Enable RWDT and use 60 seconds as default timeout.
Signed-off-by: NBiju Das <biju.das@bp.renesas.com>
Reviewed-by: NGeert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: NSimon Horman <horms+renesas@verge.net.au>

This patch enables PCIEC[01] PCI express controller on the sub board.
Signed-off-by: NBiju Das <biju.das@bp.renesas.com>
Reviewed-by: NGeert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: NSimon Horman <horms+renesas@verge.net.au>

Declare pcie bus clock, since it is generated on the HiHope RZ/G2M main
board.
Signed-off-by: NBiju Das <biju.das@bp.renesas.com>
Reviewed-by: NGeert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: NSimon Horman <horms+renesas@verge.net.au>

This patch adds PCIe{0,1} device nodes for R8A774A1 SoC.
Signed-off-by: NBiju Das <biju.das@bp.renesas.com>
Reviewed-by: NGeert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: NSimon Horman <horms+renesas@verge.net.au>

The HiHope RZ/G2M sub board sits below the HiHope RZ/G2M main board.
This patch also adds ethernet support along with a dtsi common to
both HiHope RZ/G2M and RZ/G2N sub boards.
Signed-off-by: NBiju Das <biju.das@bp.renesas.com>
Reviewed-by: NChris Paterson <Chris.Paterson2@renesas.com>
Reviewed-by: NGeert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: NSimon Horman <horms+renesas@verge.net.au>

This patch adds pincontrol support to scif2/scif clock.
Signed-off-by: NBiju Das <biju.das@bp.renesas.com>
Reviewed-by: NChris Paterson <Chris.Paterson2@renesas.com>
Reviewed-by: NGeert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: NSimon Horman <horms+renesas@verge.net.au>

Basic support for the HiHope RZ/G2M main board:
  - Memory,
  - Main crystal,
  - Serial console

This patch also includes a dtsi common to both HiHope RZ/G2M
and RZ/G2N main boards.
Signed-off-by: NBiju Das <biju.das@bp.renesas.com>
Reviewed-by: NChris Paterson <Chris.Paterson2@renesas.com>
Reviewed-by: NGeert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: NSimon Horman <horms+renesas@verge.net.au>

The RZ/G2M (a.k.a. r8a774a1) comes with two clusters of
processors, similarly to the r8a7796.
The first cluster is made of A57s, the second cluster is
made of A53s.

The operating points for the cluster with the A57s are:

 Frequency | Voltage
-----------|---------
 500 MHz   | 0.82V
 1.0 GHz   | 0.82V
 1.5 GHz   | 0.82V

The operating points for the cluster with the A53s are:

 Frequency | Voltage
-----------|---------
 800 MHz   | 0.82V
 1.0 GHz   | 0.82V
 1.2 GHz   | 0.82V

This patch adds the definitions for the operating points
to the SoC specific DT.
Signed-off-by: NFabrizio Castro <fabrizio.castro@bp.renesas.com>
Reviewed-by: NChris Paterson <Chris.Paterson2@renesas.com>
Signed-off-by: NSimon Horman <horms+renesas@verge.net.au>

Describe the dynamic power coefficient of A53 CPUs.

Based on work by Gaku Inami <gaku.inami.xw@bp.renesas.com> and others.
Signed-off-by: NSimon Horman <horms+renesas@verge.net.au>

Setup a thermal zone driven by SoC temperature sensor.
Create passive trip points and bind them to CPUFreq cooling
device that supports power extension.

In R-Car Gen3, IPA is supported for only one channel
Reason:
  Currently, IPA controls base on only CPU temperature.
  And only one thermal channel is assembled closest
  CPU cores is selected as target of IPA.
  If other channels are used, IPA controlling is not properly.

A single cooling device is described for all A53 CPUs as this
reflects that physically there is only one cooling device present.

This patch improves on an earlier version by:

* Omitting cooling-max-level and cooling-min-level properties which
  are no longer present in mainline as of v4.17
* Removing an unused trip-point0 node sub-property from the trips
  property.
* Defers adding dynamic-power-coefficient properties to a separate patch as
  these are properties of the CPU.

The long signed-off by chain below reflects many revisions, mainly
internal, that this patch has been through.
Signed-off-by: NDien Pham <dien.pham.ry@renesas.com>
Signed-off-by: NTakeshi Kihara <takeshi.kihara.df@renesas.com>
Signed-off-by: NYoshihiro Kaneko <ykaneko0929@gmail.com>
Signed-off-by: NSimon Horman <horms+renesas@verge.net.au>

Describe the dynamic power coefficient of A57 and A53 CPUs.

