For memory boundaries safety, use strlcpy instead of strcpy.
Signed-off-by: NEduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

This patch exports the thermal_zone_get_temp API so that driver
writers can fetch temperature of thermal zones managed by other
drivers.
Acked-by: NDurgadoss R <durgadoss.r@intel.com>
Signed-off-by: NEduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

This patch adds a helper function to get a reference of
a thermal zone, based on the zone type name.

It will perform a zone name lookup and return a reference
to a thermal zone device that matches the name requested.
In case the zone is not found or when several zones match
same name or if the required parameters are invalid, it will return
the corresponding error code (ERR_PTR).

Cc: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: NEduardo Valentin <eduardo.valentin@ti.com>
Acked-by: NDurgadoss R <durgadoss.r@intel.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

The thermal governors are part of the thermal framework,
rather than a seperate feature/module.
Because the generic thermal layer can not work without
thermal governors, and it must load the thermal governors
during its initialization.

Build them into one module in this patch.

This also fix a problem that the generic thermal layer does not
work when CONFIG_THERMAL=m and CONFIG_THERMAL_GOV_XXX=y.
Signed-off-by: NZhang Rui <rui.zhang@intel.com>
Acked-by: NEduardo Valentin <eduardo.valentin@ti.com>
Acked-by: NDurgadoss R <durgadoss.r@intel.com>

this is the preparation work to build all the thermal core framework
source file, like governors, cpu cooling, etc, into one module.

No functional change in this patch.
Signed-off-by: NZhang Rui <rui.zhang@intel.com>
Acked-by: NEduardo Valentin <eduardo.valentin@ti.com>
Acked-by: NDurgadoss R <durgadoss.r@intel.com>

Convert to the much saner new idr interface.
Signed-off-by: NTejun Heo <tj@kernel.org>
Cc: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: NAndrew Morton <akpm@linux-foundation.org>
Signed-off-by: NLinus Torvalds <torvalds@linux-foundation.org>

The return code from the registration of the thermal class is used to
unallocate resources, but this failure isn't passed back to the caller of
thermal_init.  Return this failure back to the caller.

This bug was introduced in changeset 4cb18728 which overwrote the return code
when the variable was re-used to catch the return code of the registration of
the genetlink thermal socket family.
Signed-off-by: NRichard Guy Briggs <rbriggs@redhat.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

Signed-off-by: NZhang Rui <rui.zhang@intel.com>

This patch adds support to set the emulated temperature method in
thermal zone (sensor). After setting this feature thermal zone may
report this temperature and not the actual temperature. The emulation
implementation may be based on sensor capability through platform
specific handler or pure software emulation if no platform handler defined.

This is useful in debugging different temperature threshold and its
associated cooling action. Critical threshold's cannot be emulated.
Writing 0 on this node should disable emulation.
Signed-off-by: NAmit Daniel Kachhap <amit.daniel@samsung.com>
Acked-by: NKukjin Kim <kgene.kim@samsung.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

This patch adds an extra check in the data structure while registering
a thermal device. The check is to avoid registering zones with a number
of trips greater than zero, but with no .get_trip_temp nor .get_trip_type
callbacks. Receiving such data structure may end in wrong data access.
Signed-off-by: NEduardo Valentin <eduardo.valentin@ti.com>
Reviewed-by: NDurgadoss R <durgadoss.r@intel.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

Change the logging messages to used dev_* helper functions.
Signed-off-by: NEduardo Valentin <eduardo.valentin@ti.com>
Reviewed-by: NDurgadoss R <durgadoss.r@intel.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

No need for spinlocks in this file, then removing its header.
Signed-off-by: NEduardo Valentin <eduardo.valentin@ti.com>
Reviewed-by: NDurgadoss R <durgadoss.r@intel.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

This patch changes the function thermal_generate_netlink_event
to receive a thermal zone device instead of a originator id.

