usb: musb: introduce DA8xx/OMAP-L1x glue layer
Texas Instruments DA8xx/OMAP-L1x glue layer for the MUSBMHRDC driver. Signed-off-by: NSergei Shtylyov <sshtylyov@ru.mvista.com> Signed-off-by: NYadviga Grigorieva <yadviga@ru.mvista.com> Signed-off-by: NFelipe Balbi <balbi@ti.com> Signed-off-by: NGreg Kroah-Hartman <gregkh@suse.de>
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drivers/usb/musb/da8xx.c
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