This patch adds platform level information to thermal.h
by introducing two structures to hold:
 * bind parameters for a thermal zone,
 * zone level platform parameters
Signed-off-by: NDurgadoss R <durgadoss.r@intel.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

This patch adds the following API's to thermal_sys.c, that
can be used by other Thermal drivers.
 * get_tz_trend: obtain the trend of the given thermal zone
 * get_thermal_instance: obtain the instance corresponding
   to the given tz, cdev and the trip point.
Signed-off-by: NDurgadoss R <durgadoss.r@intel.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

This patch rearranges the code in thermal.h file,
in the following order, so that it is easy to
read/maintain.
1. All #defines
2. All enums
3. All fops structures
4. All device structures
5. All function declarations
Signed-off-by: NDurgadoss R <durgadoss.r@intel.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

we need to go over all the thermal_instance list of a cooling device
to decide which cooling state to put the cooling device to.

But at this time, as a cooling device may be referenced in multiple
thermal zones, we need to lock the list first in case
another thermal zone is updating this cooling device.
Signed-off-by: NZhang Rui <rui.zhang@intel.com>
Reviewed-by: NRafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: NEduardo Valentin <eduardo.valentin@ti.com>

Remove thermal_zone_device_passive(). And use
thermal_zone_trip_update() and thermal_zone_do_update()
for both active and passive cooling.
Signed-off-by: NZhang Rui <rui.zhang@intel.com>
Reviewed-by: NRafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: NEduardo Valentin <eduardo.valentin@ti.com>

This fixes the problem that a cooling device may be referenced by
by multiple trip points in multiple thermal zones.

With this patch, we have two stages for updating a thermal zone,
1. check if a thermal_instance needs to be updated or not
2. update the cooling device, based on the target cooling state
   of all its instances.

Note that, currently, the cooling device is set to the deepest
cooling state required.
Signed-off-by: NZhang Rui <rui.zhang@intel.com>
Reviewed-by: NRafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: NEduardo Valentin <eduardo.valentin@ti.com>

List thermal_instance in thermal_cooling_device so that
cooling device can know the cooling state requirement
of all the thermal instances.
Signed-off-by: NZhang Rui <rui.zhang@intel.com>
Reviewed-by: NRafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: NEduardo Valentin <eduardo.valentin@ti.com>

Rename thermal_zone_device.cooling_devices
to thermal_zone_device.thermal_instances

thermal_zone_device.cooling_devices is not accurate
as this is a list for thermal instances, rather than cooling devices.
Signed-off-by: NZhang Rui <rui.zhang@intel.com>
Reviewed-by: NRafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: NEduardo Valentin <eduardo.valentin@ti.com>

Remove tc1/tc2 in generic thermal layer.
.get_trend() callback starts to take effect from this patch.
Signed-off-by: NZhang Rui <rui.zhang@intel.com>
Reviewed-by: NRafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: NValentin, Eduardo <eduardo.valentin@ti.com>

According to ACPI spec, tc1 and tc2 are used by OSPM
to anticipate the temperature trends.
We introduced the same concept to the generic thermal layer
for passive cooling, but now it seems that these values
are hard to be used on other platforms.

So We introduce .get_trend() as a more general solution.

For the platform thermal drivers that have their own way to
anticipate the temperature trends, they should provide
their own .get_trend() callback.
Or else, we will calculate the temperature trends by simply
comparing the current temperature and the cached previous
temperature reading.
Signed-off-by: NZhang Rui <rui.zhang@intel.com>
Reviewed-by: NRafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: NValentin, Eduardo <eduardo.valentin@ti.com>

set upper and lower limits when binding
a thermal cooling device to a thermal zone device.
Signed-off-by: NZhang Rui <rui.zhang@intel.com>
Reviewed-by: NRafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: NEduardo Valentin <eduardo.valentin@ti.com>

thermal_zone_device_register() does not modify 'type' argument, so it is
safe to declare it as const. Otherwise, if we pass a const string, we are
getting the ugly warning:

CC drivers/power/power_supply_core.o
drivers/power/power_supply_core.c: In function 'psy_register_thermal':
drivers/power/power_supply_core.c:204:6: warning: passing argument 1 of 'thermal_zone_device_register' discards 'const' qualifier from pointer target type [enabled by default]
include/linux/thermal.h:140:29: note: expected 'char *' but argument is of type 'const char *'
Signed-off-by: NAnton Vorontsov <anton.vorontsov@linaro.org>
Acked-by: NJean Delvare <khali@linux-fr.org>

The Linux Thermal Framework does not support hysteresis
attributes. Most thermal sensors, today, have a
hysteresis value associated with trip points.

