- 20 1月, 2017 1 次提交
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由 Wolfram Sang 提交于
Signed-off-by: NHien Dang <hien.dang.eb@renesas.com> Signed-off-by: NKhiem Nguyen <khiem.nguyen.xt@renesas.com> Signed-off-by: NWolfram Sang <wsa+renesas@sang-engineering.com> Signed-off-by: NNiklas Söderlund <niklas.soderlund+renesas@ragnatech.se> Signed-off-by: NEduardo Valentin <edubezval@gmail.com>
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- 23 11月, 2016 1 次提交
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由 Shawn Lin 提交于
"rockchip,hw-tshut-temp", "rockchip,hw-tshut-mode" and "rockchip,hw-tshut-polarity" are not a required properties actually as the code could also work by loading the default settings there. So it is apprently misleading, although we prefer to get these from DT. And it seems we miss the 'rockchip,grf' here which should also be an optional property. Acked-by: NRob Herring <robh@kernel.org> Reviewed-by: NHeiko Stuebner <heiko@sntech.de> Signed-off-by: NShawn Lin <shawn.lin@rock-chips.com> Signed-off-by: NEduardo Valentin <edubezval@gmail.com>
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- 27 9月, 2016 4 次提交
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由 Wei Ni 提交于
Add HW throttle configuration sub-node for soctherm, which is used to describe the throttle event, and worked as a cooling device. The "hot" type trip in thermal zone can be bound to this cooling device, and trigger the throttle function. Signed-off-by: NWei Ni <wni@nvidia.com> Acked-by: NRob Herring <robh@kernel.org> Signed-off-by: NZhang Rui <rui.zhang@intel.com>
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由 dawei.chien@mediatek.com 提交于
This adds the device tree binding documentation for the mediatek thermal controller found on Mediatek MT2701. Signed-off-by: NDawei Chien <dawei.chien@mediatek.com> Reviewed-by: NKeerthy <j-keerthy@ti.com> Acked-by: NRob Herring <robh@kernel.org> Signed-off-by: NZhang Rui <rui.zhang@intel.com>
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由 Laxman Dewangan 提交于
Maxim Semiconductor MAX77620 supports alarm interrupts when its die temperature crosses 120C and 140C. These threshold temperatures are not configurable. Add DT binding document to details out the DT property related to MAX77620 thermal functionality. Signed-off-by: NLaxman Dewangan <ldewangan@nvidia.com> Acked-by: NRob Herring <robh@kernel.org> Signed-off-by: NZhang Rui <rui.zhang@intel.com>
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由 Rajendra Nayak 提交于
TSENS is Qualcomms' thermal temperature sensor device. It supports reading temperatures from multiple thermal sensors present on various QCOM SoCs. Calibration data is generally read from a non-volatile memory (eeprom) device. Add a skeleton driver with all the necessary abstractions so a variety of qcom device families which support TSENS can add driver extensions. Also add the required device tree bindings which can be used to describe the TSENS device in DT. Signed-off-by: NRajendra Nayak <rnayak@codeaurora.org> Reviewed-by: NLina Iyer <lina.iyer@linaro.org> Signed-off-by: NEduardo Valentin <edubezval@gmail.com> Signed-off-by: NZhang Rui <rui.zhang@intel.com>
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- 19 8月, 2016 1 次提交
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由 Caesar Wang 提交于
See the thermal code, the obvious typo from my editor. Signed-off-by: NCaesar Wang <wxt@rock-chips.com> Signed-off-by: NEduardo Valentin <edubezval@gmail.com> Signed-off-by: NZhang Rui <rui.zhang@intel.com>
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- 17 5月, 2016 4 次提交
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由 Laxman Dewangan 提交于
