- 06 9月, 2014 1 次提交
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由 Lars-Peter Clausen 提交于
Set the CODEC driver's suspend_bias_off flag rather than manually going to SND_SOC_BIAS_OFF in suspend and SND_SOC_BIAS_STANDBY in resume. This makes the code a bit shorter and cleaner. The manual transition to SND_SOC_BIAS_STANDBY at the end of CODEC probe() can also be removed as the core will automatically do this after the CODEC has been probed. Signed-off-by: NLars-Peter Clausen <lars@metafoo.de> Signed-off-by: NMark Brown <broonie@kernel.org>
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- 11 3月, 2014 1 次提交
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由 Xiubo Li 提交于
For some CODEC drivers like who act as the MFDs children are ignored by this patch. Signed-off-by: NXiubo Li <Li.Xiubo@freescale.com> Signed-off-by: NMark Brown <broonie@linaro.org>
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- 23 2月, 2014 1 次提交
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由 Takashi Iwai 提交于
Just replace with the helper macro. No functional change at all. Signed-off-by: NTakashi Iwai <tiwai@suse.de> Acked-by: NLiam Girdwood <liam.r.girdwood@linux.intel.com> Acked-by: NLars-Peter Clausen <lars@metafoo.de> Signed-off-by: NMark Brown <broonie@linaro.org>
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- 31 10月, 2013 1 次提交
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由 Takashi Iwai 提交于
get_coeff() may return an error. Spotted by coverity CID 703394. Signed-off-by: NTakashi Iwai <tiwai@suse.de> Signed-off-by: NMark Brown <broonie@linaro.org>
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- 09 12月, 2012 1 次提交
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由 Bill Pemberton 提交于
CONFIG_HOTPLUG is going away as an option. As result the __dev* markings will be going away. Remove use of __devinit, __devexit_p, __devinitdata, __devinitconst, and __devexit. Signed-off-by: NBill Pemberton <wfp5p@virginia.edu> Signed-off-by: NMark Brown <broonie@opensource.wolfsonmicro.com>
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- 13 6月, 2012 1 次提交
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由 Axel Lin 提交于
This fixes a leak if snd_soc_register_codec fails. Signed-off-by: NAxel Lin <axel.lin@gmail.com> Signed-off-by: NMark Brown <broonie@opensource.wolfsonmicro.com>
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- 01 4月, 2012 1 次提交
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由 Tomoya MORINAGA 提交于
ML26124-01HB/ML26124-02GD is 16bit monaural audio CODEC which has high resistance to voltage noise. On chip regulator realizes power supply rejection ratio be over 90dB so more than 50dB is improved than ever. ML26124-01HB/ ML26124-02GD can deliver stable audio performance without being affected by noise from the power supply circuit and peripheral components. The chip also includes a composite video signal output, which can be applied to various portable device requirements. The ML26124 is realized these functions into very small package the size is only 2.56mm x 2.46mm therefore can be construct high quality sound system easily. ML26124-01HB is 25pin WCSP package; ML26124-02GD is 32pin WQFN package. Signed-off-by: NTomoya MORINAGA <tomoya.rohm@gmail.com> Signed-off-by: NMark Brown <broonie@opensource.wolfsonmicro.com>
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