- 03 8月, 2015 1 次提交
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由 Ni Wade 提交于
The Linux thermal framework support to change thermal governor policy in userspace, but it can't show what available policies supported. This patch adds available_policies attribute to the thermal framework, it can list the thermal governors which can be used for a particular zone. This attribute is read only. Signed-off-by: NWei Ni <wni@nvidia.com> Reviewed-by: NJavi Merino <javi.merino@arm.com> Signed-off-by: NZhang Rui <rui.zhang@intel.com>
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- 04 6月, 2015 1 次提交
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由 kongxinwei 提交于
This patch adds the support for hisilicon thermal sensor, within hisilicon SoC. there will register sensors for thermal framework and use device tree to bind cooling device. Signed-off-by: NLeo Yan <leo.yan@linaro.org> Signed-off-by: Nkongxinwei <kong.kongxinwei@hisilicon.com> Signed-off-by: NEduardo Valentin <edubezval@gmail.com>
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- 28 5月, 2015 1 次提交
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由 Luis R. Rodriguez 提交于
Most code already uses consts for the struct kernel_param_ops, sweep the kernel for the last offending stragglers. Other than include/linux/moduleparam.h and kernel/params.c all other changes were generated with the following Coccinelle SmPL patch. Merge conflicts between trees can be handled with Coccinelle. In the future git could get Coccinelle merge support to deal with patch --> fail --> grammar --> Coccinelle --> new patch conflicts automatically for us on patches where the grammar is available and the patch is of high confidence. Consider this a feature request. Test compiled on x86_64 against: * allnoconfig * allmodconfig * allyesconfig @ const_found @ identifier ops; @@ const struct kernel_param_ops ops = { }; @ const_not_found depends on !const_found @ identifier ops; @@ -struct kernel_param_ops ops = { +const struct kernel_param_ops ops = { }; Generated-by: Coccinelle SmPL Cc: Rusty Russell <rusty@rustcorp.com.au> Cc: Junio C Hamano <gitster@pobox.com> Cc: Andrew Morton <akpm@linux-foundation.org> Cc: Kees Cook <keescook@chromium.org> Cc: Tejun Heo <tj@kernel.org> Cc: Ingo Molnar <mingo@kernel.org> Cc: cocci@systeme.lip6.fr Cc: linux-kernel@vger.kernel.org Signed-off-by: NLuis R. Rodriguez <mcgrof@suse.com> Signed-off-by: NRusty Russell <rusty@rustcorp.com.au>
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- 12 5月, 2015 3 次提交
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由 Eduardo Valentin 提交于
In order to avoid having each driver adding their own specific DT property to specify slope and offset, this patch adds a basic coefficient reading from DT thermal zone node. Right now, as the thermal framework does not support multiple sensors, the current coefficients apply only to the only sensor in the thermal zone. The supported equation is a simple linear model: slope * <sensor reading> + offset. slope and offset are read from the coefficients DT property. In the same way as it is described in the DT thermal binding. So, as of today, the thermal framework will support only cases like: /* hotspot = 1 * adc + 6000 */ coefficients = <1 6000>; Signed-off-by: NEduardo Valentin <edubezval@gmail.com>
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由 Eduardo Valentin 提交于
It is common to have a linear extrapolation from the current sensor readings and the actual temperature value. This is specially the case when the sensor is in use to extrapolate hotspots. This patch adds slope and offset constants for single sensor linear extrapolation equation. Because the same sensor can be use in different locations, from board to board, these constants are added as part of thermal_zone_params. The constants are available through sysfs. It is up to the device driver to determine the usage of these values. Signed-off-by: NEduardo Valentin <edubezval@gmail.com>
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由 Javi Merino 提交于
