The fair share governor has the concept of weights, which is the
influence of each cooling device in a thermal zone.  The current
implementation forces the weights of all cooling devices in a thermal
zone to add up to a 100.  This complicates setups, as you need to know
in advance how many cooling devices you are going to have.  If you bind a
new cooling device, you have to modify all the other cooling devices
weights, which is error prone.  Furthermore, you can't specify a
"default" weight for platforms since that default value depends on the
number of cooling devices in the platform.

This patch generalizes the concept of weight by allowing any number to
be a "weight".  Weights are now relative to each other.  Platforms that
don't specify weights get the same default value for all their cooling
devices, so all their cdevs are considered to be equally influential.

It's important to note that previous users of the weights don't need to
alter the code: percentages continue to work as they used to.  This
patch just removes the constraint of all the weights in a thermal zone
having to add up to a 100.  If they do, you get the same behavior as
before.  If they don't, fair share now works for that platform.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: Durgadoss R <durgadoss.r@intel.com>
Acked-by: NDurgadoss R <durgadoss.r@intel.com>
Signed-off-by: NJavi Merino <javi.merino@arm.com>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>

Currently you can specify the weight of the cooling device in the device
tree but that information is not populated to the
thermal_bind_params where the fair share governor expects it to
be.  The of thermal zone device doesn't have a thermal_bind_params
structure and arguably it's better to pass the weight inside the
thermal_instance as it is specific to the bind of a cooling device to a
thermal zone parameter.

Core thermal code is fixed to populate the weight in the instance from
the thermal_bind_params, so platform code that was passing the weight
inside the thermal_bind_params continue to work seamlessly.

While we are at it, create a default value for the weight parameter for
those thermal zones that currently don't define it and remove the
hardcoded default in of-thermal.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: "Rafael J. Wysocki" <rjw@rjwysocki.net>
Cc: Len Brown <lenb@kernel.org>
Cc: Peter Feuerer <peter@piie.net>
Cc: Darren Hart <dvhart@infradead.org>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: Kukjin Kim <kgene@kernel.org>
Cc: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: NKapileshwar Singh <kapileshwar.singh@arm.com>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>

When CONFIG_THERMAL is not enabled, it is better to introduce
equivalent dummy functions in the exported header than to
introduce #ifdeffery in drivers using the function.

This will prevent issues such as that reported in:
http://www.spinics.net/lists/linux-next/msg31573.html

While at it switch over to IS_ENABLED for thermal macros
to allow for thermal framework to be built as framework
and relevant APIs be usable by relevant drivers as a result.
Reported-by: NGuenter Roeck <linux@roeck-us.net>
Signed-off-by: NNishanth Menon <nm@ti.com>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>

The size of unsigned long varies between 32 and 64 bit systems while
the size of phandle arguments is always 32 bits per parameter.

On 64-bit systems, cooling devices registered via of-thermal apis fail
to bind when the min/max cooling state is specified as
THERMAL_NO_LIMIT (-1UL) as there is a mis-match between the value read
from the device tree (32bit) and the pre-processor define (64bit).

As we're unlikely to need cooling states larger than 32 bits, and for
consistency with the size of phandle arguments, explicitly limit
THERMAL_NO_LIMIT to 32 bits.
Reported-by: NHyungwoo Yang <hwoo.yang@gmail.com>
Acked-by: NZhang Rui <rui.zhang@intel.com>
Signed-off-by: NPunit Agrawal <punit.agrawal@arm.com>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>

include/linux/thermal.h contains definitions for the Thermal generic
netlink family, but none of the valuable information relevant to
user-space such as the Genl family name, multicast group, version or
command set and data types is exported to user-space.

Export all the relevant generic netlink information to user-space to
make this genl family usable by user-space, and while at it, export
THERMAL_NAME_LENGTH since it limits name length for thermal_hwmon
devices.

Kbuild and MAINTAINERS are also updated accordingly to reflect this new
file: include/uapi/linux/thermal.h.
Signed-off-by: NFlorian Fainelli <f.fainelli@gmail.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

Before this change it was only possible to set get_temp() and get_trend()
methods to be used in the common code handling passing parameters via
device tree to "cpu-thermal" CPU thermal zone device.

