This patch updates the documentation to explain the driver model
and file layout.
Acked-by: NJonghwa Lee <jonghwa3.lee@samsung.com>
Acked-by: NKukjin Kim <kgene.kim@samsung.com>
Acked-by: NEduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: NAmit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: NEduardo Valentin <eduardo.valentin@ti.com>

This movement is needed because the hwmon entries and corresponding sysfs
interface is a duplicate of utilities already provided by
driver/thermal/thermal_sys.c.  The goal is to place it in thermal folder
and add necessary functions to use the in-kernel thermal interfaces.
Signed-off-by: NAmit Daniel Kachhap <amit.kachhap@linaro.org>
Acked-by: NGuenter Roeck <guenter.roeck@ericsson.com>
Cc: SangWook Ju <sw.ju@samsung.com>
Cc: Durgadoss <durgadoss.r@intel.com>
Cc: Len Brown <lenb@kernel.org>
Cc: Jean Delvare <khali@linux-fr.org>
Cc: Kyungmin Park <kmpark@infradead.org>
Cc: Kukjin Kim <kgene.kim@samsung.com>
Signed-off-by: NAndrew Morton <akpm@linux-foundation.org>
Signed-off-by: NAmit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

This patch allows to read temperature
from TMU(Thermal Management Unit) of SAMSUNG EXYNOS4 series of SoC.
Signed-off-by: NDonggeun Kim <dg77.kim@samsung.com>
Signed-off-by: NMyungJoo Ham <myungjoo.ham@samsung.com>
Signed-off-by: NKyungmin Park <kyungmin.park@samsung.com>
Signed-off-by: NGuenter Roeck <guenter.roeck@ericsson.com>