This patch adds hysteresis attributes on a per-trip-point
basis, to the Thermal Framework. These attributes are
optionally writable.
Signed-off-by: NDurgadoss R <durgadoss.r@intel.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>
Signed-off-by: NLen Brown <len.brown@intel.com>

Some of the thermal drivers using the Generic Thermal Framework
require (all/some) trip points to be writeable. This patch makes
the trip point temperatures writeable on a per-trip point basis,
and modifies the required function call in thermal.c. This patch
also updates the Documentation to reflect the new change.
Signed-off-by: NDurgadoss R <durgadoss.r@intel.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>
Signed-off-by: NLen Brown <len.brown@intel.com>

It doesn't seem right for the thermal subsystem to export a symbol
named generate_netlink_event. This function is thermal-specific and
its name should reflect that fact. Rename it to
thermal_generate_netlink_event.
Signed-off-by: NJean Delvare <khali@linux-fr.org>
Acked-by: NRafael J. Wysocki <rjw@sisk.pl>
Acked-by: NR.Durgadoss <durgadoss.r@intel.com>
Signed-off-by: NLen Brown <len.brown@intel.com>

THERMAL_HWMON is implemented inside the thermal_sys driver and has no
effect on drivers implementing thermal zones, so they shouldn't see
anything related to it in <linux/thermal.h>.  Making the THERMAL_HWMON
implementation fully internal has two advantages beyond the cleaner
design:

* This avoids rebuilding all thermal drivers if the THERMAL_HWMON
  implementation changes, or if CONFIG_THERMAL_HWMON gets enabled or
  disabled.

* This avoids breaking the thermal kABI in these cases too, which should
  make distributions happy.

The only drawback I can see is slightly higher memory fragmentation, as
the number of kzalloc() calls will increase by one per thermal zone.  But
I doubt it will be a problem in practice, as I've never seen a system with
more than two thermal zones.
Signed-off-by: NJean Delvare <khali@linux-fr.org>
Cc: Rene Herman <rene.herman@gmail.com>
Acked-by: NGuenter Roeck <guenter.roeck@ericsson.com>
Signed-off-by: NAndrew Morton <akpm@linux-foundation.org>
Signed-off-by: NLen Brown <len.brown@intel.com>

Several ACPI drivers fail to build if CONFIG_NET is unset, because
they refer to things depending on CONFIG_THERMAL that in turn depends
on CONFIG_NET.  However, CONFIG_THERMAL doesn't really need to depend
on CONFIG_NET, because the only part of it requiring CONFIG_NET is
the netlink interface in thermal_sys.c.

Put the netlink interface in thermal_sys.c under #ifdef CONFIG_NET
and remove the dependency of CONFIG_THERMAL on CONFIG_NET from
drivers/thermal/Kconfig.
Signed-off-by: NRafael J. Wysocki <rjw@sisk.pl>
Acked-by: NRandy Dunlap <randy.dunlap@oracle.com>
Cc: Ingo Molnar <mingo@elte.hu>
Cc: Len Brown <lenb@kernel.org>
Cc: Stephen Rothwell <sfr@canb.auug.org.au>
Cc: Luming Yu <luming.yu@intel.com>
Cc: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: NLinus Torvalds <torvalds@linux-foundation.org>

This patch adds event notification support to the generic
thermal sysfs framework in the kernel. The notification is in the
form of a netlink event.
Signed-off-by: NR.Durgadoss <durgadoss.r@intel.com>
Signed-off-by: NLen Brown <len.brown@intel.com>

And while touching that function definition do something about the disaster
of formatting there.
Signed-off-by: NAlan Cox <alan@linux.intel.com>
Acked-by: NZhang Rui <rui.zhang@intel.com>
Signed-off-by: NLen Brown <len.brown@intel.com>

Due to poor thermal design or Linux driving hardware outside its thermal
envelope, some systems will reach critical temperature and shut down
under high load. This patch adds support for forcing a polling-based
passive trip point if the firmware doesn't provide one. The assumption
is made that the processor is the most practical means to reduce the
dynamic heat generation, so hitting the passive thermal limit will cause
the CPU to be throttled until the temperature stabalises around the
defined value.