Based on work by Gaku Inami <gaku.inami.xw@bp.renesas.com> and others.
Signed-off-by: NSimon Horman <horms+renesas@verge.net.au>

Setup a thermal zone driven by SoC temperature sensor.
Create passive trip points and bind them to CPUFreq cooling
device that supports power extension.

In R-Car Gen3, IPA is supported for only one channel
(on H3/M3/M3N SoCs, it is channel THS3). Reason:
  Currently, IPA controls base on only CPU temperature.
  And only one thermal channel is assembled closest
  CPU cores is selected as target of IPA.
  If other channels are used, IPA controlling is not properly.

The A57 cooling device supports 5 cooling states which can be categorised
as follows:

0 & 1) boost (clocking up)
2)     default
3 & 4) cooling (clocking down)

Currently the thermal framework assumes that the default is the minimum,
or in other words there is no provision for handling boost states.
So this patch only describes the upper 3 states, default and cooling.

A single cooling device is described for all A57 CPUs and a separate
cooling device is described for all A53 CPUs. This reflects that physically
there is only one cooling device present for each type of CPU.

This patch improves on an earlier version by:

* Omitting cooling-max-level and cooling-min-level properties which
  are no longer present in mainline as of v4.17
* Removing an unused trip-point0 node sub-property from the trips
  property.
* Using cooling-device indexes such that maximum refers to maximum cooling
  rather than the inverse.
* Defers adding dynamic-power-coefficient properties to a separate patch as
  these are properties of the CPU.

The long signed-off by chain below reflects many revisions, mainly
internal, that this patch has been through.
Signed-off-by: NDien Pham <dien.pham.ry@renesas.com>
Signed-off-by: NAn Huynh <an.huynh.uj@rvc.renesas.com>
Signed-off-by: NTakeshi Kihara <takeshi.kihara.df@renesas.com>
Signed-off-by: NYoshihiro Kaneko <ykaneko0929@gmail.com>
Signed-off-by: NSimon Horman <horms+renesas@verge.net.au>

Describe the dynamic power coefficient of A57 and A53 CPUs.

Based on work by Gaku Inami <gaku.inami.xw@bp.renesas.com> and others.
Signed-off-by: NSimon Horman <horms+renesas@verge.net.au>

Setup a thermal zone driven by SoC temperature sensor.
Create passive trip points and bind them to CPUFreq cooling
device that supports power extension.

In R-Car Gen3, IPA is supported for only one channel
 (on H3/M3/M3N SoCs, it is channel THS3). Reason:
  Currently, IPA controls base on only CPU temperature.
  And only one thermal channel is assembled closest
  CPU cores is selected as target of IPA.
  If other channels are used, IPA controlling is not properly.

The A57 cooling device supports 5 cooling states which can be categorised
as follows:

0 & 1) boost (clocking up)
2)     default
3 & 4) cooling (clocking down)

Currently the thermal framework assumes that the default is the minimum,
or in other words there is no provision for handling boost states.
So this patch only describes the upper 3 states, default and cooling.

A single cooling device is described for all A57 CPUs and a separate
cooling device is described for all A53 CPUs. This reflects that physically
there is only one cooling device present for each type of CPU.

This patch improves on an earlier version by:

* Omitting cooling-max-level and cooling-min-level properties which
  are no longer present in mainline as of v4.17
* Removing an unused trip-point0 node sub-property from the trips
  property.
* Using cooling-device indexes such that maximum refers to maximum cooling
  rather than the inverse.
* Defers adding dynamic-power-coefficient properties to a separate patch as
  these are properties of the CPU.

The long signed-off by chain below reflects many revisions, mainly
internal, that this patch has been through.
Signed-off-by: NDien Pham <dien.pham.ry@renesas.com>
Signed-off-by: NHien Dang <hien.dang.eb@rvc.renesas.com>
Signed-off-by: NAn Huynh <an.huynh.uj@rvc.renesas.com>
Signed-off-by: NTakeshi Kihara <takeshi.kihara.df@renesas.com>
Signed-off-by: NYoshihiro Kaneko <ykaneko0929@gmail.com>
Signed-off-by: NSimon Horman <horms+renesas@verge.net.au>

Describe the dynamic power coefficient of A57 and A53 CPUs.

Based on work by Gaku Inami <gaku.inami.xw@bp.renesas.com> and others.
Signed-off-by: NSimon Horman <horms+renesas@verge.net.au>

Setup a thermal zone driven by SoC temperature sensor.
Create passive trip points and bind them to CPUFreq cooling
device that supports power extension.