Now it is possible to also set emulated value of temperature for debug
purposes.
Signed-off-by: NLukasz Majewski <l.majewski@samsung.com>
Acked-by: NEduardo Valentin <edubezval@gmail.com>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>

This patch changes name of struct __thermal_trip to thermal_trip and moves
declaration of the latter to ./include/linux/thermal.h for better visibility.
Signed-off-by: NLukasz Majewski <l.majewski@samsung.com>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>

Different drivers request API extensions in of-thermal. For this reason,
additional callbacks are required to fit the new drivers needs.

The current API implementation expects the registering sensor driver
to provide a get_temp and get_trend callbacks as function parameters.
As the amount of callbacks is growing, this patch changes the existing
implementation to use a .ops field to hold all the of thermal callbacks
to sensor drivers.

This patch also changes the existing of-thermal users to fit the new
API design. No functional change is introduced in this patch.

Cc: Alexandre Courbot <gnurou@gmail.com>
Cc: devicetree@vger.kernel.org
Cc: Grant Likely <grant.likely@linaro.org>
Cc: Guenter Roeck <linux@roeck-us.net>
Cc: Jean Delvare <jdelvare@suse.de>
Cc: linux-kernel@vger.kernel.org
Cc: linux-pm@vger.kernel.org
Cc: linux-tegra@vger.kernel.org
Cc: lm-sensors@lm-sensors.org
Cc: Rob Herring <robh+dt@kernel.org>
Cc: Stephen Warren <swarren@wwwdotorg.org>
Cc: Thierry Reding <thierry.reding@gmail.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Acked-by: NGuenter Roeck <linux@roeck-us.net>
Tested-by: NMikko Perttunen <mikko.perttunen@kapsi.fi>
Reviewed-by: NMikko Perttunen <mikko.perttunen@kapsi.fi>
Reviewed-by: NAlexandre Courbot <acourbot@nvidia.com>
Reviewed-by: NLukasz Majewski <l.majewski@samsung.com>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>

ACPI INT3402 device object could report temperature for the memory module.
To expose such information to user space, a thermal zone device is registered
for it so that the thermal sysfs interface can expose such information for
userspace to use.
Signed-off-by: NAaron Lu <aaron.lu@intel.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

This macro can be used by other component so move it to a common header,
but in a slightly different way: define two macros, one macro with an
offset and the other doesn't.
Signed-off-by: NAaron Lu <aaron.lu@intel.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

Document struct thermal_zone_device and struct thermal_governor fields
and their use by the thermal framework code.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: NJavi Merino <javi.merino@arm.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

This patch adds a new API to allow registering cooling devices
in the thermal framework derived from device tree nodes.

This API links the cooling device with the device tree node
so that binding with thermal zones is possible, given
that thermal zones are pointing to cooling device
device tree nodes.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: NEduardo Valentin <eduardo.valentin@ti.com>

This patch introduces a device tree bindings for
describing the hardware thermal behavior and limits.
Also a parser to read and interpret the data and feed
it in the thermal framework is presented.

This patch introduces a thermal data parser for device
tree. The parsed data is used to build thermal zones
and thermal binding parameters. The output data
can then be used to deploy thermal policies.

This patch adds also documentation regarding this
API and how to define tree nodes to use
this infrastructure.

Note that, in order to be able to have control
on the sensor registration on the DT thermal zone,
it was required to allow changing the thermal zone
.get_temp callback. For this reason, this patch
also removes the 'const' modifier from the .ops
field of thermal zone devices.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Acked-by: NMark Rutland <mark.rutland@arm.com>
Signed-off-by: NEduardo Valentin <eduardo.valentin@ti.com>

When registering a thermal zone device using platform information
via bind_params, the thermal framework will always perform the
cdev binding using the lowest and highest limits (THERMAL_NO_LIMIT).

This patch changes the data structures so that it is possible
to inform what are the desired limits for each trip point
inside a bind_param. The way the binding is performed is also
changed so that it uses the new data structure.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: NEduardo Valentin <eduardo.valentin@ti.com>

When registering a new thermal_device, the thermal framework
will always add a hwmon sysfs interface.

