This patch adds the support for hisilicon thermal sensor, within
hisilicon SoC. there will register sensors for thermal framework
and use device tree to bind cooling device.
Signed-off-by: NLeo Yan <leo.yan@linaro.org>
Signed-off-by: Nkongxinwei <kong.kongxinwei@hisilicon.com>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>

A previous version of this patch had a config for THERMAL_POWER_ACTOR
but it was dropped.  Remove the select as it is not doing anything.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Reported-by: NValentin Rothberg <valentinrothberg@gmail.com>
Signed-off-by: NJavi Merino <javi.merino@arm.com>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>

Add a Kconfig option to allow system integrators to control whether
userspace tools can change trip temperatures. This option overrides
the thermal zone setup in the driver code and must be enabled for
platform specified writable trips to come into effect.

The original behaviour of requiring root privileges to change trip
temperatures remains unchanged.

Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: NPunit Agrawal <punit.agrawal@arm.com>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>

The power allocator governor is a thermal governor that controls system
and device power allocation to control temperature.  Conceptually, the
implementation divides the sustainable power of a thermal zone among
all the heat sources in that zone.

This governor relies on "power actors", entities that represent heat
sources.  They can report current and maximum power consumption and
can set a given maximum power consumption, usually via a cooling
device.

The governor uses a Proportional Integral Derivative (PID) controller
driven by the temperature of the thermal zone.  The output of the
controller is a power budget that is then allocated to each power
actor that can have bearing on the temperature we are trying to
control.  It decides how much power to give each cooling device based
on the performance they are requesting.  The PID controller ensures
that the total power budget does not exceed the control temperature.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: NPunit Agrawal <punit.agrawal@arm.com>
Signed-off-by: NJavi Merino <javi.merino@arm.com>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>

Add support for the temperature alarm peripheral found inside
Qualcomm plug-and-play (QPNP) PMIC chips. The temperature alarm
peripheral outputs a pulse on an interrupt line whenever the
thermal over temperature stage value changes.

Register a thermal sensor. The temperature reported by this thermal
sensor device should reflect the actual PMIC die temperature if an
ADC is present on the given PMIC. If no ADC is present, then the
reported temperature should be estimated from the over temperature
stage value.

Cc: David Collins <collinsd@codeaurora.org>
Signed-off-by: NIvan T. Ivanov <iivanov@mm-sol.com>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>

Thermal is TS-ADC Controller module supports
user-defined mode and automatic mode.

User-defined mode refers,TSADC all the control signals entirely by
software writing to register for direct control.

Automaic mode refers to the module automatically poll TSADC output,
and the results were checked.If you find that the temperature High
in a period of time,an interrupt is generated to the processor
down-measures taken;If the temperature over a period of time High,
the resulting TSHUT gave CRU module,let it reset the entire chip,
or via GPIO give PMIC.
Signed-off-by: Nzhaoyifeng <zyf@rock-chips.com>
Signed-off-by: NCaesar Wang <caesar.wang@rock-chips.com>
Reviewed-by: NDmitry Torokhov <dmitry.torokhov@gmail.com>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>

This adds support for the Tegra SOCTHERM thermal sensing and management
system found in the Tegra124 system-on-chip. This initial driver supports
temperature polling for four thermal zones.
Signed-off-by: NMikko Perttunen <mperttunen@nvidia.com>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>

This patch introduces a new thermal cooling device based on common clock
framework. The original motivation to write this cooling device is to be
able to cool down thermal zones using clocks that feed co-processors, such
as GPUs, DSPs, Image Processing Co-processors, etc. But it is written
in a way that it can be used on top of any clock.

The implementation is pretty straight forward. The code creates
a thermal cooling device based on a pair of a struct device and a clock name.
The struct device is assumed to be usable by the OPP layer. The OPP layer
is used as source of the list of possible frequencies. The (cpufreq) frequency
table is then used as a map from frequencies to cooling states. Cooling
states are indexes to the frequency table.

The logic sits on top of common clock framework, specifically on clock
pre notifications. Any PRE_RATE_CHANGE is hijacked, and the transition is
only allowed when the new rate is within the thermal limit (cooling state -> freq).

When a thermal cooling device state transition is requested, the clock
is also checked to verify if the current clock rate is within the new
thermal limit.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Mike Turquette <mturquette@linaro.org>
Cc: Nishanth Menon <nm@ti.com>
Cc: Pavel Machek <pavel@ucw.cz>
Cc: "Rafael J. Wysocki" <rjw@sisk.pl>
Cc: Len Brown <len.brown@intel.com>
Cc: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
Cc: linux-pm@vger.kernel.org
Cc: linux-arm-kernel@lists.infradead.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: NEduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>

we share the same driver for both ACPI predefined Fan device
and INT3404 Fan device, thus we should select the ACPI Fan
driver when int340x thermal drivers are enabeld.
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

ACPI 4.0 introduced two thermal relationship tables via _ART
(active cooling) and  _TRT (passive cooling) objects. These
tables contain many to many relationships among thermal sensors
and cooling devices.