In R-Car Gen3, IPA is supported for only one channel
(on H3/M3/M3N SoCs, it is channel THS3). Reason:
  Currently, IPA controls base on only CPU temperature.
  And only one thermal channel is assembled closest
  CPU cores is selected as target of IPA.
  If other channels are used, IPA controlling is not properly.

The A5 cooling device supports 5 cooling states which can be categorised as
follows:

0 & 1) boost (clocking up)
2)     default
3 & 4) cooling (clocking down)

Currently the thermal framework assumes that the default is the minimum,
or in other words there is no provision for handling boost states.
So this patch only describes the upper 3 states, default and cooling.

A single cooling device is described for all A57 CPUs and a separate
cooling device is described for all A53 CPUs. This reflects that physically
there is only one cooling device present for each type of CPU.

This patch improves on an earlier version by:

* Omitting cooling-max-level and cooling-min-level properties which
  are no longer present in mainline as of v4.17
* Removing an unused trip-point0 node sub-property from the trips
  property.
* Using cooling-device indexes such that maximum refers to maximum cooling
  rather than the inverse.
* Defers adding dynamic-power-coefficient properties to a separate patch as
  these are properties of the CPU.

The long signed-off by chain below reflects many revisions, mainly
internal, that this patch has been through.
Signed-off-by: NDien Pham <dien.pham.ry@renesas.com>
Signed-off-by: NKeita Kobayashi <keita.kobayashi.ym@renesas.com>
Signed-off-by: NGaku Inami <gaku.inami.xw@bp.renesas.com>
Signed-off-by: NHien Dang <hien.dang.eb@rvc.renesas.com>
Signed-off-by: NAn Huynh <an.huynh.uj@rvc.renesas.com>
Signed-off-by: NTakeshi Kihara <takeshi.kihara.df@renesas.com>
Signed-off-by: NYoshihiro Kaneko <ykaneko0929@gmail.com>
Signed-off-by: NSimon Horman <horms+renesas@verge.net.au>

Since the commit 233da2c9 ("dt-bindings: phy: rcar-gen3-phy-usb2:
Revise #phy-cells property") revised the #phy-cells, this patch follows
the updated document for R-Car Gen3 and RZ/A2 SoCs.
Signed-off-by: NYoshihiro Shimoda <yoshihiro.shimoda.uh@renesas.com>
Signed-off-by: NSimon Horman <horms+renesas@verge.net.au>

It is incorrect to specify the no-ether-link property for the AVB device on
the Ebisu board. This is because the property should only be used when a
board does not provide a proper AVB_LINK signal. However, the Ebisu board
does provide this signal.

As per 87c059e9 ("arm64: dts: renesas: salvator-x: Remove renesas,
no-ether-link property") this fixes a bug:

    Steps to reproduce:
    - start AVB TX stream (Using aplay via MSE),
    - disconnect+reconnect the eth cable,
    - after a reconnection the eth connection goes iteratively up/down
      without user interaction,
    - this may heal after some seconds or even stay for minutes.

    As the documentation specifies, the "renesas,no-ether-link" option
    should be used when a board does not provide a proper AVB_LINK signal.
    There is no need for this option enabled on RCAR H3/M3 Salvator-X/XS
    and ULCB starter kits since the AVB_LINK is correctly handled by HW.

    Choosing to keep or remove the "renesas,no-ether-link" option will have
    impact on the code flow in the following ways:
    - keeping this option enabled may lead to unexpected behavior since the
      RX & TX are enabled/disabled directly from adjust_link function
      without any HW interrogation,
    - removing this option, the RX & TX will only be enabled/disabled after
      HW interrogation. The HW check is made through the LMON pin in PSR
      register which specifies AVB_LINK signal value (0 - at low level;
      1 - at high level).

    In conclusion, the present change is also a safety improvement because
    it removes the "renesas,no-ether-link" option leading to a proper way
    of detecting the link state based on HW interrogation and not on
    software heuristic.

