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  1. 22 3月, 2011 5 次提交
  3. 17 3月, 2011 1 次提交
  5. 15 3月, 2011 7 次提交
  7. 10 1月, 2011 1 次提交
  9. 09 1月, 2011 1 次提交
  11. 29 10月, 2010 2 次提交
    • J
      Move ams driver to macintosh · bd5f47ec
      由 Jean Delvare 提交于 
      The ams driver isn't a hardware monitoring driver, so it shouldn't
live under driver/hwmon. drivers/macintosh seems much more
appropriate, as the driver is only useful on PowerBooks and iBooks.
Signed-off-by: NJean Delvare <khali@linux-fr.org>
Cc: Guenter Roeck <guenter.roeck@ericsson.com>
Cc: Stelian Pop <stelian@popies.net>
Cc: Michael Hanselmann <linux-kernel@hansmi.ch>
Cc: Benjamin Herrenschmidt <benh@kernel.crashing.org>
Cc: Grant Likely <grant.likely@secretlab.ca>
      bd5f47ec
    • W
      hwmon: New driver for the W83795G/ADG monitoring chips · 792d376b
      由 Wei Song 提交于 
      There is still much work needed, but I wanted to give Wei the credit
he deserves. I've merged some of my own fixes already, to make
gcc and checkpatch happy. Individual fixes and improvements from me
will follow.

[JD: Fix build errors]
[JD: Coding style cleanups]
[JD: Get rid of forward declarations]
[JD: Drop VID support]
[JD: Drop fault output control feature]
[JD: Use lowercase for inline function names]
[JD: Use strict variants of the strtol/ul functions]
[JD: Shorten the read and write function names]
Signed-off-by: NJean Delvare <khali@linux-fr.org>
      792d376b
  13. 26 10月, 2010 2 次提交
  15. 21 10月, 2010 1 次提交
  17. 15 8月, 2010 1 次提交
  19. 10 8月, 2010 2 次提交
  21. 05 8月, 2010 1 次提交
  23. 04 8月, 2010 1 次提交
    • F
      x86, hwmon: Package Level Thermal/Power: pkgtemp hwmon driver · cb84b194
      由 Fenghua Yu 提交于 
      This patch adds a hwmon driver for package level thermal control. The driver
dumps package level thermal information through sysfs interface so that upper
level application (e.g. lm_sensor) can retrive the information.

Instead of having the package level hwmon code in coretemp, I write a seperate
driver pkgtemp because:

First, package level thermal sensors include not only sensors for each core,
but also sensors for uncore, memory controller or other components in the
package. Logically it will be clear to have a seperate hwmon driver for package
level hwmon to monitor wider range of sensors in a package. Merging package
thermal driver into core thermal driver doesn't make sense and may mislead.

Secondly, merging the two drivers together may cause coding mess. It's easier
to include various package level sensors info if more sensor information is
implemented. Coretemp code needs to consider a lot of legacy machine cases.
Pkgtemp code only considers platform starting from Sandy Bridge.

On a 1Sx4Cx2T Sandy Bridge platform, lm-sensors dumps the pkgtemp and coretemp:

pkgtemp-isa-0000
Adapter: ISA adapter
physical id 0: +33.0°C  (high = +79.0°C, crit = +99.0°C)

coretemp-isa-0000
Adapter: ISA adapter
Core 0:      +32.0°C  (high = +79.0°C, crit = +99.0°C)

coretemp-isa-0001
Adapter: ISA adapter
Core 1:      +32.0°C  (high = +79.0°C, crit = +99.0°C)

coretemp-isa-0002
Adapter: ISA adapter
Core 2:      +32.0°C  (high = +79.0°C, crit = +99.0°C)

coretemp-isa-0003
Adapter: ISA adapter
Core 3:      +32.0°C  (high = +79.0°C, crit = +99.0°C)

[ hpa: folded v3 patch removing improper global variable "SHOW" ]
Signed-off-by: NFenghua Yu <fenghua.yu@intel.com>
LKML-Reference: <1280448826-12004-3-git-send-email-fenghua.yu@intel.com>
Reviewed-by: NLen Brown <len.brown@intel.com>
Signed-off-by: NH. Peter Anvin <hpa@linux.intel.com>
      cb84b194
  25. 28 5月, 2010 2 次提交
  27. 25 5月, 2010 1 次提交
  29. 06 3月, 2010 3 次提交
  31. 12 1月, 2010 1 次提交
  33. 18 12月, 2009 1 次提交
  35. 17 12月, 2009 2 次提交
  37. 10 12月, 2009 2 次提交
  39. 24 9月, 2009 1 次提交
  41. 17 9月, 2009 2 次提交