In situations where there is an uneven number of cooling devices, the division of power among them can lead to a milliwatt being dropped on the floor due to rounding errors. This doesn't sound like a lot, but some devices only grant the lowest cooling device state for their maximum power. So for instance, if the granted_power is the maximum power and all devices are getting their maximum power, one would get max_power - 1, making it choose cooling device state 1, instead of 0. Round the division to make the calculation more accurate. Cc: Zhang Rui <rui.zhang@intel.com> Cc: Eduardo Valentin <edubezval@gmail.com> Signed-off-by: NJavi Merino <javi.merino@arm.com> Signed-off-by: NEduardo Valentin <edubezval@gmail.com>
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- 09 5月, 2015 7 次提交
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由 Nadav Haklai 提交于
Improve the Armada 380 thermal sensor accuracy by using updated formula. The updated formula is: Temperature[C degrees] = 0.4761 * tsen_vsen_out - 279.1 Signed-off-by: NNadav Haklai <nadavh@marvell.com> Signed-off-by: NGregory CLEMENT <gregory.clement@free-electrons.com> Cc: <stable@vger.kernel.org> #v3.16 Signed-off-by: NEduardo Valentin <edubezval@gmail.com>
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由 Dan Carpenter 提交于
There is a copy and paste bug, "->clk" vs "->pclk", so we return the wrong error code here. Fixes: cbac8f63 ('thermal: rockchip: add driver for thermal') Signed-off-by: NDan Carpenter <dan.carpenter@oracle.com> Reviewed-by: NCaesar Wang <wxt@rock-chips.com> Reviewed-by: NDoug Anderson <dianders@chromium.org> Tested-by: NCaesar Wang <wxt@rock-chips.com> Signed-off-by: NZhang Rui <rui.zhang@intel.com>
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由 Jacob Pan 提交于
Package C8 to C10 was introduced in newer Intel CPUs, we need to include them in the package c-state residency calculation. Otherwise, idle injection target is not accurately maintained by the closed control loop. Also cleaned up the code to make it scale better with large number of c-states. Reported-by: NKristen Carlson Accardi <kristen@linux.intel.com> Signed-off-by: NJacob Pan <jacob.jun.pan@linux.intel.com> Signed-off-by: NZhang Rui <rui.zhang@intel.com>
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由 Jacob Pan 提交于
Broadwell server has support for package C-states, idle injection works as expected on this platform. Signed-off-by: NJacob Pan <jacob.jun.pan@linux.intel.com> Signed-off-by: NZhang Rui <rui.zhang@intel.com>
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由 Mathias Krause 提交于
Mark the module init / exit functions with __init / __exit accodingly. This allows making the intel_powerclamp_ids[] array __initconst, too, as it only gets referenced from powerclamp_probe(). This is safe as file2alias doesn't care about the section, but the symbol name for the MODULE_DEVICE_TABLE alias. Cc: Arjan van de Ven <arjan@linux.intel.com> Cc: Jacob Pan <jacob.jun.pan@linux.intel.com> Signed-off-by: NMathias Krause <minipli@googlemail.com> Acked-by: NJacob Pan <jacob.jun.pan@linux.intel.com> Acked-by: NJacob Pan <jacob.jun.pan@linux.intel.com> Signed-off-by: NZhang Rui <rui.zhang@intel.com>
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由 Keerthy 提交于
DESCRIPTION Spurious Thermal Alert: Talert can happen randomly while the device remains under the temperature limit defined for this event to trig. This spurious event is caused by a incorrect re-synchronization between clock domains. The comparison between configured threshold and current temperature value can happen while the value is transitioning (metastable), thus causing inappropriate event generation. No spurious event occurs as long as the threshold value stays unchanged. Spurious event can be generated while a thermal alert threshold is modified in CONTROL_BANDGAP_THRESHOLD_MPU/GPU/CORE/DSPEVE/IVA_n. WORKAROUND Spurious event generation can be avoided by performing following sequence when the threshold is modified: 1. Mask the hot/cold events at the thermal IP level. 2. Modify Threshold. 3. Unmask the hot/cold events at the thermal IP level. Signed-off-by: NKeerthy <j-keerthy@ti.com> Signed-off-by: NEduardo Valentin <edubezval@gmail.com>
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由 Keerthy 提交于