This way, the messages will always be bound to a thermal zone.
Signed-off-by: NEduardo Valentin <eduardo.valentin@ti.com>
Reviewed-by: NDurgadoss R <durgadoss.r@intel.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

[   12.761956] BUG: unable to handle kernel NULL pointer dereference at 0000000000000018
[   12.762016] IP: [<ffffffffa0005277>] handle_thermal_trip+0x47/0x130 [thermal_sys]
[   12.762060] PGD 1fec74067 PUD 1fee5b067 PMD 0
[   12.762127] Oops: 0000 [#1] SMP
[   12.762177] Modules linked in: hid_generic crc32c_intel usbhid hid firewire_ohci(+) e1000e(+) firewire_core crc_itu_t xhci_hcd(+) thermal(+) fan thermal_sys hwmon
[   12.762423] CPU 1
[   12.762443] Pid: 187, comm: modprobe Tainted: G       A     3.7.0-thermal-module+ #25                  /DH77DF
[   12.762496] RIP: 0010:[<ffffffffa0005277>]  [<ffffffffa0005277>] handle_thermal_trip+0x47/0x130 [thermal_sys]
[   12.762682] RSP: 0018:ffff8801fe7ddc18  EFLAGS: 00010282
[   12.762704] RAX: 0000000000000000 RBX: ffff8801ff3e9c00 RCX: ffff8801fdc39800
[   12.762728] RDX: ffff8801fe7ddc24 RSI: 0000000000000001 RDI: ffff8801ff3e9c00
[   12.762764] RBP: ffff8801fe7ddc48 R08: 0000000004000000 R09: ffffffffa001f568
[   12.762797] R10: ffffffff81363083 R11: 0000000000000001 R12: 0000000000000001
[   12.762832] R13: 0000000000000000 R14: 0000000000000001 R15: ffff8801fde73e68
[   12.762866] FS:  00007f5548516700(0000) GS:ffff88021f240000(0000) knlGS:0000000000000000
[   12.762912] CS:  0010 DS: 0000 ES: 0000 CR0: 0000000080050033
[   12.762946] CR2: 0000000000000018 CR3: 00000001fefe2000 CR4: 00000000001407e0
[   12.762979] DR0: 0000000000000000 DR1: 0000000000000000 DR2: 0000000000000000
[   12.763014] DR3: 0000000000000000 DR6: 00000000ffff0ff0 DR7: 0000000000000400
[   12.763048] Process modprobe (pid: 187, threadinfo ffff8801fe7dc000, task ffff8801fe5bdb40)
[   12.763095] Stack:
[   12.763122]  0000000000019640 00000000fdc39800 ffff8801fe7ddc48 ffff8801ff3e9c00
[   12.763225]  0000000000000002 0000000000000000 ffff8801fe7ddc78 ffffffffa00053e7
[   12.763338]  ffff8801ff3e9c00 0000000000006c98 ffffffffa0007480 ffff8801ff3e9c00
[   12.763440] Call Trace:
[   12.763470]  [<ffffffffa00053e7>] thermal_zone_device_update+0x77/0xa0 [thermal_sys]
[   12.763515]  [<ffffffffa0006d38>] thermal_zone_device_register+0x788/0xa88 [thermal_sys]
[   12.763562]  [<ffffffffa001f394>] acpi_thermal_add+0x360/0x4c8 [thermal]
[   12.763598]  [<ffffffff8133902a>] acpi_device_probe+0x50/0x190
[   12.763632]  [<ffffffff811bd793>] ? sysfs_create_link+0x13/0x20
[   12.763666]  [<ffffffff813cc41b>] driver_probe_device+0x7b/0x240
[   12.763699]  [<ffffffff813cc68b>] __driver_attach+0xab/0xb0
[   12.763732]  [<ffffffff813cc5e0>] ? driver_probe_device+0x240/0x240
[   12.763766]  [<ffffffff813ca836>] bus_for_each_dev+0x56/0x90
[   12.763799]  [<ffffffff813cbf4e>] driver_attach+0x1e/0x20
[   12.763831]  [<ffffffff813cbac0>] bus_add_driver+0x190/0x290
[   12.763864]  [<ffffffffa0022000>] ? 0xffffffffa0021fff
[   12.763896]  [<ffffffff813ccbea>] driver_register+0x7a/0x160
[   12.763928]  [<ffffffffa0022000>] ? 0xffffffffa0021fff
[   12.763960]  [<ffffffff813399fb>] acpi_bus_register_driver+0x43/0x45
[   12.763995]  [<ffffffffa002203a>] acpi_thermal_init+0x3a/0x42 [thermal]
[   12.764029]  [<ffffffff8100207f>] do_one_initcall+0x3f/0x170
[   12.764063]  [<ffffffff810b1a5f>] sys_init_module+0x8f/0x200
[   12.764097]  [<ffffffff815ff259>] system_call_fastpath+0x16/0x1b
[   12.764129] Code: 48 8b 87 c8 02 00 00 41 89 f4 48 8d 55 dc ff 50 28 44 8b 6d dc 41 8d 45 fe 83 f8 01 76 5e 48 8b 83 d8 02 00 00 44 89 e6 48 89 df <ff> 50 18 4c 8d a3 10 03 00 00 4c 89 e7 e8 87 f1 5e e1 8b 83 bc
[   12.765164] RIP  [<ffffffffa0005277>] handle_thermal_trip+0x47/0x130 [thermal_sys]
[   12.765223]  RSP <ffff8801fe7ddc18>
[   12.765252] CR2: 0000000000000018
[   12.765284] ---[ end trace 7723294cdfb00d2a ]---

