- 03 3月, 2014 6 次提交
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由 Zhang Rui 提交于
This patch does a cleanup about the thermal zone govenor, setting and make the following rule. 1. For thermal zone devices that are registered w/o tz->tzp, they can use the default thermal governor only. 2. For thermal zone devices w/ governor name specified in tz->tzp->governor_name, we will use the default govenor if the governor specified is not available at the moment, and update tz->governor when the matched governor is registered. This also fixes a problem that OF registered thermal zones are running with no governor. Signed-off-by: NZhang Rui <rui.zhang@intel.com> Acked-by: NJavi Merino <javi.merino@arm.com>
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由 Ni Wade 提交于
In initialization, if the cooling device is initialized at max cooling state, and the thermal zone temperature is below the first trip point, then the cooling state can't be updated to the right state, untill the first trip point be triggered. To fix this issue, allow first update of cooling device state during registration, initialized "updated" device field as "false" (instead of "true"). Signed-off-by: NWei Ni <wni@nvidia.com> Signed-off-by: NZhang Rui <rui.zhang@intel.com>
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由 Richard Weinberger 提交于
Commit beeb5a1e (thermal: rcar-thermal: Enable driver compilation with COMPILE_TEST) broke build on archs wihout io memory. On archs like S390 or um this driver cannot build nor work. Make it depend on HAS_IOMEM to bypass build failures. drivers/thermal/rcar_thermal.c:404: undefined reference to `devm_ioremap_resource' drivers/thermal/rcar_thermal.c:426: undefined reference to `devm_ioremap_resource' Signed-off-by: NRichard Weinberger <richard@nod.at> Acked-by: NLaurent Pinchart <laurent.pinchart@ideasonboard.com> Acked-by: NKuninori Morimoto <kuninori.morimoto.gx@renesas.com> Signed-off-by: NZhang Rui <rui.zhang@intel.com>
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由 Jean Delvare 提交于
The thermal zone type should not include an instance number. Otherwise each zone is considered a different type and the thermal-to-hwmon bridge fails to group them all in a single hwmon device. I also changed the type to "x86_pkg_temp", because "pkg" was too generic, and other thermal drivers use an underscore, not a dash, as a separator. Or maybe "cpu_pkg_temp" would be better? Signed-off-by: NJean Delvare <jdelvare@suse.de> Cc: Zhang Rui <rui.zhang@intel.com> Cc: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: NZhang Rui <rui.zhang@intel.com>
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由 Jean Delvare 提交于
The temperature value reported by x86_pkg_temp_thermal is already reported by the coretemp driver. So, do not expose this thermal zone as a hwmon device, because it would be redundant. Signed-off-by: NJean Delvare <jdelvare@suse.de> Cc: Zhang Rui <rui.zhang@intel.com> Cc: Eduardo Valentin <eduardo.valentin@ti.com> Acked-by: NGuenter Roeck <linux@roeck-us.net> Signed-off-by: NZhang Rui <rui.zhang@intel.com>
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由 Zhang Rui 提交于
Signed-off-by: NZhang Rui <rui.zhang@intel.com>
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- 17 1月, 2014 1 次提交
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由 Lukasz Majewski 提交于
This patch provides auto disable/enable operation for boost. It uses already present thermal infrastructure to provide BOOST hysteresis. The TMU data is modified to work properly with or without BOOST. Hence, the two first trip points with corresponding clip frequencies are adjusted. The first one is reduced from 85 to 70 degrees and the clip frequency is increased to 1.4 GHz from 800 MHz. This trip point is in fact responsible for providing BOOST hysteresis. When temperature exceeds 70 deg, the maximal non BOOST frequency for Exynos4412 is imposed. Since the first trigger level has been "stolen" for BOOST, the second one needs to be a compromise for the previously used two for non BOOST configuration. The 95 deg with modified clip freq (to 400 MHz) should provide a good balance between cooling down the overheated device and throughput on an acceptable level. Two last trigger levels are not modified since, they cause platform shutdown on emergency overheat to happen. The third trip point passage results in SW managed shut down of the system. If the last trip point is crossed, the PMU HW generates the power off signal. Signed-off-by: NLukasz Majewski <l.majewski@samsung.com> Signed-off-by: NMyungjoo Ham <myungjoo.ham@samsung.com> Acked-by: NEduardo Valentin <eduardo.valentin@ti.com> Reviewed-by: NZhang Rui <rui.zhang@intel.com> [rjw: Changelog] Signed-off-by: NRafael J. Wysocki <rafael.j.wysocki@intel.com>