Fixes: 8441ef64 ("arm64: dts: renesas: r8a77990: ebisu: Enable EthernetAVB")
Signed-off-by: NTakeshi Kihara <takeshi.kihara.df@renesas.com>
[simon: updated changelog]
Signed-off-by: NSimon Horman <horms+renesas@verge.net.au>

Apparently this DTS crossed over with commit 31af04cd ("arm64: dts:
Remove inconsistent use of 'arm,armv8' compatible string") and missed
out on the cleanup, so put it right.
Signed-off-by: NRobin Murphy <robin.murphy@arm.com>
Reviewed-by: NGeert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: NSimon Horman <horms+renesas@verge.net.au>

Convert bootargs from ip=dhcp to ip=on
Signed-off-by: NMagnus Damm <damm+renesas@opensource.se>
Signed-off-by: NSimon Horman <horms+renesas@verge.net.au>

This patch enables BT support for the CAT874 board.
Signed-off-by: NBiju Das <biju.das@bp.renesas.com>
Reviewed-by: NGeert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: NSimon Horman <horms+renesas@verge.net.au>

This patch enables WLAN support for the CAT874 board.
Signed-off-by: NBiju Das <biju.das@bp.renesas.com>
Reviewed-by: NGeert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: NSimon Horman <horms+renesas@verge.net.au>

Add tpu device node to dtsi for TPU support on r8a7795 SoC.
Signed-off-by: NCao Van Dong <cv-dong@jinso.co.jp>
Reviewed-by: NGeert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: NSimon Horman <horms+renesas@verge.net.au>

Add tpu device node to dtsi for TPU support on r8a77965 SoC.
Signed-off-by: NCao Van Dong <cv-dong@jinso.co.jp>
Reviewed-by: NGeert Uytterhoeven <geert+renesas@glider.be>
Tested-by: NGeert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: NSimon Horman <horms+renesas@verge.net.au>

Add tpu device node to dtsi for TPU support on r8a7796 SoC.
Signed-off-by: NCao Van Dong <cv-dong@jinso.co.jp>
Reviewed-by: NGeert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: NSimon Horman <horms+renesas@verge.net.au>

This patch adds description of TI WL1837 and links interfaces
to communicate with the IC, namely the SDIO interface to WLAN.
Signed-off-by: NSpyridon Papageorgiou <spapageorgiou@de.adit-jv.com>
Signed-off-by: NSimon Horman <horms+renesas@verge.net.au>

The ports node of vin4 only has one sub-node and thus does
not need #address-cells/#size-cells and the sub-node does
not need an exit.

This addresses the following warning:

 # make dtbs W=1
 ...
 arch/arm64/boot/dts/renesas/r8a77995-draak.dts:492.8-503.4: Warning (graph_child_address): /soc/video@e6ef4000/ports: graph node has single child node 'port@0', #address-cells/#size-cells are not necessary

Fixes: 6a0942c2 ("arm64: dts: renesas: draak: Describe CVBS input")
Cc: Jacopo Mondi <jacopo+renesas@jmondi.org>
Signed-off-by: NSimon Horman <horms+renesas@verge.net.au>
Tested-by: NLaurent Pinchart <laurent.pinchart@ideasonboard.com>
Reviewed-by: NNiklas Söderlund <niklas.soderlund+renesas@ragnatech.se>

The CAT874 board pushes sound via I2S over SSI0 into the
TDA19988BET chip.
This commit wires things up so that we can get sound out of
the HDMI interface.
Signed-off-by: NFabrizio Castro <fabrizio.castro@bp.renesas.com>
Signed-off-by: NSimon Horman <horms+renesas@verge.net.au>

The CAT874 board comes with a HDMI connector, managed by
a TDA19988BET chip, connected to the RZ/G2E SoC via DPAD.
This patch adds the necessary support to the board DT.
Signed-off-by: NFabrizio Castro <fabrizio.castro@bp.renesas.com>
Signed-off-by: NSimon Horman <horms+renesas@verge.net.au>

Add IPMMU-DS0 to the Ethernet-AVB device node.

Based on work by Magnus Damm for the r8a7795.
Signed-off-by: NBiju Das <biju.das@bp.renesas.com>
Reviewed-by: NGeert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: NSimon Horman <horms+renesas@verge.net.au>

Hook up r8a774a1 Audio-DMAC nodes to the IPMMU-MP.

Based on work for the r8a7795 by Magnus Damm.
Signed-off-by: NBiju Das <biju.das@bp.renesas.com>
Reviewed-by: NGeert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: NSimon Horman <horms+renesas@verge.net.au>

Hook up r8a774a1 DMAC nodes to the IPMMUs. In particular SYS-DMAC0
gets tied to IPMMU-DS0, and SYS-DMAC1 and SYS-DMAC2 get tied to IPMMU-DS1.

