module.h header file was included twice.
Signed-off-by: NSachin Kamat <sachin.kamat@linaro.org>
Signed-off-by: NFelipe Balbi <balbi@ti.com>

Adds Exynos Specific Glue layer to support USB peripherals
on Samsung Exynos5 chips.

[ balbi@ti.com : prevent compilation of Exynos glue layer
	on platforms which don't provide clk API implementation ]
Signed-off-by: NAnton Tikhomirov <av.tikhomirov@samsung.com>
Signed-off-by: NFelipe Balbi <balbi@ti.com>