This patch parses _ART and _TRT and makes the result available to
the userspace via an misc device interface. At the same time,
kernel drivers can also request parsing results from internal
kernel APIs.

The results include source and target devices, influence, and
sampling rate in case of _TRT. For _ART, the result shows source
device, target device, and weight percentage.
Signed-off-by: NJacob Pan <jacob.jun.pan@linux.intel.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

ACPI INT3403 device object can be used to retrieve temperature date
from temperature sensors present in the system, and to expose
device' performance control.

The previous INT3403 thermal driver supports temperature reporting only,
thus remove it and introduce this new & enhanced one.
Signed-off-by: NLan Tianyu <tianyu.lan@intel.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

Signed-off-by: NZhang Rui <rui.zhang@intel.com>

Introduce int3400 thermal driver. And make INT3400 driver
enumerate the other int340x thermal components shown in _ART/_TRT.
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

Newer laptops and tablets that use ACPI may have thermal sensors and
other devices with thermal control capabilities outside the core CPU/SOC,
for thermal safety reasons.
They are exposed for the OS to use via
1) INT3400 ACPI device object as the master.
2) INT3401 ~ INT340B ACPI device objects as the slaves.

This patch introduces a scan handler to enumerate the INT3400
ACPI device object to platform bus, and prevent its slaves
from being enumerated before the controller driver being probed.
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

mach-kirkwood has been removed, now that kirkwood lives in mach-mvebu.
Depend on MACH_KIRKWOOD, which will be set when kirkwood is built as
part of ARCH_MVEBU.
Signed-off-by: NAndrew Lunn <andrew@lunn.ch>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Acked-by: NEduardo Valentin <edubezval@gmail.com>
Link: https://lkml.kernel.org/r/1409417172-6846-4-git-send-email-andrew@lunn.chSigned-off-by: NJason Cooper <jason@lakedaemon.net>

The bang-bang thermal governor uses a hysteresis to switch abruptly on
or off a cooling device.  It is intended to control fans, which can
not be throttled but just switched on or off.
Bang-bang cannot be set as default governor as it is intended for
special devices only.  For those special devices the driver needs to
explicitely request it.

Cc: Andrew Morton <akpm@linux-foundation.org>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Andreas Mohr <andi@lisas.de>
Cc: Borislav Petkov <bp@suse.de>
Cc: Javi Merino <javi.merino@arm.com>
Cc: linux-pm@vger.kernel.org
Signed-off-by: NPeter Feuerer <peter@piie.net>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

DT-enabled Dove has moved from ARCH_DOVE in mach-dove to MACH_DOVE
in mach-mvebu. As non-DT ARCH_DOVE will stay to rot for a while, add a new
DT-only MACH_DOVE to thermal Kconfig.

This was originally supposed to go in via "ARM: dove: prepare new Dove DT Kconfig"
patch from Sebastian Hesselbarth for 3.15, but slipped through the cracks.

I've tested on CuBox that without this patch you can't compile
dove_thermal into a mach-mvebu based kernel, and with this patch I can
build the driver and it works as expected run-time.

v2: non-ascii char creeped in somehow
Signed-off-by: NRiku Voipio <riku.voipio@linaro.org>
Cc: Sebastian Hesselbarth <sebastian.hesselbarth@gmail.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-arm-kernel@lists.infradead.org
Acked-by: NSebastian Hesselbarth <sebastian.hesselbarth@gmail.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

This core is shared by both ST's 'memory mapped' and
'system configuration register' based Thermal controllers.
Signed-off-by: NAjit Pal Singh <ajitpal.singh@st.com>
Signed-off-by: NLee Jones <lee.jones@linaro.org>
Acked-by: NPavel Machek <pavel@ucw.cz>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

In the Intel SoCs like Bay Trail, there are 2 additional digital temperature
sensors(DTS), in addition to the standard DTSs in the core. Also they support
4 programmable thresholds, out of which two can be used by OSPM. These
thresholds can be used by OSPM thermal control. Out of these two thresholds,
one is used by driver and one user mode can change via thermal sysfs to get
notifications on threshold violations.