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- 14 1月, 2014 1 次提交
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由 Peter Zijlstra 提交于
The only valid use of preempt_enable_no_resched() is if the very next line is schedule() or if we know preemption cannot actually be enabled by that statement due to known more preempt_count 'refs'. Signed-off-by: NPeter Zijlstra <peterz@infradead.org> Cc: rjw@rjwysocki.net Cc: Eliezer Tamir <eliezer.tamir@linux.intel.com> Cc: rui.zhang@intel.com Cc: jacob.jun.pan@linux.intel.com Cc: Mike Galbraith <bitbucket@online.de> Cc: hpa@zytor.com Cc: Arjan van de Ven <arjan@linux.intel.com> Cc: lenb@kernel.org Cc: Linus Torvalds <torvalds@linux-foundation.org> Cc: Andrew Morton <akpm@linux-foundation.org> Link: http://lkml.kernel.org/n/tip-zcfvacdlvlr63qmnn5i58vuj@git.kernel.orgSigned-off-by: NIngo Molnar <mingo@kernel.org>
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- 08 1月, 2014 1 次提交
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由 Geert Uytterhoeven 提交于
Signed-off-by: NGeert Uytterhoeven <geert+renesas@linux-m68k.org> Acked-by: NSimon Horman <horms+renesas@verge.net.au> Signed-off-by: NJiri Kosina <jkosina@suse.cz>
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- 06 1月, 2014 1 次提交
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由 Eduardo Valentin 提交于
As per previous changes on thermal framework API, registering a new thermal zone does not require a const thermal zone ops. Thus, this patch removes the flag from imx thermal zone ops. Cc: Zhang Rui <rui.zhang@intel.com> Cc: Grant Likely <grant.likely@linaro.org> Cc: Rob Herring <rob.herring@calxeda.com> Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Cc: devicetree@vger.kernel.org Signed-off-by: NEduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: NZhang Rui <rui.zhang@intel.com>
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- 03 1月, 2014 3 次提交
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由 lan,Tianyu 提交于
This patch is to update thermal zone device after setting emul_temp in order to make governor work according to input temperature immediately. Signed-off-by: NLan Tianyu <tianyu.lan@intel.com> Signed-off-by: NZhang Rui <rui.zhang@intel.com>
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由 Yuxuan Shui 提交于
Having all zero cstate count doesn't necesserily mean the cstate counter is no functional. Signed-off-by: NYuxuan Shui <yshuiv7@gmail.com> Signed-off-by: NZhang Rui <rui.zhang@intel.com>
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由 Anson Huang 提交于
Thermal sensor needs pll3_usb_otg when measuring temperature, otherwise the temperature read will be incorrect, so need to enable this clk before sensor working, for alarm function, as hardware will take measurement periodically, so we should keep this clk always on once alarm function is enabled. Signed-off-by: NAnson Huang <b20788@freescale.com> Acked-by: NShawn Guo <shawn.guo@linaro.org> Signed-off-by: NZhang Rui <rui.zhang@intel.com>
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- 02 1月, 2014 10 次提交
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由 Zhang Rui 提交于
Signed-off-by: NZhang Rui <rui.zhang@intel.com>
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由 Eduardo Valentin 提交于
As per Documentation/thermal/sysfs-api.txt, max_level is an index, not a counter. Thus, in case a CPU has 3 valid frequencies, max_level is expected to be 2, for instance. The current code makes max_level == number of valid frequencies, which is bogus. This patch fix the cpu_cooling device by ranging max_level properly. Reported-by: NCarlos Hernandez <ceh@ti.com> Signed-off-by: NEduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: NZhang Rui <rui.zhang@intel.com>
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由 Laurent Pinchart 提交于
This helps increasing build testing coverage. Cc: Zhang Rui <rui.zhang@intel.com> Cc: Eduardo Valentin <eduardo.valentin@ti.com> Cc: linux-pm@vger.kernel.org Signed-off-by: NLaurent Pinchart <laurent.pinchart+renesas@ideasonboard.com> Acked-by: NSimon Horman <horms@verge.net.au> Acked-by: NEduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: NZhang Rui <rui.zhang@intel.com>