This is because thermal_zone_device_update() is invoked before
any thermal governors being registered.
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

This patch fixes the following mutex and NULL pointer
problems in thermal_sys.c:

 * mutex_unlock fix in update_temperature function
 * mutex_unlock fix in bind_cdev function
 * Correct early return to continue in bind_cdev function
 * NULL check fix in bind_cdev function
 * NULL check fix in bind_tz function
Reported-by: NDan Carpenter <dan.carpenter@oracle.com>
Reported-by: NSedat Dilek <sedat.dilek@gmail.com>
Reported-by: NHugh Dickins <hughd@google.com>
Signed-off-by: NDurgadoss R <durgadoss.r@intel.com>
Signed-off-by: NSedat Dilek <sedat.dilek@gmail.com>
Signed-off-by: NHugh Dickins <hughd@google.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

This patch adds a notification API which the sensor drivers'
can use to notify the framework. The framework then takes
care of the throttling according to the configured policy.
Signed-off-by: NDurgadoss R <durgadoss.r@intel.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

This patch removes the throttling logic out of
thermal_sys.c; also refactors the code into smaller
functions so that are easy to read/maintain.
 * Seperates the handling of critical and non-critical trips
 * Re-arranges the set_polling and device_check methods, so
   that all related functions are arranged in one place.
 * Removes the 'do_update' and 'trip_update' method, as part
   of moving the throttling logic out of thermal_sys.c
Signed-off-by: NDurgadoss R <durgadoss.r@intel.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

This patch makes the thermal_cdev_update function as a
global one, so that other files can use it. This function
serves as a single arbitrator to set the state of a cooling
device.
Signed-off-by: NDurgadoss R <durgadoss.r@intel.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

This patch updates the binding logic in thermal_sys.c
It uses the platform layer data to bind a thermal zone
to a cdev for a particular trip point.

 * If we do not have platform data and do not have
   .bind defined, do not bind.
 * If we do not have platform data but .bind is
   defined, then use tz->ops->bind.
 * If we have platform data, use it to create binding.

