power cooling device API")
Acked-by: NJavi Merino <javi.merino@arm.com>
Signed-off-by: NKapileshwar Singh <kapileshwar.singh@arm.com>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>

It's useful for tuning to be able to edit thermal_zone_parameters from
userspace.  Export them to the thermal_zone sysfs so that they can be
easily changed.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: NJavi Merino <javi.merino@arm.com>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>

We allocate the power_table in memory but we don't test whether the
allocation succeeded.  Return -ENOMEM if kcalloc() fails.

Fixes: e0128d8ab423 ("thermal: cpu_cooling: implement the power cooling device API")
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Reported-by: Nkbuild test robot <fengguang.wu@intel.com>
Signed-off-by: NJavi Merino <javi.merino@arm.com>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>

When periodic mode is not enabled, it is neccessary to force reads.
Signed-off-by: NPavel Machek <pavel@ucw.cz>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>

For omap3, proper implementation of eocz bit is needed. It was
actually a TODO in the driver.
Signed-off-by: NPavel Machek <pavel@ucw.cz>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>

Simplify code by removing goto's where they point to simple return.

Avoid confusing |= on error values.

Correct whitespace.
Signed-off-by: NPavel Machek <pavel@ucw.cz>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>

A previous version of this patch had a config for THERMAL_POWER_ACTOR
but it was dropped.  Remove the select as it is not doing anything.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Reported-by: NValentin Rothberg <valentinrothberg@gmail.com>
Signed-off-by: NJavi Merino <javi.merino@arm.com>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>

When registering a thermal zone from device tree, default the trip
points to writable. By default, only the root user can change these.

This allows the trip points to be tweaked after the system has
booted.

Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: NPunit Agrawal <punit.agrawal@arm.com>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>

Add a Kconfig option to allow system integrators to control whether
userspace tools can change trip temperatures. This option overrides
the thermal zone setup in the driver code and must be enabled for
platform specified writable trips to come into effect.

The original behaviour of requiring root privileges to change trip
temperatures remains unchanged.

Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: NPunit Agrawal <punit.agrawal@arm.com>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>

8754d5115693 ("thermal: introduce the Power Allocator governor") dropped
the const attribute in the struct thermal_zone_device.  That means that
the thermal_zone_params pointer passed to thermal_zone_device_register()
also lost the const qualifier.  Drop the const in x86_pkg_temp_thermal.c
as well to avoid the following warning as reported by the kbuild test
robot:

   drivers/thermal/x86_pkg_temp_thermal.c: In function 'pkg_temp_thermal_device_add':
>> drivers/thermal/x86_pkg_temp_thermal.c:450:31: warning: passing argument 6 of 'thermal_zone_device_register' discards 'const' qualifier from pointer target type
       phy_dev_entry, &tzone_ops, &pkg_temp_tz_params, 0, 0);
                                  ^
   In file included from drivers/thermal/x86_pkg_temp_thermal.c:30:0:
   include/linux/thermal.h:378:29: note: expected 'struct thermal_zone_params *' but argument is of type 'const struct thermal_zone_params *'
    struct thermal_zone_device *thermal_zone_device_register(const char *, int, int,
                                ^

Cc: Jean Delvare <jdelvare@suse.de>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: NJavi Merino <javi.merino@arm.com>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>

Introduce an optional property called, sustainable-power, which
represents the power (in mW) which the thermal zone can safely
dissipate.

If provided the property is parsed and associated with the thermal
zone via the thermal zone parameters.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: NPunit Agrawal <punit.agrawal@arm.com>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>

Add trace events for the power allocator governor and the power actor
interface of the cpu cooling device.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: Frederic Weisbecker <fweisbec@gmail.com>
Cc: Ingo Molnar <mingo@redhat.com>
Acked-by: NSteven Rostedt <rostedt@goodmis.org>
Signed-off-by: NJavi Merino <javi.merino@arm.com>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>

The power allocator governor is a thermal governor that controls system
and device power allocation to control temperature.  Conceptually, the
implementation divides the sustainable power of a thermal zone among
all the heat sources in that zone.

This governor relies on "power actors", entities that represent heat
sources.  They can report current and maximum power consumption and
can set a given maximum power consumption, usually via a cooling
device.

The governor uses a Proportional Integral Derivative (PID) controller
driven by the temperature of the thermal zone.  The output of the
controller is a power budget that is then allocated to each power
actor that can have bearing on the temperature we are trying to
control.  It decides how much power to give each cooling device based
on the performance they are requesting.  The PID controller ensures
that the total power budget does not exceed the control temperature.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: NPunit Agrawal <punit.agrawal@arm.com>
Signed-off-by: NJavi Merino <javi.merino@arm.com>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>

Add a basic power model to the cpu cooling device to implement the
power cooling device API.  The power model uses the current frequency,
current load and OPPs for the power calculations.  The cpus must have
registered their OPPs using the OPP library.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: NKapileshwar Singh <kapileshwar.singh@arm.com>
Signed-off-by: NPunit Agrawal <punit.agrawal@arm.com>
Signed-off-by: NJavi Merino <javi.merino@arm.com>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>

Add three optional callbacks to the cooling device interface to allow
them to express power.  In addition to the callbacks, add helpers to
identify cooling devices that implement the power cooling device API.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: NJavi Merino <javi.merino@arm.com>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>

A governor may need to store its current state between calls to
throttle().  That state depends on the thermal zone, so store it as
private data in struct thermal_zone_device.

