Fixes generated by 'codespell' and manually reviewed.
Signed-off-by: NLucas De Marchi <lucas.demarchi@profusion.mobi>

This allows the cache/processor/fault glue to be more easily used
from assembler code.  Tested on Assabet and Tegra 2.
Tested-by: NColin Cross <ccross@android.com>
Signed-off-by: NRussell King <rmk+kernel@arm.linux.org.uk>