1. 17 2月, 2011 1 次提交
  2. 19 1月, 2011 1 次提交
  3. 13 1月, 2011 1 次提交
  4. 10 1月, 2011 1 次提交
  5. 09 1月, 2011 1 次提交
  6. 29 10月, 2010 9 次提交
  7. 26 10月, 2010 2 次提交
  8. 21 10月, 2010 1 次提交
  9. 25 9月, 2010 1 次提交
  10. 21 8月, 2010 1 次提交
    • A
      revert "hwmon: f71882fg: add support for the Fintek F71808E" · f2e41e91
      Andrew Morton 提交于
      Revert commit 7721fea3 ("hwmon:
      f71882fg: add support for the Fintek F71808E").
      
      Hans said:
      
      : A second review after I've received a data sheet for this device from
      : Fintek has turned up a few bugs.
      :
      : Unfortunately Giel (nor I) have time to fix this in time for the 2.6.36
      : cycle.  Therefor I would like to see this patch reverted as not having any
      : support for the hwmon function of this superio chip is better then having
      : unreliable support.
      
      Cc: Giel van Schijndel <me@mortis.eu>
      Cc: Jean Delvare <khali@linux-fr.org>
      Cc: Hans de Goede <hdegoede@redhat.com>
      Cc: Jonathan Cameron <jic23@cam.ac.uk>
      Signed-off-by: NAndrew Morton <akpm@linux-foundation.org>
      Signed-off-by: NLinus Torvalds <torvalds@linux-foundation.org>
      f2e41e91
  11. 15 8月, 2010 4 次提交
  12. 10 8月, 2010 4 次提交
  13. 05 8月, 2010 1 次提交
  14. 04 8月, 2010 1 次提交
    • F
      x86, hwmon: Package Level Thermal/Power: pkgtemp hwmon driver · cb84b194
      Fenghua Yu 提交于
      This patch adds a hwmon driver for package level thermal control. The driver
      dumps package level thermal information through sysfs interface so that upper
      level application (e.g. lm_sensor) can retrive the information.
      
      Instead of having the package level hwmon code in coretemp, I write a seperate
      driver pkgtemp because:
      
      First, package level thermal sensors include not only sensors for each core,
      but also sensors for uncore, memory controller or other components in the
      package. Logically it will be clear to have a seperate hwmon driver for package
      level hwmon to monitor wider range of sensors in a package. Merging package
      thermal driver into core thermal driver doesn't make sense and may mislead.
      
      Secondly, merging the two drivers together may cause coding mess. It's easier
      to include various package level sensors info if more sensor information is
      implemented. Coretemp code needs to consider a lot of legacy machine cases.
      Pkgtemp code only considers platform starting from Sandy Bridge.
      
      On a 1Sx4Cx2T Sandy Bridge platform, lm-sensors dumps the pkgtemp and coretemp:
      
      pkgtemp-isa-0000
      Adapter: ISA adapter
      physical id 0: +33.0°C  (high = +79.0°C, crit = +99.0°C)
      
      coretemp-isa-0000
      Adapter: ISA adapter
      Core 0:      +32.0°C  (high = +79.0°C, crit = +99.0°C)
      
      coretemp-isa-0001
      Adapter: ISA adapter
      Core 1:      +32.0°C  (high = +79.0°C, crit = +99.0°C)
      
      coretemp-isa-0002
      Adapter: ISA adapter
      Core 2:      +32.0°C  (high = +79.0°C, crit = +99.0°C)
      
      coretemp-isa-0003
      Adapter: ISA adapter
      Core 3:      +32.0°C  (high = +79.0°C, crit = +99.0°C)
      
      [ hpa: folded v3 patch removing improper global variable "SHOW" ]
      Signed-off-by: NFenghua Yu <fenghua.yu@intel.com>
      LKML-Reference: <1280448826-12004-3-git-send-email-fenghua.yu@intel.com>
      Reviewed-by: NLen Brown <len.brown@intel.com>
      Signed-off-by: NH. Peter Anvin <hpa@linux.intel.com>
      cb84b194
  15. 28 5月, 2010 5 次提交
  16. 25 5月, 2010 1 次提交
  17. 30 3月, 2010 1 次提交
  18. 06 3月, 2010 4 次提交