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由 Aaron Lu 提交于
To ease debugging thermal problem, add these dynamic debug statements so that user do not need rebuild kernel to see these info. Based on a patch from Zhang Rui for debugging on bugzilla: https://bugzilla.kernel.org/attachment.cgi?id=98671 A sample output after we turn on dynamic debug with the following cmd: # echo 'module thermal_sys +fp' > /sys/kernel/debug/dynamic_debug/control is like: [ 355.147627] update_temperature: thermal thermal_zone0: last_temperature=52000, current_temperature=55000 [ 355.147636] thermal_zone_trip_update: thermal thermal_zone0: Trip1[type=1,temp=79000]:trend=2,throttle=0 [ 355.147644] get_target_state: thermal cooling_device8: cur_state=0 [ 355.147647] thermal_zone_trip_update: thermal cooling_device8: old_target=-1, target=-1 [ 355.147652] get_target_state: thermal cooling_device7: cur_state=0 [ 355.147655] thermal_zone_trip_update: thermal cooling_device7: old_target=-1, target=-1 [ 355.147660] get_target_state: thermal cooling_device6: cur_state=0 [ 355.147663] thermal_zone_trip_update: thermal cooling_device6: old_target=-1, target=-1 [ 355.147668] get_target_state: thermal cooling_device5: cur_state=0 [ 355.147671] thermal_zone_trip_update: thermal cooling_device5: old_target=-1, target=-1 [ 355.147678] thermal_zone_trip_update: thermal thermal_zone0: Trip2[type=0,temp=90000]:trend=1,throttle=0 [ 355.147776] get_target_state: thermal cooling_device0: cur_state=0 [ 355.147783] thermal_zone_trip_update: thermal cooling_device0: old_target=-1, target=-1 [ 355.147792] thermal_zone_trip_update: thermal thermal_zone0: Trip3[type=0,temp=80000]:trend=1,throttle=0 [ 355.147845] get_target_state: thermal cooling_device1: cur_state=0 [ 355.147849] thermal_zone_trip_update: thermal cooling_device1: old_target=-1, target=-1 [ 355.147856] thermal_zone_trip_update: thermal thermal_zone0: Trip4[type=0,temp=70000]:trend=1,throttle=0 [ 355.147904] get_target_state: thermal cooling_device2: cur_state=0 [ 355.147908] thermal_zone_trip_update: thermal cooling_device2: old_target=-1, target=-1 [ 355.147915] thermal_zone_trip_update: thermal thermal_zone0: Trip5[type=0,temp=60000]:trend=1,throttle=0 [ 355.147963] get_target_state: thermal cooling_device3: cur_state=0 [ 355.147967] thermal_zone_trip_update: thermal cooling_device3: old_target=-1, target=-1 [ 355.147973] thermal_zone_trip_update: thermal thermal_zone0: Trip6[type=0,temp=55000]:trend=1,throttle=1 [ 355.148022] get_target_state: thermal cooling_device4: cur_state=0 [ 355.148025] thermal_zone_trip_update: thermal cooling_device4: old_target=-1, target=1 [ 355.148036] thermal_cdev_update: thermal cooling_device4: zone0->target=1 [ 355.169279] thermal_cdev_update: thermal cooling_device4: set to state 1 Signed-off-by: NAaron Lu <aaron.lu@intel.com> Acked-by: NEduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: NZhang Rui <rui.zhang@intel.com>
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由 Russell King 提交于
Add the module device table declaration so the module can be loaded automatically at boot time. Signed-off-by: NRussell King <rmk+kernel@arm.linux.org.uk> Acked-by: NShawn Guo <shawn.guo@linaro.org> Acked-by: NEduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: NZhang Rui <rui.zhang@intel.com>
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由 Rashika 提交于
Mark function sys_set_trip_temp() as static in x86_pkg_temp_thermal.c because it is not used outside this file. This eliminates the following warning in x86_pkg_temp_thermal.c: drivers/thermal/x86_pkg_temp_thermal.c:218:5: warning: no previous prototype for ‘sys_set_trip_temp’ [-Wmissing-prototypes] Signed-off-by: NRashika Kheria <rashika.kheria@gmail.com> Reviewed-by: NJosh Triplett <josh@joshtriplett.org> Signed-off-by: NZhang Rui <rui.zhang@intel.com>
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由 Naveen Krishna Chatradhi 提交于
This patch fixes a compilation warning. warning: passing argument 5 of 'thermal_zone_device_register' discards 'const' qualifier from pointer target type [enabled by default] include/linux/thermal.h:270:29: note: expected 'struct thermal_zone_device_ops *' but argument is of type 'const struct thermal_zone_device_ops *' Signed-off-by: NNaveen Krishna Chatradhi <ch.naveen@samsung.com> Signed-off-by: NZhang Rui <rui.zhang@intel.com>