UI is provided via a "passive" sysfs entry in the thermal zone
directory. It accepts a decimal value in millidegrees celsius, or "0" to
disable the functionality. Default behaviour is for this functionality
to be disabled.
Signed-off-by: NMatthew Garrett <mjg@redhat.com>
Signed-off-by: NLen Brown <len.brown@intel.com>

The ACPI code currently carries its own thermal trip handling, meaning that
any other thermal implementation will need to reimplement it. Move the code
to the generic thermal layer.
Signed-off-by: NMatthew Garrett <mjg@redhat.com>
Signed-off-by: NLen Brown <len.brown@intel.com>

The thermal API currently uses strings to pass values to userspace. This
makes it difficult to use from within the kernel. Change the interface
to use integers and fix up the consumers.
Signed-off-by: NMatthew Garrett <mjg@redhat.com>
Acked-by: NZhang Rui <rui.zhang@intel.com>
Acked-by: NThomas Renninger <trenn@suse.de>
Signed-off-by: NLen Brown <len.brown@intel.com>

A bug in libsensors <= 2.10.6 is exposed
when this new hwmon I/F is enabled.
Create CONFIG_THERMAL_HWMON=n
until some time after libsensors 2.10.7 ships
so those users can run the latest kernel.

libsensors 3.x is already fixed -- those users
can use CONFIG_THERMAL_HWMON=y now.
Signed-off-by: NRene Herman <rene.herman@gmail.com>
Acked-by: NMark M. Hoffman <mhoffman@lightlink.com>
Signed-off-by: NLen Brown <len.brown@intel.com>

Add hwmon sys I/F for generic thermal driver.

Note: we have one hwmon class device for EACH TYPE of the thermal zone device.
Signed-off-by: NZhang Rui <rui.zhang@intel.com>
Acked-by: NJean Delvare <khali@linux-fr.org>
Signed-off-by: NLen Brown <len.brown@intel.com>

Add a new callback so that the generic thermal can get
the critical trip point info of a thermal zone,
which is needed for building the tempX_crit hwmon sysfs attribute.
Signed-off-by: NZhang Rui <rui.zhang@intel.com>
Acked-by: NJean Delvare <khali@linux-fr.org>
Signed-off-by: NLen Brown <len.brown@intel.com>

Build the generic thermal driver as module "thermal_sys".

Make ACPI thermal, video, processor and fan SELECT the generic
thermal driver, as these drivers rely on it to build the sysfs I/F.
Signed-off-by: NZhang Rui <rui.zhang@intel.com>
Acked-by: NJean Delvare <khali@linux-fr.org>
Signed-off-by: NLen Brown <len.brown@intel.com>

The THERMAL_MAX_TRIPS value is set to 10.  It is too few for the Compaq AP550
machine which has 12 trip points.
Signed-off-by: NKrzysztof Helt <krzysztof.h1@wp.pl>
Cc: Len Brown <lenb@kernel.org>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: "Rafael J. Wysocki" <rjw@sisk.pl>
Signed-off-by: NAndrew Morton <akpm@linux-foundation.org>
Signed-off-by: NLinus Torvalds <torvalds@linux-foundation.org>

This fixes the build, but acpi_fan_add() still needs
to be updated to handle thermal_cooling_device_register()
returning NULL as a non-fatal condition.
Signed-off-by: NLen Brown <len.brown@intel.com>

Fix an imprecision in CELSIUS_TO_KELVIN and move these
two macroes to a proper place.
Signed-off-by: NZhang Rui <rui.zhang@intel.com>
Signed-off-by: NThomas Sujith <sujith.thomas@intel.com>
Signed-off-by: NLen Brown <len.brown@intel.com>

The Generic Thermal sysfs driver for thermal management.
Signed-off-by: NZhang Rui <rui.zhang@intel.com>
Signed-off-by: NThomas Sujith <sujith.thomas@intel.com>
Signed-off-by: NLen Brown <len.brown@intel.com>