This patch adds a flag to make this behavior optional. Now
when registering a new thermal device, the caller can
optionally inform if hwmon interface is desirable. This can
be done by means of passing a thermal_zone_params.no_hwmon == true.

In order to keep same behavior as of today, all current
calls will by default create the hwmon interface.

Cc: David Woodhouse <dwmw2@infradead.org>
Cc: linux-acpi@vger.kernel.org
Cc: linux-arm-kernel@lists.infradead.org
Cc: linux-kernel@vger.kernel.org
Cc: linux-pm@vger.kernel.org
Cc: Zhang Rui <rui.zhang@intel.com>
Suggested-by: NWei Ni <wni@nvidia.com>
Signed-off-by: NEduardo Valentin <eduardo.valentin@ti.com>

To follow the prefix names used by the thermal functions,
this patch renames notify_thermal_framework to thermal_notify_framework.
Signed-off-by: NEduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

This patch exports the thermal_zone_get_temp API so that driver
writers can fetch temperature of thermal zones managed by other
drivers.
Acked-by: NDurgadoss R <durgadoss.r@intel.com>
Signed-off-by: NEduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

This patch adds a helper function to get a reference of
a thermal zone, based on the zone type name.

It will perform a zone name lookup and return a reference
to a thermal zone device that matches the name requested.
In case the zone is not found or when several zones match
same name or if the required parameters are invalid, it will return
the corresponding error code (ERR_PTR).

Cc: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: NEduardo Valentin <eduardo.valentin@ti.com>
Acked-by: NDurgadoss R <durgadoss.r@intel.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

The thermal governors are part of the thermal framework,
rather than a seperate feature/module.
Because the generic thermal layer can not work without
thermal governors, and it must load the thermal governors
during its initialization.

Build them into one module in this patch.

This also fix a problem that the generic thermal layer does not
work when CONFIG_THERMAL=m and CONFIG_THERMAL_GOV_XXX=y.
Signed-off-by: NZhang Rui <rui.zhang@intel.com>
Acked-by: NEduardo Valentin <eduardo.valentin@ti.com>
Acked-by: NDurgadoss R <durgadoss.r@intel.com>

The following warning is obtained when CONFIG_NET is not defined:

In file included from drivers/thermal/mvebu_thermal.c:27:0:
include/linux/thermal.h:254:12: warning: 'thermal_generate_netlink_event'
defined but not used [-Wunused-function]

This patch fixes the warning by properly inlining
thermal_generate_netlink_event().
Signed-off-by: NEzequiel Garcia <ezequiel.garcia@free-electrons.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

Signed-off-by: NZhang Rui <rui.zhang@intel.com>
Tested-by: NAmit Daniel kachhap <amit.daniel@samsung.com>

The original name is too long.
Signed-off-by: NMasatake YAMATO <yamato@redhat.com>
Signed-off-by: NDavid S. Miller <davem@davemloft.net>

This patch adds support to set the emulated temperature method in
thermal zone (sensor). After setting this feature thermal zone may
report this temperature and not the actual temperature. The emulation
implementation may be based on sensor capability through platform
specific handler or pure software emulation if no platform handler defined.

This is useful in debugging different temperature threshold and its
associated cooling action. Critical threshold's cannot be emulated.
Writing 0 on this node should disable emulation.
Signed-off-by: NAmit Daniel Kachhap <amit.daniel@samsung.com>
Acked-by: NKukjin Kim <kgene.kim@samsung.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

This patch changes the function thermal_generate_netlink_event
to receive a thermal zone device instead of a originator id.

This way, the messages will always be bound to a thermal zone.
Signed-off-by: NEduardo Valentin <eduardo.valentin@ti.com>
Reviewed-by: NDurgadoss R <durgadoss.r@intel.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

These two new thermal_trend types are used to tell the governor
that the temeprature is raising/dropping quickly.

