The section titled "Configuring Bonding for Maximum Throughput" is
actually section twelve not thirteen, and there are a couple of words
spelled incorrectly.
Signed-off-by: NRick Jones <rick.jones2@hp.com>
Reviewed-by: NNicolas de Pesloüan <nicolas.2p.debian@free.fr>
Signed-off-by: NJay Vosburgh <fubar@us.ibm.com>
Signed-off-by: NDavid S. Miller <davem@davemloft.net>