1. 24 8月, 2018 1 次提交
  2. 25 7月, 2018 1 次提交
  3. 24 7月, 2018 6 次提交
  4. 23 7月, 2018 7 次提交
  5. 22 7月, 2018 5 次提交
  6. 21 7月, 2018 7 次提交
    • T
      ARM: dts: omap4: Add l4 ranges for 4460 · 77036896
      Tony Lindgren 提交于
      Compared to 4430, 4460 and 4470 just have slightly different
      l4 cfg ranges.
      Signed-off-by: NTony Lindgren <tony@atomide.com>
      77036896
    • T
      ARM: dts: omap4: Move l4 child devices to probe them with ti-sysc · 84badc5e
      Tony Lindgren 提交于
      With l4 interconnect hierarchy and ti-sysc interconnect target module
      data in place, we can simply move all the related child devices to
      their proper location and enable probing using ti-sysc.
      
      In general the first child device address range starts at range 0
      from the ti-sysc interconnect target so the move involves adjusting
      the child device reg properties for that.
      
      And we cannot yet move mmu_dsp until we have a proper reset controller
      driver for rstctrl registers.
      
      In case of any regressions, problem devices can be reverted to probe
      with legacy platform data as needed by moving them back and removing
      the related interconnect target module node.
      Signed-off-by: NTony Lindgren <tony@atomide.com>
      84badc5e
    • T
      ARM: dts: omap4: Probe watchdog 3 with ti-sysc · 4bce6786
      Tony Lindgren 提交于
      Before updating wdt2 to probe with ti-sysc we want to have wdt3
      probed with ti-sysc to avoid having them unnecessarily swap order.
      
      With ti-sysc, we probe child devices at module_init time while
      and until l4 abe interconnect is converted to use ti-sysc, wdt3
      will probe earlier with legacy platform data.
      
      Cc: Peter Ujfalusi <peter.ujfalusi@ti.com>
      Signed-off-by: NTony Lindgren <tony@atomide.com>
      4bce6786
    • T
      ARM: dts: omap4: Add l4 interconnect hierarchy and ti-sysc data · 8f42cb7f
      Tony Lindgren 提交于
      Let's add proper interconnect hierarchy for l4 interconnect
      instances with the related ti-sysc interconnect module data as
      documented in Documentation/devicetree/bindings/bus/ti-sysc.txt.
      
      Using ti-sysc driver binding allows us to start dropping
      legacy platform data in arch/arm/mach-omap2/omap*hwmod*data.c
      files later on in favor of ti-sysc dts data.
      
      For setting up a proper hierarchy for the interconnect and
      ti-sysc data, there are multiple reasons:
      
      1. We can use dts ranges to protect registers from being
         ioremapped from other devices and prevent hard to track
         issues with failed flush of posted write between modules
      
      2. Some of the ranges may not be accessible to operating systems
         at all if configured so on high-security devices
      
      3. The interconnect hierarchy provides proper clockdomain
         hierarchy that can be used for genpd later on
      
      4. We can avoid almost all deferred probe related issues simply
         by probing the resource providing interconnect instance first
         for l4 wkup instance
      
      5. With deferred probe issues gone, we can probe everything
         later at module_init time except for system timer and interrupt
         controller and their clocks.
      
      This data is generated based on platform data from a booted system
      and the interconnect acces protection registers for ranges. To avoid
      regressions, we initially validate the device tree provided data
      against the existing platform data on boot.
      
      Each interconnect instance is typically divided into segments
      to avoid powering up the whole interconnect. And each segment
      has one or more ranges TI specific interconnect target modules
      connected to it. Some devices can also have a separate data
      access port directly to the parent L3 interconnect for DMA that
      can be set up as a separate range.
      
      Note that we cannot yet include this file from omap4.dtsi
      until child devices are moved to their proper locations in
      the interconnect hierarchy in the following patch. Otherwise
      we would have the each module probed twice.
      
      Also note that this does not yet add l4 abe instance, that will
      be added separately later on.
      Signed-off-by: NTony Lindgren <tony@atomide.com>
      8f42cb7f
    • A
      ARM: dts: imx7d: remove "operating-points" property for cpu1 · 33a8d5a5
      Anson Huang 提交于
      Commit b97872d4 ("ARM: dts: imx: Add missing OPP properties for CPUs")
      added "operating-points" property for all CPUs, but i.MX7D already has
      "operating-points-v2" property on both CPUs, so no need to add
      "operating-points" property again, this patch removes it.
      
      Fixes: b97872d4 ("ARM: dts: imx: Add missing OPP properties for CPUs")
      Signed-off-by: NAnson Huang <Anson.Huang@nxp.com>
      Signed-off-by: NShawn Guo <shawnguo@kernel.org>
      33a8d5a5
    • A
      ARM: dts: vf610-zii-ssmb-spu3: Fix W=1 level warnings · 55e20919
      Andrey Smirnov 提交于
      Fix a couple of things that were causing warning when building DTB
      with W=1.
      
      Cc: Fabio Estevam <fabio.estevam@nxp.com>
      Cc: cphealy@gmail.com
      Cc: linux-arm-kernel@lists.infradead.org
      Cc: devicetree@vger.kernel.org
      Cc: linux-kernel@vger.kernel.org
      Signed-off-by: NAndrey Smirnov <andrew.smirnov@gmail.com>
      Signed-off-by: NShawn Guo <shawnguo@kernel.org>
      55e20919
    • A
      ARM: dts: vf610: Add ZII CFU1 board · 19fddda1
      Andrey Smirnov 提交于
      Add support for the Zodiac Inflight Innovations CFU1
      board (VF610-based).
      
      Cc: linux-arm-kernel@lists.infradead.org
      Cc: devicetree@vger.kernel.org
      Cc: linux-kernel@vger.kernel.org
      Signed-off-by: NAndrew Lunn <andrew@lunn.ch>
      Signed-off-by: NAndrey Smirnov <andrew.smirnov@gmail.com>
      Tested-by: NChris Healy <cphealy@gmail.com>
      Reviewed-by: NFabio Estevam <fabio.estevam@nxp.com>
      Signed-off-by: NShawn Guo <shawnguo@kernel.org>
      19fddda1
  7. 20 7月, 2018 7 次提交
  8. 19 7月, 2018 6 次提交