The same logic sequence is followed for unbind also.
Signed-off-by: NDurgadoss R <durgadoss.r@intel.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

This patch adds a policy sysfs attribute to a thermal zone.
This attribute denotes the throttling governor used for the
zone. This is a RW attribute.
Signed-off-by: NDurgadoss R <durgadoss.r@intel.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

This patch creates a structure to hold platform
thermal governor information, and provides APIs
for individual thermal governors to register/unregister
with the Thermal framework.
Signed-off-by: NDurgadoss R <durgadoss.r@intel.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

This patch adds the thermal zone parameter as an argument to
the tzd_register() function call; and updates other drivers
using this function.
Signed-off-by: NDurgadoss R <durgadoss.r@intel.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

This patch adds the following API's to thermal_sys.c, that
can be used by other Thermal drivers.
 * get_tz_trend: obtain the trend of the given thermal zone
 * get_thermal_instance: obtain the instance corresponding
   to the given tz, cdev and the trip point.
Signed-off-by: NDurgadoss R <durgadoss.r@intel.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

This patch creates a thermal_core.h file which can contain
all defines used by the core thermal framework files. For
now, move the thermal_instance structure to thermal_core.h
This structure is used by files under drivers/thermal/.
Signed-off-by: NDurgadoss R <durgadoss.r@intel.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

To avoid name conflicts:

  drivers/video/riva/fbdev.c:281:9: sparse: preprocessor token MAX_LEVEL redefined

While at it, also make the other names more consistent and add
parentheses.

[akpm@linux-foundation.org: repair fallout]
[sfr@canb.auug.org.au: IB/mlx4: fix for MAX_ID_MASK to MAX_IDR_MASK name change]
Signed-off-by: NFengguang Wu <fengguang.wu@intel.com>
Cc: Bernd Petrovitsch <bernd@petrovitsch.priv.at>
Cc: walter harms <wharms@bfs.de>
Cc: Glauber Costa <glommer@parallels.com>
Signed-off-by: NStephen Rothwell <sfr@canb.auug.org.au>
Cc: Roland Dreier <roland@purestorage.com>
Signed-off-by: NAndrew Morton <akpm@linux-foundation.org>
Signed-off-by: NLinus Torvalds <torvalds@linux-foundation.org>

The type parameter in thermal_zone_device_register and
thermal_cooling_device_register can be NULL, indicating that no sysfs attribute
for the type should be created. Only call strlen() and strcpy() on type if it is
not NULL.

This patch addresses Coverity #102180 and #102182: Dereference before null check
Signed-off-by: NGuenter Roeck <linux@roeck-us.net>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

temp_crit.name and temp_input.name have a length of 16 bytes.  Using
THERMAL_NAME_LENGTH (20) as length parameter for snprintf() may result in
out-of-bounds memory accesses.  Replace it with sizeof().

Addresses Coverity #115679
Signed-off-by: NGuenter Roeck <linux@roeck-us.net>
Cc: Len Brown <lenb@kernel.org>
Cc: "Brown, Len" <len.brown@intel.com>
Signed-off-by: NAndrew Morton <akpm@linux-foundation.org>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

we need to go over all the thermal_instance list of a cooling device
to decide which cooling state to put the cooling device to.

But at this time, as a cooling device may be referenced in multiple
thermal zones, we need to lock the list first in case
another thermal zone is updating this cooling device.
Signed-off-by: NZhang Rui <rui.zhang@intel.com>
Reviewed-by: NRafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: NEduardo Valentin <eduardo.valentin@ti.com>

Remove thermal_zone_device_passive(). And use
thermal_zone_trip_update() and thermal_zone_do_update()
for both active and passive cooling.
Signed-off-by: NZhang Rui <rui.zhang@intel.com>
Reviewed-by: NRafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: NEduardo Valentin <eduardo.valentin@ti.com>

This fixes the problem that a cooling device may be referenced by
by multiple trip points in multiple thermal zones.

With this patch, we have two stages for updating a thermal zone,
1. check if a thermal_instance needs to be updated or not
2. update the cooling device, based on the target cooling state
   of all its instances.

Note that, currently, the cooling device is set to the deepest
cooling state required.
Signed-off-by: NZhang Rui <rui.zhang@intel.com>
Reviewed-by: NRafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: NEduardo Valentin <eduardo.valentin@ti.com>

List thermal_instance in thermal_cooling_device so that
cooling device can know the cooling state requirement
of all the thermal instances.
Signed-off-by: NZhang Rui <rui.zhang@intel.com>
Reviewed-by: NRafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: NEduardo Valentin <eduardo.valentin@ti.com>

thermal_instance should be referenced by both thermal zone devices
and thermal cooling devices.