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由 Anson Huang 提交于
Fixes regression introduced by: commit 37713a1e Author: Philipp Zabel <p.zabel@pengutronix.de> Date: Thu Aug 1 18:33:12 2013 +0200 thermal: imx: implement thermal alarm interrupt handling The commit 37713a1e makes imx thermal sensor always powered up as alarm function is enabled, but the suspend callback of imx thermal returns success only if thermal sensor is powered down, so it will always returns fail hence break system's suspend, this patch disables imx thermal sensor before suspend and re-enable it after resume. Signed-off-by: NAnson Huang <b20788@freescale.com> Acked-by: NShawn Guo <shawn.guo@linaro.org> Signed-off-by: NZhang Rui <rui.zhang@intel.com>
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由 Julia Lawall 提交于
Set the return variable to an error code as done elsewhere in the function. A simplified version of the semantic match that finds this problem is as follows: (http://coccinelle.lip6.fr/) // <smpl> ( if@p1 (\(ret < 0\|ret != 0\)) { ... return ret; } | ret@p1 = 0 ) ... when != ret = e1 when != &ret *if(...) { ... when != ret = e2 when forall return ret; } // </smpl> Signed-off-by: NJulia Lawall <Julia.Lawall@lip6.fr> Reviewed-by: NJingoo Han <jg1.han@samsung.com> Signed-off-by: NZhang Rui <rui.zhang@intel.com>
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由 Srinivas Pandruvada 提交于
The ACPI INT3403 device objects present on some systems can be used to retrieve temperature data from thermal sensors. Add a driver registering each INT3403 device object as a thermal zone device and exposing its _TMP, PATx and GTSH method via the standard thermal control interface under /sys/class/thermal/. Signed-off-by: NSrinivas Pandruvada <srinivas.pandruvada@linux.intel.com> Signed-off-by: NZhang Rui <rui.zhang@intel.com>
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- 20 12月, 2013 1 次提交
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由 Peter Zijlstra 提交于
People seem to delight in writing wrong and broken mwait idle routines; collapse the lot. This leaves mwait_play_dead() the sole remaining user of __mwait() and new __mwait() users are probably doing it wrong. Also remove __sti_mwait() as its unused. Cc: Arjan van de Ven <arjan@linux.intel.com> Cc: Jacob Jun Pan <jacob.jun.pan@linux.intel.com> Cc: Mike Galbraith <bitbucket@online.de> Cc: Len Brown <lenb@kernel.org> Cc: Rui Zhang <rui.zhang@intel.com> Acked-by: NRafael Wysocki <rafael.j.wysocki@intel.com> Signed-off-by: NPeter Zijlstra <peterz@infradead.org> Link: http://lkml.kernel.org/r/20131212141654.616820819@infradead.orgSigned-off-by: NH. Peter Anvin <hpa@linux.intel.com>
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- 04 12月, 2013 5 次提交
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由 Eduardo Valentin 提交于
This patch improves the ti-soc-thermal driver by adding the support to build the thermal zones based on DT nodes. The driver will have two options now to build the thermal zones. The first option is the zones originally coded in this driver. So, the driver behavior will be same if there is no DT node describing the zones. The second option, when it is found a DT node with thermal data, will used the common infrastructure to build the thermal zone and bind its cooling devices. In case the driver loads thermal data using the legacy mode, this driver still adds to the system a cpufreq cooling device. Loading the thermal data from DT, the driver assumes someone else will add the cpufreq cooling device, like the cpufreq driver. Cc: Zhang Rui <rui.zhang@intel.com> Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Signed-off-by: NEduardo Valentin <eduardo.valentin@ti.com>
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由 Eduardo Valentin 提交于
This patch introduces an API to register cpufreq cooling device based on device tree node. The registration via device tree node differs from normal registration due to the fact that it is needed to fill the device_node structure in order to be able to match the cooling devices with trip points. Cc: Zhang Rui <rui.zhang@intel.com> Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Signed-off-by: NEduardo Valentin <eduardo.valentin@ti.com>
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由 Eduardo Valentin 提交于