The driver defines one critical trip points, which is set to TJ MAX - offset.
The offset can be changed via module parameter (default 5C). Also it uses
one of the thresholds to get notification for this temperature violation.
This is very important for orderly shutdown as the many of these devices don't
have ACPI thermal zone, and expects that there is some other thermal control
mechanism present in OSPM. When a Linux distro is used without additional
specialized thermal control program, BIOS can do force shutdown when thermals
are not under control. When temperature reaches critical, the Linux thermal
core will initiate an orderly shutdown.
Signed-off-by: NSrinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

Menu for Samsung thermal support is visible on all Samsung
platforms while thermal drivers are currently available only
for EXYNOS SoCs. Fix it by replacing PLAT_SAMSUNG dependency
with ARCH_EXYNOS one.
Signed-off-by: NBartlomiej Zolnierkiewicz <b.zolnierkie@samsung.com>
Signed-off-by: NKyungmin Park <kyungmin.park@samsung.com>
Acked-by: NAmit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>

Commit beeb5a1e (thermal: rcar-thermal: Enable driver compilation with COMPILE_TEST)
broke build on archs wihout io memory.

On archs like S390 or um this driver cannot build nor work.
Make it depend on HAS_IOMEM to bypass build failures.

drivers/thermal/rcar_thermal.c:404: undefined reference to `devm_ioremap_resource'
drivers/thermal/rcar_thermal.c:426: undefined reference to `devm_ioremap_resource'
Signed-off-by: NRichard Weinberger <richard@nod.at>
Acked-by: NLaurent Pinchart <laurent.pinchart@ideasonboard.com>
Acked-by: NKuninori Morimoto <kuninori.morimoto.gx@renesas.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

Signed-off-by: NZhang Rui <rui.zhang@intel.com>

With the move of kirkwood into mach-mvebu, drivers Kconfig need
tweeking to allow the kirkwood specific drivers to be built.
Signed-off-by: NAndrew Lunn <andrew@lunn.ch>
Acked-by: NArnd Bergmann <arnd@arndb.de>
Acked-by: NMark Brown <broonie@linaro.org>
Acked-by: NKishon Vijay Abraham I <kishon@ti.com>
Acked-by: NDaniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: NViresh Kumar <viresh.kumar@linaro.org>
Tested-by: NJason Gunthorpe <jgunthorpe@obsidianresearch.com>
Cc: Viresh Kumar <viresh.kumar@linaro.org>
Cc: Rafael J. Wysocki <rjw@rjwysocki.net>
Cc: Richard Purdie <rpurdie@rpsys.net>
Cc: Bryan Wu <cooloney@gmail.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: NJason Cooper <jason@lakedaemon.net>

This helps increasing build testing coverage.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <eduardo.valentin@ti.com>
Cc: linux-pm@vger.kernel.org
Signed-off-by: NLaurent Pinchart <laurent.pinchart+renesas@ideasonboard.com>
Acked-by: NSimon Horman <horms@verge.net.au>
Acked-by: NEduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

The ACPI INT3403 device objects present on some systems can be used to retrieve
temperature data from thermal sensors. Add a driver registering each INT3403
device object as a thermal zone device and exposing its _TMP, PATx and GTSH
method via the standard thermal control interface under /sys/class/thermal/.
Signed-off-by: NSrinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

This patch introduces an API to register cpufreq cooling device
based on device tree node.

The registration via device tree node differs from normal
registration due to the fact that it is needed to fill
the device_node structure in order to be able to match
the cooling devices with trip points.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: NEduardo Valentin <eduardo.valentin@ti.com>

This patch introduces a device tree bindings for
describing the hardware thermal behavior and limits.
Also a parser to read and interpret the data and feed
it in the thermal framework is presented.

This patch introduces a thermal data parser for device
tree. The parsed data is used to build thermal zones
and thermal binding parameters. The output data
can then be used to deploy thermal policies.

This patch adds also documentation regarding this
API and how to define tree nodes to use
this infrastructure.

Note that, in order to be able to have control
on the sensor registration on the DT thermal zone,
it was required to allow changing the thermal zone
.get_temp callback. For this reason, this patch
also removes the 'const' modifier from the .ops
field of thermal zone devices.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Acked-by: NMark Rutland <mark.rutland@arm.com>
Signed-off-by: NEduardo Valentin <eduardo.valentin@ti.com>

CONFIG_CPU_FREQ_TABLE will be always enabled when cpufreq framework is used, as
cpufreq core depends on it. So, we don't need this CONFIG option anymore as it
is not configurable. Remove CONFIG_CPU_FREQ_TABLE and update its users.
Signed-off-by: NViresh Kumar <viresh.kumar@linaro.org>
Signed-off-by: NRafael J. Wysocki <rafael.j.wysocki@intel.com>

Fix typo, finish sentence and add missing dots.
Signed-off-by: NLuka Perkov <luka@openwrt.org>
CC: Randy Dunlap <rdunlap@infradead.org>
Acked-by: NEduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

Applied to the HEAD of linux.git,
                       VERSION = 3 PATCHLEVEL = 11 SUBLEVEL = 0
Signed-off-by: NRegid Ichira <regid23@nt1.in>
Acked-by: NEduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

In order to improve code organization, this patch
moves the hwmon sysfs support to a file named
thermal_hwmon. This helps to add extra support
for hwmon without scrambling the code.