Sometimes, thermal sensors like NCT thermistors are connected to the ADC channel. The temperature is read by reading the voltage across the sensor resistance via ADC and referring the lookup table for ADC value to temperature. Add DT binding doc for the ADC based thermal sensor driver to detail the DT property and provide the example for how to use it. Signed-off-by: NLaxman Dewangan <ldewangan@nvidia.com> Acked-by: NRob Herring <rob@kernel.org> Signed-off-by: NEduardo Valentin <edubezval@gmail.com>
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由 Marc Gonzalez 提交于
The Tango thermal driver provides support for the primitive temperature sensor embedded in Tango chips since the SMP8758. This sensor only generates a 1-bit signal to indicate whether the die temperature exceeds a programmable threshold. Signed-off-by: NMarc Gonzalez <marc_gonzalez@sigmadesigns.com> Signed-off-by: NEduardo Valentin <edubezval@gmail.com>
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由 Simon Horman 提交于
The latest information that I have is that there is no thermal IP block present on the r8a7794 SoC so remove the corresponding binding. Cc: Geert Uytterhoeven <geert+renesas@glider.be> Acked-by: NGeert Uytterhoeven <geert+renesas@glider.be> Signed-off-by: NSimon Horman <horms+renesas@verge.net.au> Signed-off-by: NEduardo Valentin <edubezval@gmail.com>
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由 Wei Ni 提交于
The "critical" type trip in thermal zone can be set to SOC_THERM hardware, it can trigger shut down or reset event from hardware. Signed-off-by: NWei Ni <wni@nvidia.com> Acked-by: NRob Herring <robh@kernel.org> Signed-off-by: NEduardo Valentin <edubezval@gmail.com>
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- 20 4月, 2016 2 次提交
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由 Thierry Reding 提交于
Device tree binding for NVIDIA Tegra have traditionally carried the "nvidia," vendor prefix in the filename. A couple of odd ones don't, so fix them up for consistency. Also rename existing bindings to reflect the first compatible value that they document. This wasn't done consistently either. Acked-by: NStephen Warren <swarren@nvidia.com> Signed-off-by: NThierry Reding <treding@nvidia.com> Signed-off-by: NRob Herring <robh@kernel.org>
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由 Thierry Reding 提交于
When Tegra124 support was first merged the unit-addresses of all devices were listed with a "0," prefix to encode the reg property's second cell. It turns out that this notation is not correct, and the "," separator is only used to separate fields in the unit address (such as the device and function number in PCI devices), not individual cells for addresses with more than one cell. Acked-by: NStephen Warren <swarren@nvidia.com> Signed-off-by: NThierry Reding <treding@nvidia.com> Signed-off-by: NRob Herring <robh@kernel.org>
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- 09 3月, 2016 3 次提交
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由 Javier Martinez Canillas 提交于
The Exynos Thermal Management Unit binding says that the vtmu-supply is optional but is listed in the required properties section. Add an optional properties section and move the regulator property there. Acked-by: NRob Herring <robh@kernel.org> Reviewed-by: NKrzysztof Kozlowski <k.kozlowski@samsung.com> Reviewed-by: NAndi Shyti <andi.shyti@samsung.com> Signed-off-by: NJavier Martinez Canillas <javier@osg.samsung.com> Signed-off-by: NEduardo Valentin <edubezval@gmail.com>
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由 Krzysztof Kozlowski 提交于
Document the number of configurable temperature thresholds (for trip-points in interrupt-driven mode). Acked-by: NRob Herring <robh@kernel.org> Reviewed-by: NChanwoo Choi <cw00.choi@samsung.com> Signed-off-by: NKrzysztof Kozlowski <k.kozlowski@samsung.com> Signed-off-by: NEduardo Valentin <edubezval@gmail.com>
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由 Krzysztof Kozlowski 提交于
Commit 488c7455 ("thermal: exynos: Add the support for Exynos5433 TMU") added new compatible but forgot to update documentation. Acked-by: NRob Herring <robh@kernel.org> Reviewed-by: NChanwoo Choi <cw00.choi@samsung.com> Signed-off-by: NKrzysztof Kozlowski <k.kozlowski@samsung.com> Signed-off-by: NEduardo Valentin <edubezval@gmail.com>