This patch adds a new API to allow registering cooling devices in the thermal framework derived from device tree nodes. This API links the cooling device with the device tree node so that binding with thermal zones is possible, given that thermal zones are pointing to cooling device device tree nodes. Cc: Zhang Rui <rui.zhang@intel.com> Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Signed-off-by: NEduardo Valentin <eduardo.valentin@ti.com>
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由 Eduardo Valentin 提交于
This patch introduces a device tree bindings for describing the hardware thermal behavior and limits. Also a parser to read and interpret the data and feed it in the thermal framework is presented. This patch introduces a thermal data parser for device tree. The parsed data is used to build thermal zones and thermal binding parameters. The output data can then be used to deploy thermal policies. This patch adds also documentation regarding this API and how to define tree nodes to use this infrastructure. Note that, in order to be able to have control on the sensor registration on the DT thermal zone, it was required to allow changing the thermal zone .get_temp callback. For this reason, this patch also removes the 'const' modifier from the .ops field of thermal zone devices. Cc: Zhang Rui <rui.zhang@intel.com> Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Acked-by: NMark Rutland <mark.rutland@arm.com> Signed-off-by: NEduardo Valentin <eduardo.valentin@ti.com>
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由 Eduardo Valentin 提交于
This patch changes the thermal core driver to allow registration of thermal zones without the .get_temp callback. The idea behind this change is to allow lazy registration of sensor callbacks. The thermal zone will be disabled whenever the ops does not contain a .get_temp callback. The sysfs interface will be returning -EINVAL on any temperature read operation. Cc: Zhang Rui <rui.zhang@intel.com> Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Signed-off-by: NEduardo Valentin <eduardo.valentin@ti.com>
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- 20 11月, 2013 2 次提交
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由 Johannes Berg 提交于
Register generic netlink multicast groups as an array with the family and give them contiguous group IDs. Then instead of passing the global group ID to the various functions that send messages, pass the ID relative to the family - for most families that's just 0 because the only have one group. This avoids the list_head and ID in each group, adding a new field for the mcast group ID offset to the family. At the same time, this allows us to prevent abusing groups again like the quota and dropmon code did, since we can now check that a family only uses a group it owns. Signed-off-by: NJohannes Berg <johannes.berg@intel.com> Signed-off-by: NDavid S. Miller <davem@davemloft.net>
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由 Johannes Berg 提交于
This doesn't really change anything, but prepares for the next patch that will change the APIs to pass the group ID within the family, rather than the global group ID. Signed-off-by: NJohannes Berg <johannes.berg@intel.com> Signed-off-by: NDavid S. Miller <davem@davemloft.net>
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- 06 11月, 2013 2 次提交
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由 Ni Wade 提交于
The thermal zone params can be used to set governor to specific thermal governor for thermal zone device. But if the thermal zone params has only governor name without thermal bind params, then the thermal zone device will not be binding to cooling device. Because tz->ops->bind operator is not invoked in bind_tz() and bind_cdev() when there is thermal zone params. Signed-off-by: NWei Ni <wni@nvidia.com> Signed-off-by: NJinyoung Park <jinyoungp@nvidia.com> Signed-off-by: NZhang Rui <rui.zhang@intel.com>
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由 Wei Yongjun 提交于
In case of error, the function thermal_cooling_device_register() returns ERR_PTR() and never returns NULL. The NULL test in the return value check should be replaced with IS_ERR(). Signed-off-by: NWei Yongjun <yongjun_wei@trendmicro.com.cn> Signed-off-by: NZhang Rui <rui.zhang@intel.com>
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- 21 10月, 2013 1 次提交
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由 Zhang Rui 提交于
