1. 03 3月, 2014 1 次提交
  2. 17 1月, 2014 1 次提交
    • L
      thermal: exynos: boost: Automatic enable/disable of BOOST feature (at Exynos4412) · 4f11b85a
      Lukasz Majewski 提交于
      This patch provides auto disable/enable operation for boost. It uses already
      present thermal infrastructure to provide BOOST hysteresis.
      The TMU data is modified to work properly with or without BOOST.
      Hence, the two first trip points with corresponding clip frequencies are
      adjusted.
      
      The first one is reduced from 85 to 70 degrees and the clip frequency is
      increased to 1.4 GHz from 800 MHz. This trip point is in fact responsible
      for providing BOOST hysteresis. When temperature exceeds 70 deg, the maximal
      non BOOST frequency for Exynos4412 is imposed.
      
      Since the first trigger level has been "stolen" for BOOST, the second one
      needs to be a compromise for the previously used two for non BOOST
      configuration. The 95 deg with modified clip freq (to 400 MHz) should provide
      a good balance between cooling down the overheated device and throughput on
      an acceptable level.
      
      Two last trigger levels are not modified since, they cause platform shutdown
      on emergency overheat to happen.
      
      The third trip point passage results in SW managed shut down of the system.
      If the last trip point is crossed, the PMU HW generates the power off
      signal.
      Signed-off-by: NLukasz Majewski <l.majewski@samsung.com>
      Signed-off-by: NMyungjoo Ham <myungjoo.ham@samsung.com>
      Acked-by: NEduardo Valentin <eduardo.valentin@ti.com>
      Reviewed-by: NZhang Rui <rui.zhang@intel.com>
      [rjw: Changelog]
      Signed-off-by: NRafael J. Wysocki <rafael.j.wysocki@intel.com>
      4f11b85a
  3. 14 1月, 2014 1 次提交
  4. 08 1月, 2014 1 次提交
  5. 06 1月, 2014 1 次提交
  6. 03 1月, 2014 3 次提交
  7. 02 1月, 2014 10 次提交
  8. 20 12月, 2013 1 次提交
  9. 04 12月, 2013 5 次提交
    • E
      thermal: ti-soc-thermal: use thermal DT infrastructure · 26d9cc65
      Eduardo Valentin 提交于
      This patch improves the ti-soc-thermal driver by adding the
      support to build the thermal zones based on DT nodes.
      
      The driver will have two options now to build the thermal
      zones. The first option is the zones originally coded
      in this driver. So, the driver behavior will be same
      if there is no DT node describing the zones. The second
      option, when it is found a DT node with thermal data,
      will used the common infrastructure to build the thermal
      zone and bind its cooling devices.
      
      In case the driver loads thermal data using the legacy
      mode, this driver still adds to the system
      a cpufreq cooling device. Loading the thermal data from
      DT, the driver assumes someone else will add the cpufreq
      cooling device, like the cpufreq driver.
      
      Cc: Zhang Rui <rui.zhang@intel.com>
      Cc: linux-pm@vger.kernel.org
      Cc: linux-kernel@vger.kernel.org
      Signed-off-by: NEduardo Valentin <eduardo.valentin@ti.com>
      26d9cc65
    • E
      thermal: cpu_cooling: introduce of_cpufreq_cooling_register · 39d99cff
      Eduardo Valentin 提交于
      This patch introduces an API to register cpufreq cooling device
      based on device tree node.
      
      The registration via device tree node differs from normal
      registration due to the fact that it is needed to fill
      the device_node structure in order to be able to match
      the cooling devices with trip points.
      
      Cc: Zhang Rui <rui.zhang@intel.com>
      Cc: linux-pm@vger.kernel.org
      Cc: linux-kernel@vger.kernel.org
      Signed-off-by: NEduardo Valentin <eduardo.valentin@ti.com>
      39d99cff
    • E
      thermal: core: introduce thermal_of_cooling_device_register · a116b5d4
      Eduardo Valentin 提交于
      This patch adds a new API to allow registering cooling devices
      in the thermal framework derived from device tree nodes.
      
      This API links the cooling device with the device tree node
      so that binding with thermal zones is possible, given
      that thermal zones are pointing to cooling device
      device tree nodes.
      
      Cc: Zhang Rui <rui.zhang@intel.com>
      Cc: linux-pm@vger.kernel.org
      Cc: linux-kernel@vger.kernel.org
      Signed-off-by: NEduardo Valentin <eduardo.valentin@ti.com>
      a116b5d4
    • E
      thermal: introduce device tree parser · 4e5e4705
      Eduardo Valentin 提交于
      This patch introduces a device tree bindings for
      describing the hardware thermal behavior and limits.
      Also a parser to read and interpret the data and feed
      it in the thermal framework is presented.
      
      This patch introduces a thermal data parser for device
      tree. The parsed data is used to build thermal zones
      and thermal binding parameters. The output data
      can then be used to deploy thermal policies.
      
      This patch adds also documentation regarding this
      API and how to define tree nodes to use
      this infrastructure.
      
      Note that, in order to be able to have control
      on the sensor registration on the DT thermal zone,
      it was required to allow changing the thermal zone
      .get_temp callback. For this reason, this patch
      also removes the 'const' modifier from the .ops
      field of thermal zone devices.
      
      Cc: Zhang Rui <rui.zhang@intel.com>
      Cc: linux-pm@vger.kernel.org
      Cc: linux-kernel@vger.kernel.org
      Acked-by: NMark Rutland <mark.rutland@arm.com>
      Signed-off-by: NEduardo Valentin <eduardo.valentin@ti.com>
      4e5e4705
    • E
      thermal: allow registering without .get_temp · 81bd4e1c
      Eduardo Valentin 提交于
      This patch changes the thermal core driver to allow
      registration of thermal zones without the .get_temp callback.
      
      The idea behind this change is to allow lazy registration
      of sensor callbacks.
      
      The thermal zone will be disabled whenever the ops
      does not contain a .get_temp callback. The sysfs interface
      will be returning -EINVAL on any temperature read operation.
      
      Cc: Zhang Rui <rui.zhang@intel.com>
      Cc: linux-pm@vger.kernel.org
      Cc: linux-kernel@vger.kernel.org
      Signed-off-by: NEduardo Valentin <eduardo.valentin@ti.com>
      81bd4e1c
  10. 20 11月, 2013 2 次提交
  11. 06 11月, 2013 2 次提交
  12. 21 10月, 2013 1 次提交
  13. 16 10月, 2013 1 次提交
  14. 15 10月, 2013 4 次提交
  15. 14 10月, 2013 1 次提交
    • D
      Thermal: Check for validity before doing kfree · 732e4c8d
      durgadoss.r@intel.com 提交于
      The thermal_release function is called whenever
      any device belonging to 'thermal' class unregisters.
      This function performs kfree(cdev) without any check.
      In cases where there are more device registrations
      other than just 'thermal_zone' and 'cooling_device'
      this might accidently free memory allocated them
      silently; and cause memory errors.
      
      This patch changes this behavior by doing
      kfree(cdev) only when the device pointer belongs
      to a real cdev i.e. cooling_device.
      Signed-off-by: NDurgadoss R <durgadoss.r@intel.com>
      Signed-off-by: NZhang Rui <rui.zhang@intel.com>
      732e4c8d
  16. 09 10月, 2013 3 次提交
  17. 25 9月, 2013 2 次提交