Based on work for the r8a7796 by Magnus Damm.
Signed-off-by: NBiju Das <biju.das@bp.renesas.com>
Reviewed-by: NGeert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: NSimon Horman <horms+renesas@verge.net.au>

The r8a774a1 has a single FDP1 instance similar to r8a7796.
Signed-off-by: NBiju Das <biju.das@bp.renesas.com>
Reviewed-by: NGeert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: NSimon Horman <horms+renesas@verge.net.au>

Add the DU device to r8a774a1.dtsi in a disabled state.
Signed-off-by: NBiju Das <biju.das@bp.renesas.com>
Signed-off-by: NSimon Horman <horms+renesas@verge.net.au>

The r8a774a1 soc has 5 VSP instances similar to r8a7796.
Signed-off-by: NBiju Das <biju.das@bp.renesas.com>
Reviewed-by: NGeert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: NSimon Horman <horms+renesas@verge.net.au>

Pull UBIFS fixes from Richard Weinberger:

 - build errors wrt xattrs

 - mismerge which lead to a wrong Kconfig ifdef

 - missing endianness conversion

* tag 'upstream-5.2-rc2' of git://git.kernel.org/pub/scm/linux/kernel/git/rw/ubifs:
  ubifs: Convert xattr inum to host order
  ubifs: Use correct config name for encryption
  ubifs: Fix build error without CONFIG_UBIFS_FS_XATTR

Merge yet more updates from Andrew Morton:
 "A few final bits:

   - large changes to vmalloc, yielding large performance benefits

   - tweak the console-flush-on-panic code

   - a few fixes"

* emailed patches from Andrew Morton <akpm@linux-foundation.org>:
  panic: add an option to replay all the printk message in buffer
  initramfs: don't free a non-existent initrd
  fs/writeback.c: use rcu_barrier() to wait for inflight wb switches going into workqueue when umount
  mm/compaction.c: correct zone boundary handling when isolating pages from a pageblock
  mm/vmap: add DEBUG_AUGMENT_LOWEST_MATCH_CHECK macro
  mm/vmap: add DEBUG_AUGMENT_PROPAGATE_CHECK macro
  mm/vmalloc.c: keep track of free blocks for vmap allocation

Pull more Kbuild updates from Masahiro Yamada:

 - remove unneeded use of cc-option, cc-disable-warning, cc-ldoption

 - exclude tracked files from .gitignore

 - re-enable -Wint-in-bool-context warning

 - refactor samples/Makefile

 - stop building immediately if syncconfig fails

 - do not sprinkle error messages when $(CC) does not exist

 - move arch/alpha/defconfig to the configs subdirectory

 - remove crappy header search path manipulation

 - add comment lines to .config to clarify the end of menu blocks

 - check uniqueness of module names (adding new warnings intentionally)

* tag 'kbuild-v5.2-2' of git://git.kernel.org/pub/scm/linux/kernel/git/masahiroy/linux-kbuild: (24 commits)
  kconfig: use 'else ifneq' for Makefile to improve readability
  kbuild: check uniqueness of module names
  kconfig: Terminate menu blocks with a comment in the generated config
  kbuild: add LICENSES to KBUILD_ALLDIRS
  kbuild: remove 'addtree' and 'flags' magic for header search paths
  treewide: prefix header search paths with $(srctree)/
  media: prefix header search paths with $(srctree)/
  media: remove unneeded header search paths
  alpha: move arch/alpha/defconfig to arch/alpha/configs/defconfig
  kbuild: terminate Kconfig when $(CC) or $(LD) is missing
  kbuild: turn auto.conf.cmd into a mandatory include file
  .gitignore: exclude .get_maintainer.ignore and .gitattributes
  kbuild: add all Clang-specific flags unconditionally
  kbuild: Don't try to add '-fcatch-undefined-behavior' flag
  kbuild: add some extra warning flags unconditionally
  kbuild: add -Wvla flag unconditionally
  arch: remove dangling asm-generic wrappers
  samples: guard sub-directories with CONFIG options
  kbuild: re-enable int-in-bool-context warning
  MAINTAINERS: kbuild: Add pattern for scripts/*vmlinux*
  ...

Pull i2c updates from Wolfram Sang:
 "Some I2C core API additions which are kind of simple but enhance error
  checking for users a lot, especially by returning errno now.

  There are wrappers to still support the old API but it will be removed
  once all users are converted"

* 'i2c/for-next' of git://git.kernel.org/pub/scm/linux/kernel/git/wsa/linux:
  i2c: core: add device-managed version of i2c_new_dummy
  i2c: core: improve return value handling of i2c_new_device and i2c_new_dummy