Bandgap Temperature read Dtemp can be corrupted DESCRIPTION Read accesses to registers listed below can be corrupted due to incorrect resynchronization between clock domains. Read access to registers below can be corrupted : • CTRL_CORE_DTEMP_MPU/GPU/CORE/DSPEVE/IVA_n (n = 0 to 4) • CTRL_CORE_TEMP_SENSOR_MPU/GPU/CORE/DSPEVE/IVA_n WORKAROUND Multiple reads to CTRL_CORE_TEMP_SENSOR_MPU/GPU/CORE/DSPEVE/IVA[9:0]: BGAP_DTEMPMPU/GPU/CORE/DSPEVE/IVA is needed to discard false value and read right value: 1. Perform two successive reads to BGAP_DTEMP bit field. (a) If read1 returns Val1 and read2 returns Val1, then right value is Val1. (b) If read1 returns Val1, read 2 returns Val2, a third read is needed. 2. Perform third read (a) If read3 returns Val2 then right value is Val2. (b) If read3 returns Val3, then right value is Val3. The above in gist means if val1 and val2 are the same then we can go ahead with that value else we need a third read which will be right since synchronization will be complete by then. Signed-off-by: NKeerthy <j-keerthy@ti.com> Signed-off-by: NEduardo Valentin <edubezval@gmail.com>
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- 05 5月, 2015 24 次提交
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由 Chanwoo Choi 提交于
This patch adds the support for Exynos5433's TMU (Thermal Management Unit). Exynos5433 has a little different register bit fields as following description: - Support the eight trip points for rising/falling interrupt by using two registers - Read the calibration type (1-point or 2-point) and sensor id from TRIMINFO register - Use a little different register address Cc: Zhang Rui <rui.zhang@intel.com> Cc: Eduardo Valentin <edubezval@gmail.com> Cc: Lukasz Majewski <l.majewski@samsung.com> Signed-off-by: NChanwoo Choi <cw00.choi@samsung.com> Signed-off-by: NEduardo Valentin <edubezval@gmail.com>
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由 Kapileshwar Singh 提交于
Ensure that the CPU for which the frequency is being requested is online. If none of the CPUs are online the requested power is returned as 0. Acked-by: NJavi Merino <javi.merino@arm.com> Signed-off-by: NKapileshwar Singh <kapileshwar.singh@arm.com> Signed-off-by: NEduardo Valentin <edubezval@gmail.com>
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由 Kapileshwar Singh 提交于
It was initially understood that an update to the cpu_device (cached in cpufreq_cooling_device) was required to ascertain the correct operating point of the device on a cpufreq policy->cpu update or creation or deletion of a cpufreq policy. (e.g. when the existing policy CPU goes offline). This update is not required and it is possible to ascertain the OPPs from the leading CPU in a cpufreq domain even if the CPU is hotplugged out. Fixes: e0128d8ab423 ("thermal: cpu_cooling: implement the power cooling device API") Acked-by: NJavi Merino <javi.merino@arm.com> Signed-off-by: NKapileshwar Singh <kapileshwar.singh@arm.com> Signed-off-by: NEduardo Valentin <edubezval@gmail.com>
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由 Javi Merino 提交于
It's useful for tuning to be able to edit thermal_zone_parameters from userspace. Export them to the thermal_zone sysfs so that they can be easily changed. Cc: Zhang Rui <rui.zhang@intel.com> Cc: Eduardo Valentin <edubezval@gmail.com> Signed-off-by: NJavi Merino <javi.merino@arm.com> Signed-off-by: NEduardo Valentin <edubezval@gmail.com>
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由 Javi Merino 提交于
We allocate the power_table in memory but we don't test whether the allocation succeeded. Return -ENOMEM if kcalloc() fails. Fixes: e0128d8ab423 ("thermal: cpu_cooling: implement the power cooling device API") Cc: Eduardo Valentin <edubezval@gmail.com> Cc: Zhang Rui <rui.zhang@intel.com> Reported-by: Nkbuild test robot <fengguang.wu@intel.com> Signed-off-by: NJavi Merino <javi.merino@arm.com> Signed-off-by: NEduardo Valentin <edubezval@gmail.com>
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由 Pavel Machek 提交于
When periodic mode is not enabled, it is neccessary to force reads. Signed-off-by: NPavel Machek <pavel@ucw.cz> Signed-off-by: NEduardo Valentin <edubezval@gmail.com>
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由 Pavel Machek 提交于
For omap3, proper implementation of eocz bit is needed. It was actually a TODO in the driver. Signed-off-by: NPavel Machek <pavel@ucw.cz> Signed-off-by: NEduardo Valentin <edubezval@gmail.com>
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由 Pavel Machek 提交于