Commit b82715fd introduces a 'device' subdirectory under /sys/class/hwmon/hwmonX/ directory, for the thermal_zone hwmon devices. And this results in different handling by libsensors. The problem is reported and discussed in this thread http://marc.info/?l=linux-pm&m=138229306109596&w=2 This patch reverts commit b82715fd. Reported-by: NArnaud Ebalard <arno@natisbad.org> Signed-off-by: NZhang Rui <rui.zhang@intel.com>
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- 16 10月, 2013 1 次提交
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由 Viresh Kumar 提交于
CONFIG_CPU_FREQ_TABLE will be always enabled when cpufreq framework is used, as cpufreq core depends on it. So, we don't need this CONFIG option anymore as it is not configurable. Remove CONFIG_CPU_FREQ_TABLE and update its users. Signed-off-by: NViresh Kumar <viresh.kumar@linaro.org> Signed-off-by: NRafael J. Wysocki <rafael.j.wysocki@intel.com>
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- 15 10月, 2013 4 次提交
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由 Eduardo Valentin 提交于
This patch changes the behavior of TI SoC thermal driver when there is a PCB thermal zone. Instead of reporting an error code when reading from PCB temperature sensor fails, this patch will make the driver attempt to compose the hotspot extrapolation based on bandgap readings only. Cc: Zhang Rui <rui.zhang@intel.com> Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Signed-off-by: NEduardo Valentin <eduardo.valentin@ti.com>
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由 Lukasz Majewski 提交于
The commit d0a0ce3e ("thermal: exynos: Add missing definations and code cleanup") has removed setting of test MUX address value at TMU configuration setting. This field is not present on Exynos4210 and Exynos5 SoCs. However on Exynos4412 SoC it is required to set this field after reset because without it TMU shows maximal available temperature, which causes immediate platform shutdown. Signed-off-by: NLukasz Majewski <l.majewski@samsung.com> Reviewed-by: NBartlomiej Zolnierkiewicz <b.zolnierkie@samsung.com> Reviewed-by: NTomasz Figa <t.figa@samsung.com> Signed-off-by: NEduardo Valentin <eduardo.valentin@ti.com>
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由 Lukasz Majewski 提交于
Up till now Exynos5250 and Exynos4412 had the same definitions for TMU data. Following commit changes that, by introducing separate exynos4412_default_tmu_data structure. Since Exynos4412 was chronologically first, the corresponding name for TMU registers and default data was renamed. Additionally, new SOC_ARCH_EXYNOS4412 type has been defined. Moreover, the SOC_ARCH_EXYNOS name has been changed to SOC_ARCH_EXYNOS5250. Signed-off-by: NLukasz Majewski <l.majewski@samsung.com> Reviewed-by: NBartlomiej Zolnierkiewicz <b.zolnierkie@samsung.com> Reviewed-by: NTomasz Figa <t.figa@samsung.com> Signed-off-by: NEduardo Valentin <eduardo.valentin@ti.com>
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由 Lukasz Majewski 提交于
The commit 4de0bdaa ("thermal: exynos: Add support for instance based register/unregister") broke check for presence of therm_dev at global thermal zone in exynos_report_trigger(). The resulting wrong test prevents thermal_zone_device_update() call, which calls handlers for situation when trip points are passed. Such behavior prevents thermal driver from proper reaction (when TMU interrupt is raised) in a situation when overheating is detected at TMU hardware. It turns out, that after exynos thermal subsystem redesign (at v3.12) this check is not needed, since it is not possible to register thermal zone without valid thermal device. Signed-off-by: NLukasz Majewski <l.majewski@samsung.com> Reviewed-by: NBartlomiej Zolnierkiewicz <b.zolnierkie@samsung.com> Reviewed-by: NTomasz Figa <t.figa@samsung.com> Signed-off-by: NEduardo Valentin <eduardo.valentin@ti.com>
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- 14 10月, 2013 1 次提交
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由 durgadoss.r@intel.com 提交于
The thermal_release function is called whenever any device belonging to 'thermal' class unregisters. This function performs kfree(cdev) without any check. In cases where there are more device registrations other than just 'thermal_zone' and 'cooling_device' this might accidently free memory allocated them silently; and cause memory errors. This patch changes this behavior by doing kfree(cdev) only when the device pointer belongs to a real cdev i.e. cooling_device. Signed-off-by: NDurgadoss R <durgadoss.r@intel.com> Signed-off-by: NZhang Rui <rui.zhang@intel.com>
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