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由 Robert Jarzmik 提交于
Add support for multiple floors, ie. cascaded docg3 chips. There might be 4 docg3 chips cascaded, sharing the same address space, and providing up to 4 times the storage capacity of a unique chip. Each floor will be seen as an independant mtd device. Signed-off-by: NRobert Jarzmik <robert.jarzmik@free.fr> Reviewed-by: NIvan Djelic <ivan.djelic@parrot.com> Reviewed-by: NMike Dunn <mikedunn@newsguy.com> Signed-off-by: NDavid Woodhouse <David.Woodhouse@intel.com>
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