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- 18 2月, 2016 1 次提交
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由 Sascha Hauer 提交于
This adds the device tree binding documentation for the mediatek thermal controller found on Mediatek MT8173 and other SoCs. Signed-off-by: NSascha Hauer <s.hauer@pengutronix.de> Reviewed-by: NDaniel Kurtz <djkurtz@chromium.org> Acked-by: NRob Herring <robh@kernel.org> Signed-off-by: NEduardo Valentin <edubezval@gmail.com>
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- 10 2月, 2016 1 次提交
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由 Kuninori Morimoto 提交于
This patch enables to use thermal-zone on DT if it was calles as "renesas,rcar-thermal-gen2". Previous style (= non thermal-zone) is still supported by "renesas,rcar-thermal" to keep compatibility for "git bisect". Signed-off-by: NKuninori Morimoto <kuninori.morimoto.gx@renesas.com> Signed-off-by: NEduardo Valentin <edubezval@gmail.com>
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- 07 1月, 2016 1 次提交
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由 Caesar Wang 提交于
This patchset attempts to new compatible for thermal founding on RK3228/RK3399 SoCs. Signed-off-by: NCaesar Wang <wxt@rock-chips.com> Acked-by: NRob Herring <robh@kernel.org> Signed-off-by: NEduardo Valentin <edubezval@gmail.com>
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- 24 12月, 2015 1 次提交
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由 Hongtao Jia 提交于
Add bindings documentation for TMU (Thermal Monitoring Unit) on QorIQ platform. Signed-off-by: NJia Hongtao <hongtao.jia@freescale.com> Reviewed-by: NScott Wood <scottwood@freescale.com> Acked-by: NRob Herring <robh@kernel.org> Signed-off-by: NScott Wood <scottwood@freescale.com>
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- 13 11月, 2015 1 次提交
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由 Caesar Wang 提交于
This patchset attempts to new compatible for thermal founding on RK3368 SoCs. Signed-off-by: NCaesar Wang <wxt@rock-chips.com> Acked-by: NRob Herring <robh@kernel.org> Signed-off-by: NEduardo Valentin <edubezval@gmail.com>
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- 04 11月, 2015 1 次提交
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由 Caesar Wang 提交于
The "init" pinctrl is defined we'll set pinctrl to this state before probe and then "default" after probe. Add the "init" and "sleep" pinctrl as the OTP gpio state, since we need switch the pin to gpio state before the TSADC controller is reset. AFAIK, the TSADC controller is reset, the tshut polarity will be a *low* signal in a short period of time for some devices. Says: The TSADC get the temperature on rockchip thermal. If T(current temperature) < (setting temperature), the OTP output the *high* signal. If T(current temperature) > (setting temperature), the OTP output the *low* Signal. In some cases, the OTP pin is connected to the PMIC, maybe the PMIC can accept the reset response time to avoid this issue. In other words, the system will be always reboot if we make the OTP pin is connected the others IC to control the power. Acked-by: NRob Herring <robh@kernel.org> Signed-off-by: NCaesar Wang <wxt@rock-chips.com> Reviewed-by: NDouglas Anderson <dianders@chromium.org> Signed-off-by: NEduardo Valentin <edubezval@gmail.com>
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- 30 9月, 2015 2 次提交
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由 Eduardo Valentin 提交于
Add OMAP36xx support to ti-soc-thermal driver. This chip is also unreliable. The data provided here is based on OMAP36xx TRM: http://www.ti.com/lit/ug/swpu177aa/swpu177aa.pdfSigned-off-by: NEduardo Valentin <edubezva@gmail.com> Signed-off-by: NEduardo Valentin <edubezval@gmail.com>
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由 Pavel Machek 提交于