Thermal cooling governors should handle this situation and make
proper decisions, e.g. set cooling state to upper/lower limit directly
instead of one step each time.
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

Fix DEFAULT_THERMAL_GOVERNOR to be consistant with the
default governor selected in kernel config file.
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

This patch adds a notification API which the sensor drivers'
can use to notify the framework. The framework then takes
care of the throttling according to the configured policy.
Signed-off-by: NDurgadoss R <durgadoss.r@intel.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

This patch makes the thermal_cdev_update function as a
global one, so that other files can use it. This function
serves as a single arbitrator to set the state of a cooling
device.
Signed-off-by: NDurgadoss R <durgadoss.r@intel.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

This patch creates a structure to hold platform
thermal governor information, and provides APIs
for individual thermal governors to register/unregister
with the Thermal framework.
Signed-off-by: NDurgadoss R <durgadoss.r@intel.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

This patch adds the thermal zone parameter as an argument to
the tzd_register() function call; and updates other drivers
using this function.
Signed-off-by: NDurgadoss R <durgadoss.r@intel.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

This patch adds platform level information to thermal.h
by introducing two structures to hold:
 * bind parameters for a thermal zone,
 * zone level platform parameters
Signed-off-by: NDurgadoss R <durgadoss.r@intel.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

This patch adds the following API's to thermal_sys.c, that
can be used by other Thermal drivers.
 * get_tz_trend: obtain the trend of the given thermal zone
 * get_thermal_instance: obtain the instance corresponding
   to the given tz, cdev and the trip point.
Signed-off-by: NDurgadoss R <durgadoss.r@intel.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

This patch rearranges the code in thermal.h file,
in the following order, so that it is easy to
read/maintain.
1. All #defines
2. All enums
3. All fops structures
4. All device structures
5. All function declarations
Signed-off-by: NDurgadoss R <durgadoss.r@intel.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

we need to go over all the thermal_instance list of a cooling device
to decide which cooling state to put the cooling device to.

But at this time, as a cooling device may be referenced in multiple
thermal zones, we need to lock the list first in case
another thermal zone is updating this cooling device.
Signed-off-by: NZhang Rui <rui.zhang@intel.com>
Reviewed-by: NRafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: NEduardo Valentin <eduardo.valentin@ti.com>

Remove thermal_zone_device_passive(). And use
thermal_zone_trip_update() and thermal_zone_do_update()
for both active and passive cooling.
Signed-off-by: NZhang Rui <rui.zhang@intel.com>
Reviewed-by: NRafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: NEduardo Valentin <eduardo.valentin@ti.com>

This fixes the problem that a cooling device may be referenced by
by multiple trip points in multiple thermal zones.

With this patch, we have two stages for updating a thermal zone,
1. check if a thermal_instance needs to be updated or not
2. update the cooling device, based on the target cooling state
   of all its instances.

Note that, currently, the cooling device is set to the deepest
cooling state required.
Signed-off-by: NZhang Rui <rui.zhang@intel.com>
Reviewed-by: NRafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: NEduardo Valentin <eduardo.valentin@ti.com>

List thermal_instance in thermal_cooling_device so that
cooling device can know the cooling state requirement
of all the thermal instances.
Signed-off-by: NZhang Rui <rui.zhang@intel.com>
Reviewed-by: NRafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: NEduardo Valentin <eduardo.valentin@ti.com>

Rename thermal_zone_device.cooling_devices
to thermal_zone_device.thermal_instances

thermal_zone_device.cooling_devices is not accurate
as this is a list for thermal instances, rather than cooling devices.
Signed-off-by: NZhang Rui <rui.zhang@intel.com>
Reviewed-by: NRafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: NEduardo Valentin <eduardo.valentin@ti.com>

Remove tc1/tc2 in generic thermal layer.
.get_trend() callback starts to take effect from this patch.
Signed-off-by: NZhang Rui <rui.zhang@intel.com>
Reviewed-by: NRafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: NValentin, Eduardo <eduardo.valentin@ti.com>

According to ACPI spec, tc1 and tc2 are used by OSPM
to anticipate the temperature trends.
We introduced the same concept to the generic thermal layer
for passive cooling, but now it seems that these values
are hard to be used on other platforms.

So We introduce .get_trend() as a more general solution.

For the platform thermal drivers that have their own way to
anticipate the temperature trends, they should provide
their own .get_trend() callback.
Or else, we will calculate the temperature trends by simply
comparing the current temperature and the cached previous
temperature reading.
Signed-off-by: NZhang Rui <rui.zhang@intel.com>
Reviewed-by: NRafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: NValentin, Eduardo <eduardo.valentin@ti.com>