The governors may have two new ops: bind_to_tz() and unbind_from_tz().
When provided, these functions let governors do some initialization
and teardown when they are bound/unbound to a tz and possibly store that
information in the governor_data field of the struct
thermal_zone_device.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: NJavi Merino <javi.merino@arm.com>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>

Add support for the temperature alarm peripheral found inside
Qualcomm plug-and-play (QPNP) PMIC chips. The temperature alarm
peripheral outputs a pulse on an interrupt line whenever the
thermal over temperature stage value changes.

Register a thermal sensor. The temperature reported by this thermal
sensor device should reflect the actual PMIC die temperature if an
ADC is present on the given PMIC. If no ADC is present, then the
reported temperature should be estimated from the over temperature
stage value.

Cc: David Collins <collinsd@codeaurora.org>
Signed-off-by: NIvan T. Ivanov <iivanov@mm-sol.com>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>

The fair share governor has the concept of weights, which is the
influence of each cooling device in a thermal zone.  The current
implementation forces the weights of all cooling devices in a thermal
zone to add up to a 100.  This complicates setups, as you need to know
in advance how many cooling devices you are going to have.  If you bind a
new cooling device, you have to modify all the other cooling devices
weights, which is error prone.  Furthermore, you can't specify a
"default" weight for platforms since that default value depends on the
number of cooling devices in the platform.

This patch generalizes the concept of weight by allowing any number to
be a "weight".  Weights are now relative to each other.  Platforms that
don't specify weights get the same default value for all their cooling
devices, so all their cdevs are considered to be equally influential.

It's important to note that previous users of the weights don't need to
alter the code: percentages continue to work as they used to.  This
patch just removes the constraint of all the weights in a thermal zone
having to add up to a 100.  If they do, you get the same behavior as
before.  If they don't, fair share now works for that platform.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: Durgadoss R <durgadoss.r@intel.com>
Acked-by: NDurgadoss R <durgadoss.r@intel.com>
Signed-off-by: NJavi Merino <javi.merino@arm.com>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>

It's useful to have access to the weights for the cooling devices for
thermal zones and change them if needed.  Export them to sysfs.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: NJavi Merino <javi.merino@arm.com>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>

s/asscciated/associated/

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: Durgadoss R <durgadoss.r@intel.com>
Reviewed-by: NDurgadoss R <durgadoss.r@intel.com>
Signed-off-by: NJavi Merino <javi.merino@arm.com>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>

The fair share governor is not usable with thermal zones that use the
bind op and don't populate thermal_zone_parameters, the majority of
them.  Now that the weight is in the thermal instance, we can use that
in the fair share governor to allow every thermal zone to trivially use
this governor.  Furthermore, this simplifies the code.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: Durgadoss R <durgadoss.r@intel.com>
Reviewed-by: NDurgadoss R <durgadoss.r@intel.com>
Signed-off-by: NJavi Merino <javi.merino@arm.com>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>

Currently you can specify the weight of the cooling device in the device
tree but that information is not populated to the
thermal_bind_params where the fair share governor expects it to
be.  The of thermal zone device doesn't have a thermal_bind_params
structure and arguably it's better to pass the weight inside the
thermal_instance as it is specific to the bind of a cooling device to a
thermal zone parameter.

Core thermal code is fixed to populate the weight in the instance from
the thermal_bind_params, so platform code that was passing the weight
inside the thermal_bind_params continue to work seamlessly.

While we are at it, create a default value for the weight parameter for
those thermal zones that currently don't define it and remove the
hardcoded default in of-thermal.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: "Rafael J. Wysocki" <rjw@rjwysocki.net>
Cc: Len Brown <lenb@kernel.org>
Cc: Peter Feuerer <peter@piie.net>
Cc: Darren Hart <dvhart@infradead.org>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: Kukjin Kim <kgene@kernel.org>
Cc: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: NKapileshwar Singh <kapileshwar.singh@arm.com>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>

Use the normal return values for bool functions
Signed-off-by: NJoe Perches <joe@perches.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

This patch enables intel_powerclamp driver to run on the
next-generation Intel(R) Xeon Phi Microarchitecture
code named "Knights Landing"
Signed-off-by: NDasaratharaman Chandramouli <dasaratharaman.chandramouli@intel.com>
Acked-by: NJacob Pan <jacob.jun.pan@linux.intel.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>