Simplify code by removing goto's where they point to simple return. Avoid confusing |= on error values. Correct whitespace. Signed-off-by: NPavel Machek <pavel@ucw.cz> Signed-off-by: NEduardo Valentin <edubezval@gmail.com>
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由 Javi Merino 提交于
A previous version of this patch had a config for THERMAL_POWER_ACTOR but it was dropped. Remove the select as it is not doing anything. Cc: Zhang Rui <rui.zhang@intel.com> Cc: Eduardo Valentin <edubezval@gmail.com> Reported-by: NValentin Rothberg <valentinrothberg@gmail.com> Signed-off-by: NJavi Merino <javi.merino@arm.com> Signed-off-by: NEduardo Valentin <edubezval@gmail.com>
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由 Punit Agrawal 提交于
When registering a thermal zone from device tree, default the trip points to writable. By default, only the root user can change these. This allows the trip points to be tweaked after the system has booted. Cc: Eduardo Valentin <edubezval@gmail.com> Cc: Zhang Rui <rui.zhang@intel.com> Signed-off-by: NPunit Agrawal <punit.agrawal@arm.com> Signed-off-by: NEduardo Valentin <edubezval@gmail.com>
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由 Punit Agrawal 提交于
Add a Kconfig option to allow system integrators to control whether userspace tools can change trip temperatures. This option overrides the thermal zone setup in the driver code and must be enabled for platform specified writable trips to come into effect. The original behaviour of requiring root privileges to change trip temperatures remains unchanged. Cc: Eduardo Valentin <edubezval@gmail.com> Cc: Zhang Rui <rui.zhang@intel.com> Signed-off-by: NPunit Agrawal <punit.agrawal@arm.com> Signed-off-by: NEduardo Valentin <edubezval@gmail.com>
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由 Javi Merino 提交于
8754d5115693 ("thermal: introduce the Power Allocator governor") dropped the const attribute in the struct thermal_zone_device. That means that the thermal_zone_params pointer passed to thermal_zone_device_register() also lost the const qualifier. Drop the const in x86_pkg_temp_thermal.c as well to avoid the following warning as reported by the kbuild test robot: drivers/thermal/x86_pkg_temp_thermal.c: In function 'pkg_temp_thermal_device_add': >> drivers/thermal/x86_pkg_temp_thermal.c:450:31: warning: passing argument 6 of 'thermal_zone_device_register' discards 'const' qualifier from pointer target type phy_dev_entry, &tzone_ops, &pkg_temp_tz_params, 0, 0); ^ In file included from drivers/thermal/x86_pkg_temp_thermal.c:30:0: include/linux/thermal.h:378:29: note: expected 'struct thermal_zone_params *' but argument is of type 'const struct thermal_zone_params *' struct thermal_zone_device *thermal_zone_device_register(const char *, int, int, ^ Cc: Jean Delvare <jdelvare@suse.de> Cc: Zhang Rui <rui.zhang@intel.com> Cc: Eduardo Valentin <edubezval@gmail.com> Signed-off-by: NJavi Merino <javi.merino@arm.com> Signed-off-by: NEduardo Valentin <edubezval@gmail.com>
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由 Punit Agrawal 提交于
Introduce an optional property called, sustainable-power, which represents the power (in mW) which the thermal zone can safely dissipate. If provided the property is parsed and associated with the thermal zone via the thermal zone parameters. Cc: Zhang Rui <rui.zhang@intel.com> Cc: Eduardo Valentin <edubezval@gmail.com> Signed-off-by: NPunit Agrawal <punit.agrawal@arm.com> Signed-off-by: NEduardo Valentin <edubezval@gmail.com>
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由 Javi Merino 提交于
Add trace events for the power allocator governor and the power actor interface of the cpu cooling device. Cc: Zhang Rui <rui.zhang@intel.com> Cc: Eduardo Valentin <edubezval@gmail.com> Cc: Frederic Weisbecker <fweisbec@gmail.com> Cc: Ingo Molnar <mingo@redhat.com> Acked-by: NSteven Rostedt <rostedt@goodmis.org> Signed-off-by: NJavi Merino <javi.merino@arm.com> Signed-off-by: NEduardo Valentin <edubezval@gmail.com>
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由 Javi Merino 提交于