This adds support for OMAP3 chips to ti-soc-thermal. As requested by TI people, it is marked unreliable and warning is printed. Signed-off-by: NPavel Machek <pavel@ucw.cz> Signed-off-by: NEduardo Valentin <edubezval@gmail.com>
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- 18 9月, 2015 2 次提交
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由 Punit Agrawal 提交于
The cooling-{min,max}-level properties are marked as optional in Documentation/devicetree/bindings/cpufreq/cpufreq-dt.txt and the usage in various device tree matches this, i.e., some cooling device in the device trees provide these properties while others do not. Make the bindings in Documentation/devicetree/bindings/thermal/thermal.txt consistent with the cpufreq-dt bindings by marking the cooling-*-level properties as optional. Signed-off-by: NPunit Agrawal <punit.agrawal@arm.com> Cc: Eduardo Valentin <edubezval@gmail.com> Cc: Rob Herring <robh+dt@kernel.org> Cc: Mark Rutland <mark.rutland@arm.com> Cc: Ian Campbell <ijc+devicetree@hellion.org.uk> Cc: Kumar Gala <galak@codeaurora.org> Signed-off-by: NRob Herring <robh@kernel.org>
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由 Punit Agrawal 提交于
The device trees in the kernel as well as the binding description in Documentation/devicetree/bindings/cpufreq/cpufreq-dt.txt use the cooling-{min,max}-level property. Fix the inconsistency with the binding description in Documentation/devicetree/bindings/thermal/thermal.txt by changing cooling-*-state properties to cooling-*-level. Signed-off-by: NPunit Agrawal <punit.agrawal@arm.com> Cc: Eduardo Valentin <edubezval@gmail.com> Cc: Rob Herring <robh+dt@kernel.org> Cc: Mark Rutland <mark.rutland@arm.com> Cc: Ian Campbell <ijc+devicetree@hellion.org.uk> Cc: Kumar Gala <galak@codeaurora.org> Signed-off-by: NRob Herring <robh@kernel.org>
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- 04 6月, 2015 1 次提交
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由 kongxinwei 提交于
This adds documentation of device tree bindings for the thermal sensor controller of hi6220 SoC. Signed-off-by: NLeo Yan <leo.yan@linaro.org> Signed-off-by: Nkongxinwei <kong.kongxinwei@hisilicon.com> Signed-off-by: NEduardo Valentin <edubezval@gmail.com>
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- 05 5月, 2015 2 次提交
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由 Punit Agrawal 提交于
Introduce an optional property called, sustainable-power, which represents the power (in mW) which the thermal zone can safely dissipate. If provided the property is parsed and associated with the thermal zone via the thermal zone parameters. Cc: Zhang Rui <rui.zhang@intel.com> Cc: Eduardo Valentin <edubezval@gmail.com> Signed-off-by: NPunit Agrawal <punit.agrawal@arm.com> Signed-off-by: NEduardo Valentin <edubezval@gmail.com>
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由 Ivan T. Ivanov 提交于
Add support for the temperature alarm peripheral found inside Qualcomm plug-and-play (QPNP) PMIC chips. The temperature alarm peripheral outputs a pulse on an interrupt line whenever the thermal over temperature stage value changes. Register a thermal sensor. The temperature reported by this thermal sensor device should reflect the actual PMIC die temperature if an ADC is present on the given PMIC. If no ADC is present, then the reported temperature should be estimated from the over temperature stage value. Cc: David Collins <collinsd@codeaurora.org> Signed-off-by: NIvan T. Ivanov <iivanov@mm-sol.com> Signed-off-by: NEduardo Valentin <edubezval@gmail.com>
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- 08 4月, 2015 1 次提交
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由 Geert Uytterhoeven 提交于
r8a73a4 is R-Mobile APE6, not AP6. Signed-off-by: NGeert Uytterhoeven <geert+renesas@glider.be> Signed-off-by: NEduardo Valentin <edubezval@gmail.com>
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- 04 2月, 2015 1 次提交