In order to do this move, the hwmon list head is now
using its own locking. Before, the list used
the global thermal locking. Also, some minor changes
in the code were required, as recommended by checkpatch.pl.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Acked-by: NDurgadoss R <durgadoss.r@intel.com>
Signed-off-by: NEduardo Valentin <eduardo.valentin@ti.com>

This movement of files is done for easy maintenance and adding more
new sensor's support for exynos platform easily . This will also help in
bifurcating exynos common, sensor driver and sensor data related parts.
Acked-by: NKukjin Kim <kgene.kim@samsung.com>
Acked-by: NJonghwa Lee <jonghwa3.lee@samsung.com>
Acked-by: NEduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: NAmit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: NEduardo Valentin <eduardo.valentin@ti.com>

This is based on the initial imx thermal work done by
Rob Lee <rob.lee@linaro.org> (Not sure if the email address is still
valid).  Since he is no longer interested in the work and I have
rewritten a significant amount of the code, I just took the authorship
over from him.

It adds the imx thermal support using Temperature Monitor (TEMPMON)
block found on some Freescale i.MX SoCs.  The driver uses syscon regmap
interface to access TEMPMON control registers and calibration data, and
supports cpufreq as the cooling device.
Signed-off-by: NShawn Guo <shawn.guo@linaro.org>
Signed-off-by: NEduardo Valentin <eduardo.valentin@ti.com>

Fix build error in x86_pkg_temp_thermal.c.  It requires that
X86_MCE & X86_THERMAL_VECTOR be enabled, so depend on the latter symbol,
since it depends on X86_MCE (indirectly).

Also, X86_PKG_TEMP_THERMAL is already inside an "if THERMAL" block,
so remove that duplicated dependency.

ERROR: "platform_thermal_package_rate_control" [drivers/thermal/x86_pkg_temp_thermal.ko] undefined!
ERROR: "platform_thermal_package_notify" [drivers/thermal/x86_pkg_temp_thermal.ko] undefined!
Signed-off-by: NRandy Dunlap <rdunlap@infradead.org>
Acked-by: NBorislav Petkov <bp@suse.de>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

This driver register CPU digital temperature sensor as a thermal
zone at package level.
Each package will show up as one zone with at max two trip points.
These trip points can be both read and updated. Once a non zero
value is set in the trip point, if the package package temperature
goes above or below this setting, a thermal notification is
generated.
Signed-off-by: NSrinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

This patch moves the ti-soc-thermal driver out of
the staging tree to the thermal tree.

Cc: Grant Likely <grant.likely@linaro.org>
Cc: Rob Herring <rob.herring@calxeda.com>
Cc: Rob Landley <rob@landley.net>
Cc: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <eduardo.valentin@ti.com>
Cc: J Keerthy <j-keerthy@ti.com>
Cc: Radhesh Fadnis <radhesh.fadnis@ti.com>
Cc: Cyril Roelandt <tipecaml@gmail.com>
Cc: devicetree-discuss@lists.ozlabs.org
Cc: linux-doc@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Cc: devel@driverdev.osuosl.org
Cc: linux-pm@vger.kernel.org
Signed-off-by: NEduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

There is no support for hotplug or any other means of reducing
temperature. So, this patch removes these references from Kconfig.
Signed-off-by: NEduardo Valentin <eduardo.valentin@ti.com>
Acked-by: NAmit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

Signed-off-by: NZhang Rui <rui.zhang@intel.com>
Acked-by: NEduardo Valentin <eduardo.valentin@ti.com>
Acked-by: NDurgadoss R <durgadoss.r@intel.com>

Because this feature is for debuging purposes, it is highly
recommended to do not enable this on production systems.
This patch adds warnings for system integrators, so that
people are aware of this potential security issue.
Signed-off-by: NEduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

This removes the driver specific sysfs support of the temperature
emulation and uses the newly added core thermal framework for thermal
emulation. An exynos platform specific handler is added to support this.

In this patch, the exynos senor(tmu) related code and exynos framework
related (thermal zone, cooling devices) code are intentionally kept separate.
So an emulated function pointer is passed from sensor to framework. This is
beneficial in adding more sensor support using the same framework code
which is an ongoing work. The goal is to finally split them totally. Even
the existing read_temperature also follows the same execution method.
Acked-by: NKukjin Kim <kgene.kim@samsung.com>
Signed-off-by: NAmit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>