The power allocator governor is a thermal governor that controls system and device power allocation to control temperature. Conceptually, the implementation divides the sustainable power of a thermal zone among all the heat sources in that zone. This governor relies on "power actors", entities that represent heat sources. They can report current and maximum power consumption and can set a given maximum power consumption, usually via a cooling device. The governor uses a Proportional Integral Derivative (PID) controller driven by the temperature of the thermal zone. The output of the controller is a power budget that is then allocated to each power actor that can have bearing on the temperature we are trying to control. It decides how much power to give each cooling device based on the performance they are requesting. The PID controller ensures that the total power budget does not exceed the control temperature. Cc: Zhang Rui <rui.zhang@intel.com> Cc: Eduardo Valentin <edubezval@gmail.com> Signed-off-by: NPunit Agrawal <punit.agrawal@arm.com> Signed-off-by: NJavi Merino <javi.merino@arm.com> Signed-off-by: NEduardo Valentin <edubezval@gmail.com>
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由 Javi Merino 提交于
Add a basic power model to the cpu cooling device to implement the power cooling device API. The power model uses the current frequency, current load and OPPs for the power calculations. The cpus must have registered their OPPs using the OPP library. Cc: Zhang Rui <rui.zhang@intel.com> Cc: Eduardo Valentin <edubezval@gmail.com> Signed-off-by: NKapileshwar Singh <kapileshwar.singh@arm.com> Signed-off-by: NPunit Agrawal <punit.agrawal@arm.com> Signed-off-by: NJavi Merino <javi.merino@arm.com> Signed-off-by: NEduardo Valentin <edubezval@gmail.com>
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由 Javi Merino 提交于
Add three optional callbacks to the cooling device interface to allow them to express power. In addition to the callbacks, add helpers to identify cooling devices that implement the power cooling device API. Cc: Zhang Rui <rui.zhang@intel.com> Cc: Eduardo Valentin <edubezval@gmail.com> Signed-off-by: NJavi Merino <javi.merino@arm.com> Signed-off-by: NEduardo Valentin <edubezval@gmail.com>
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由 Javi Merino 提交于
A governor may need to store its current state between calls to throttle(). That state depends on the thermal zone, so store it as private data in struct thermal_zone_device. The governors may have two new ops: bind_to_tz() and unbind_from_tz(). When provided, these functions let governors do some initialization and teardown when they are bound/unbound to a tz and possibly store that information in the governor_data field of the struct thermal_zone_device. Cc: Zhang Rui <rui.zhang@intel.com> Cc: Eduardo Valentin <edubezval@gmail.com> Signed-off-by: NJavi Merino <javi.merino@arm.com> Signed-off-by: NEduardo Valentin <edubezval@gmail.com>
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由 Ivan T. Ivanov 提交于
Add support for the temperature alarm peripheral found inside Qualcomm plug-and-play (QPNP) PMIC chips. The temperature alarm peripheral outputs a pulse on an interrupt line whenever the thermal over temperature stage value changes. Register a thermal sensor. The temperature reported by this thermal sensor device should reflect the actual PMIC die temperature if an ADC is present on the given PMIC. If no ADC is present, then the reported temperature should be estimated from the over temperature stage value. Cc: David Collins <collinsd@codeaurora.org> Signed-off-by: NIvan T. Ivanov <iivanov@mm-sol.com> Signed-off-by: NEduardo Valentin <edubezval@gmail.com>
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由 Javi Merino 提交于
The fair share governor has the concept of weights, which is the influence of each cooling device in a thermal zone. The current implementation forces the weights of all cooling devices in a thermal zone to add up to a 100. This complicates setups, as you need to know in advance how many cooling devices you are going to have. If you bind a new cooling device, you have to modify all the other cooling devices weights, which is error prone. Furthermore, you can't specify a "default" weight for platforms since that default value depends on the number of cooling devices in the platform. This patch generalizes the concept of weight by allowing any number to be a "weight". Weights are now relative to each other. Platforms that don't specify weights get the same default value for all their cooling devices, so all their cdevs