1. 23 11月, 2016 1 次提交
  2. 27 9月, 2016 4 次提交
  3. 06 9月, 2016 1 次提交
  4. 17 5月, 2016 3 次提交
  5. 11 5月, 2016 1 次提交
  6. 21 4月, 2016 2 次提交
  7. 09 3月, 2016 4 次提交
  8. 18 2月, 2016 1 次提交
  9. 10 2月, 2016 2 次提交
    • A
      thermal: allow u8500-thermal driver to be a module · 26716ce1
      Arnd Bergmann 提交于
      When the thermal subsystem is a loadable module, the u8500 driver
      fails to build:
      
      drivers/thermal/built-in.o: In function `db8500_thermal_probe':
      db8500_thermal.c:(.text+0x96c): undefined reference to `thermal_zone_device_register'
      drivers/thermal/built-in.o: In function `db8500_thermal_work':
      db8500_thermal.c:(.text+0xab4): undefined reference to `thermal_zone_device_update'
      
      This changes the symbol to a tristate, so Kconfig can track the
      dependency correctly.
      Signed-off-by: NArnd Bergmann <arnd@arndb.de>
      Signed-off-by: NEduardo Valentin <edubezval@gmail.com>
      26716ce1
    • A
      thermal: allow spear-thermal driver to be a module · 4d2f1794
      Arnd Bergmann 提交于
      When the thermal subsystem is a loadable module, the spear driver
      fails to build:
      
      drivers/thermal/built-in.o: In function `spear_thermal_exit':
      spear_thermal.c:(.text+0xf8): undefined reference to `thermal_zone_device_unregister'
      drivers/thermal/built-in.o: In function `spear_thermal_probe':
      spear_thermal.c:(.text+0x230): undefined reference to `thermal_zone_device_register'
      
      This changes the symbol to a tristate, so Kconfig can track the
      dependency correctly.
      Signed-off-by: NArnd Bergmann <arnd@arndb.de>
      Signed-off-by: NEduardo Valentin <edubezval@gmail.com>
      4d2f1794
  10. 24 11月, 2015 1 次提交
    • A
      Revert "thermal: qcom_spmi: allow compile test" · e4217468
      Arnd Bergmann 提交于
      This just caused build errors:
      
      warning: (QCOM_SPMI_TEMP_ALARM) selects REGMAP_SPMI which has unmet direct dependencies (SPMI)
      drivers/built-in.o: In function `regmap_spmi_ext_gather_write':
      :(.text+0x609b0): undefined reference to `spmi_ext_register_write'
      :(.text+0x609f0): undefined reference to `spmi_ext_register_writel'
      
      While it's generally a good idea to allow compile testing, in this
      case, it just doesn't work, so reverting the patch that
      introduced the compile-test variant seems the most appropriate
      solution.
      
      Note that SPMI also has a 'depends on ARCH_QCOM || COMPILE_TEST'
      statement, so we should be able to enable SPMI on all architectures
      for compile testing already.
      Signed-off-by: NArnd Bergmann <arnd@arndb.de>
      Fixes: cb7fb4d3 ("thermal: qcom_spmi: allow compile test")
      Signed-off-by: NEduardo Valentin <edubezval@gmail.com>
      e4217468
  11. 31 10月, 2015 1 次提交
  12. 10 10月, 2015 1 次提交
  13. 14 9月, 2015 9 次提交
  14. 04 8月, 2015 1 次提交
  15. 04 6月, 2015 1 次提交
  16. 05 5月, 2015 4 次提交
    • J
      thermal: remove stale THERMAL_POWER_ACTOR select · db6cb88b
      Javi Merino 提交于
      A previous version of this patch had a config for THERMAL_POWER_ACTOR
      but it was dropped.  Remove the select as it is not doing anything.
      
      Cc: Zhang Rui <rui.zhang@intel.com>
      Cc: Eduardo Valentin <edubezval@gmail.com>
      Reported-by: NValentin Rothberg <valentinrothberg@gmail.com>
      Signed-off-by: NJavi Merino <javi.merino@arm.com>
      Signed-off-by: NEduardo Valentin <edubezval@gmail.com>
      db6cb88b
    • P
      thermal: core: Add Kconfig option to enable writable trips · 35e94644
      Punit Agrawal 提交于
      Add a Kconfig option to allow system integrators to control whether
      userspace tools can change trip temperatures. This option overrides
      the thermal zone setup in the driver code and must be enabled for
      platform specified writable trips to come into effect.
      
      The original behaviour of requiring root privileges to change trip
      temperatures remains unchanged.
      
      Cc: Eduardo Valentin <edubezval@gmail.com>
      Cc: Zhang Rui <rui.zhang@intel.com>
      Signed-off-by: NPunit Agrawal <punit.agrawal@arm.com>
      Signed-off-by: NEduardo Valentin <edubezval@gmail.com>
      35e94644
    • J
      thermal: introduce the Power Allocator governor · 6b775e87
      Javi Merino 提交于
      The power allocator governor is a thermal governor that controls system
      and device power allocation to control temperature.  Conceptually, the
      implementation divides the sustainable power of a thermal zone among
      all the heat sources in that zone.
      
      This governor relies on "power actors", entities that represent heat
      sources.  They can report current and maximum power consumption and
      can set a given maximum power consumption, usually via a cooling
      device.
      
      The governor uses a Proportional Integral Derivative (PID) controller
      driven by the temperature of the thermal zone.  The output of the
      controller is a power budget that is then allocated to each power
      actor that can have bearing on the temperature we are trying to
      control.  It decides how much power to give each cooling device based
      on the performance they are requesting.  The PID controller ensures
      that the total power budget does not exceed the control temperature.
      
      Cc: Zhang Rui <rui.zhang@intel.com>
      Cc: Eduardo Valentin <edubezval@gmail.com>
      Signed-off-by: NPunit Agrawal <punit.agrawal@arm.com>
      Signed-off-by: NJavi Merino <javi.merino@arm.com>
      Signed-off-by: NEduardo Valentin <edubezval@gmail.com>
      6b775e87
    • I
      thermal: Add QPNP PMIC temperature alarm driver · c610afaa
      Ivan T. Ivanov 提交于
      Add support for the temperature alarm peripheral found inside
      Qualcomm plug-and-play (QPNP) PMIC chips. The temperature alarm
      peripheral outputs a pulse on an interrupt line whenever the
      thermal over temperature stage value changes.
      
      Register a thermal sensor. The temperature reported by this thermal
      sensor device should reflect the actual PMIC die temperature if an
      ADC is present on the given PMIC. If no ADC is present, then the
      reported temperature should be estimated from the over temperature
      stage value.
      
      Cc: David Collins <collinsd@codeaurora.org>
      Signed-off-by: NIvan T. Ivanov <iivanov@mm-sol.com>
      Signed-off-by: NEduardo Valentin <edubezval@gmail.com>
      c610afaa
  17. 01 5月, 2015 3 次提交