Rename thermal_instance.node to thermal_instance.tz_node in this patch
and thermal_instanace.cdev_node will be introduced in next patch.
Signed-off-by: NZhang Rui <rui.zhang@intel.com>
Reviewed-by: NRafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: NEduardo Valentin <eduardo.valentin@ti.com>

Rename thermal_zone_device.cooling_devices
to thermal_zone_device.thermal_instances

thermal_zone_device.cooling_devices is not accurate
as this is a list for thermal instances, rather than cooling devices.
Signed-off-by: NZhang Rui <rui.zhang@intel.com>
Reviewed-by: NRafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: NEduardo Valentin <eduardo.valentin@ti.com>

This struct is used to describe the behavior for a thermal
cooling device on a certain trip point for a certain thremal zone.

thermal_cooling_device_instance is not accurate, as a cooling device
can be used for more than one trip point in one thermal zone device.
Signed-off-by: NZhang Rui <rui.zhang@intel.com>
Reviewed-by: NRafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: NEduardo Valentin <eduardo.valentin@ti.com>

This function is used to update the cooling state of
all the cooling devices that are bound to an active trip point.

This will be used for passive cooling as well, in the future patches.
as both active and passive cooling can share the same algorithm,
which is

1. if the temperature is higher than a trip point,
   a. if the trend is THERMAL_TREND_RAISING, use higher cooling
      state for this trip point
   b. if the trend is THERMAL_TREND_DROPPING, use lower cooling
      state for this trip point

2. if the temperature is lower than a trip point, use lower
   cooling state for this trip point.
Signed-off-by: NZhang Rui <rui.zhang@intel.com>
Reviewed-by: NRafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: NEduardo Valentin <eduardo.valentin@ti.com>

Remove tc1/tc2 in generic thermal layer.
.get_trend() callback starts to take effect from this patch.
Signed-off-by: NZhang Rui <rui.zhang@intel.com>
Reviewed-by: NRafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: NValentin, Eduardo <eduardo.valentin@ti.com>

According to ACPI spec, tc1 and tc2 are used by OSPM
to anticipate the temperature trends.
We introduced the same concept to the generic thermal layer
for passive cooling, but now it seems that these values
are hard to be used on other platforms.

So We introduce .get_trend() as a more general solution.

For the platform thermal drivers that have their own way to
anticipate the temperature trends, they should provide
their own .get_trend() callback.
Or else, we will calculate the temperature trends by simply
comparing the current temperature and the cached previous
temperature reading.
Signed-off-by: NZhang Rui <rui.zhang@intel.com>
Reviewed-by: NRafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: NValentin, Eduardo <eduardo.valentin@ti.com>

set upper and lower limits when binding
a thermal cooling device to a thermal zone device.
Signed-off-by: NZhang Rui <rui.zhang@intel.com>
Reviewed-by: NRafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: NEduardo Valentin <eduardo.valentin@ti.com>

As the active cooling devices can have multiple cooling states,
we may want only several cooling states for a certain trip point,
and other cooling states for other active trip points.

To do this, we should be able to describe the cooling device
behavior for a certain trip point, rather than for the entire thermal zone.
And when updating thermal zone, we need to check the upper and lower limit
to make sure the cooling device is set to the proper cooling state.

Note that this patch will not bring any different behavior as
upper limit is set to max_state and lower limit is set to 0
in this patch, for now.

Next patch will set these to real values.
Signed-off-by: NZhang Rui <rui.zhang@intel.com>
Reviewed-by: NRafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: NEduardo Valentin <eduardo.valentin@ti.com>

This is because general active cooling devices, like fans,
may have multiple speeds, which can be mapped to different cooling states.
Signed-off-by: NZhang Rui <rui.zhang@intel.com>
Reviewed-by: NRafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: NValentin, Eduardo <eduardo.valentin@ti.com>