are considered to be equally influential. It's important to note that previous users of the weights don't need to alter the code: percentages continue to work as they used to. This patch just removes the constraint of all the weights in a thermal zone having to add up to a 100. If they do, you get the same behavior as before. If they don't, fair share now works for that platform. Cc: Zhang Rui <rui.zhang@intel.com> Cc: Eduardo Valentin <edubezval@gmail.com> Cc: Durgadoss R <durgadoss.r@intel.com> Acked-by: NDurgadoss R <durgadoss.r@intel.com> Signed-off-by: NJavi Merino <javi.merino@arm.com> Signed-off-by: NEduardo Valentin <edubezval@gmail.com>
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由 Javi Merino 提交于
It's useful to have access to the weights for the cooling devices for thermal zones and change them if needed. Export them to sysfs. Cc: Zhang Rui <rui.zhang@intel.com> Cc: Eduardo Valentin <edubezval@gmail.com> Signed-off-by: NJavi Merino <javi.merino@arm.com> Signed-off-by: NEduardo Valentin <edubezval@gmail.com>
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由 Javi Merino 提交于
s/asscciated/associated/ Cc: Zhang Rui <rui.zhang@intel.com> Cc: Eduardo Valentin <edubezval@gmail.com> Cc: Durgadoss R <durgadoss.r@intel.com> Reviewed-by: NDurgadoss R <durgadoss.r@intel.com> Signed-off-by: NJavi Merino <javi.merino@arm.com> Signed-off-by: NEduardo Valentin <edubezval@gmail.com>
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由 Javi Merino 提交于
The fair share governor is not usable with thermal zones that use the bind op and don't populate thermal_zone_parameters, the majority of them. Now that the weight is in the thermal instance, we can use that in the fair share governor to allow every thermal zone to trivially use this governor. Furthermore, this simplifies the code. Cc: Zhang Rui <rui.zhang@intel.com> Cc: Eduardo Valentin <edubezval@gmail.com> Cc: Durgadoss R <durgadoss.r@intel.com> Reviewed-by: NDurgadoss R <durgadoss.r@intel.com> Signed-off-by: NJavi Merino <javi.merino@arm.com> Signed-off-by: NEduardo Valentin <edubezval@gmail.com>
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由 Kapileshwar Singh 提交于
Currently you can specify the weight of the cooling device in the device tree but that information is not populated to the thermal_bind_params where the fair share governor expects it to be. The of thermal zone device doesn't have a thermal_bind_params structure and arguably it's better to pass the weight inside the thermal_instance as it is specific to the bind of a cooling device to a thermal zone parameter. Core thermal code is fixed to populate the weight in the instance from the thermal_bind_params, so platform code that was passing the weight inside the thermal_bind_params continue to work seamlessly. While we are at it, create a default value for the weight parameter for those thermal zones that currently don't define it and remove the hardcoded default in of-thermal. Cc: Zhang Rui <rui.zhang@intel.com> Cc: "Rafael J. Wysocki" <rjw@rjwysocki.net> Cc: Len Brown <lenb@kernel.org> Cc: Peter Feuerer <peter@piie.net> Cc: Darren Hart <dvhart@infradead.org> Cc: Eduardo Valentin <edubezval@gmail.com> Cc: Kukjin Kim <kgene@kernel.org> Cc: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: NKapileshwar Singh <kapileshwar.singh@arm.com> Signed-off-by: NEduardo Valentin <edubezval@gmail.com>
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- 01 5月, 2015 3 次提交
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由 Joe Perches 提交于
Use the normal return values for bool functions Signed-off-by: NJoe Perches <joe@perches.com> Signed-off-by: NZhang Rui <rui.zhang@intel.com>
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This patch enables intel_powerclamp driver to run on the next-generation Intel(R) Xeon Phi Microarchitecture code named "Knights Landing" Signed-off-by: NDasaratharaman Chandramouli <dasaratharaman.chandramouli@intel.com> Acked-by: NJacob Pan <jacob.jun.pan@linux.intel.com> Signed-off-by: NZhang Rui <rui.zhang@intel.com>
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由 Brian Bian 提交于
Add PCI ID of Skylake thermal reporting device. Signed-off-by: NBrian Bian <brian.bian@intel.com> Signed-off-by: NZhang Rui <rui.zhang@intel.com>
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