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由 Paul Walmsley 提交于
Align compatible strings for several IP blocks present on Tegra chips with the latest doctrine from the DT maintainers: http://marc.info/?l=devicetree&m=142255654213019&w=2 The primary objective here is to avoid checkpatch warnings, per: http://marc.info/?l=linux-tegra&m=142201349727836&w=2 DT binding text files have been updated for the following IP blocks: - PCIe - SOR - SoC timers - AHB "gizmo" - APB_MISC - pinmux control - UART - PWM - I2C - SPI - RTC - PMC - eFuse - AHCI - HDA - XUSB_PADCTRL - SDHCI - SOC_THERM - AHUB - I2S - EHCI - USB PHY N.B. The nvidia,tegra20-timer compatible string is removed from the nvidia,tegra30-timer.txt documentation file because it's already mentioned in the nvidia,tegra20-timer.txt documentation file. This second version takes into account the following requests from Rob Herring <robherring2@gmail.com>: - Per-IP block patches have been combined into a single patch - Explicit documentation about which compatible strings are actually matched by the driver has been removed. In its place is implicit documentation that loosely follows Rob's prescribed format: "Must contain '"nvidia,<chip>-pcie", "nvidia,tegra20-pcie"' where <chip> is tegra30, tegra132, ..." [...] "You should attempt to document known values of <chip> if you use it" Signed-off-by: NPaul Walmsley <paul@pwsan.com> Cc: Alexandre Courbot <gnurou@gmail.com> Cc: Dylan Reid <dgreid@chromium.org> Cc: Greg Kroah-Hartman <gregkh@linuxfoundation.org> Cc: Hans de Goede <hdegoede@redhat.com> Cc: Ian Campbell <ijc+devicetree@hellion.org.uk> Cc: Jingchang Lu <jingchang.lu@freescale.com> Cc: John Crispin <blogic@openwrt.org> Cc: Kumar Gala <galak@codeaurora.org> Cc: Linus Walleij <linus.walleij@linaro.org> Cc: Mark Rutland <mark.rutland@arm.com> Cc: Mikko Perttunen <mperttunen@nvidia.com> Cc: Murali Karicheri <m-karicheri2@ti.com> Cc: Paul Walmsley <pwalmsley@nvidia.com> Cc: Pawel Moll <pawel.moll@arm.com> Cc: Peter De Schrijver <pdeschrijver@nvidia.com> Cc: Peter Hurley <peter@hurleysoftware.com> Cc: Sean Paul <seanpaul@chromium.org> Cc: Stephen Warren <swarren@wwwdotorg.org> Cc: Takashi Iwai <tiwai@suse.de> Cc: Tejun Heo <tj@kernel.org> Cc: "Terje Bergström" <tbergstrom@nvidia.com> Cc: Thierry Reding <thierry.reding@gmail.com> Cc: Tuomas Tynkkynen <ttynkkynen@nvidia.com> Cc: Wolfram Sang <wsa@the-dreams.de> Cc: Zhang Rui <rui.zhang@intel.com> Cc: dri-devel@lists.freedesktop.org Cc: linux-i2c@vger.kernel.org Cc: linux-kernel@vger.kernel.org Cc: linux-pci@vger.kernel.org Cc: linux-pm@vger.kernel.org Cc: linux-pwm@vger.kernel.org Cc: linux-tegra@vger.kernel.org Acked-by: NEduardo Valentin <edubezval@gmail.com> Signed-off-by: NRob Herring <robh@kernel.org>
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- 01 2月, 2015 1 次提交
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由 Abhilash Kesavan 提交于
Add documentation for exynos7 thermal bindings including compatible name and special clock properties. Acked-by: NLukasz Majewski <l.majewski@samsung.com> Signed-off-by: NAbhilash Kesavan <a.kesavan@samsung.com> Signed-off-by: NEduardo Valentin <edubezval@gmail.com>
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- 29 1月, 2015 1 次提交
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由 Srinivas Kandagatla 提交于
There are various issues with the examples in this documentation, some of the DT labels are invalid and one of the macro THERMAL_NO_LIMITS referenced is not available as well. This patch attempts to fix such errors in the documentation. Signed-off-by: NSrinivas Kandagatla <srinivas.kandagatla@linaro.org> Signed-off-by: NEduardo Valentin <edubezval@gmail.com>
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- 25 1月, 2015 2 次提交
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由 Lukasz Majewski 提交于
Updating exynos-thermal.txt documentation entry for Exynos5440 Signed-off-by: NLukasz Majewski <l.majewski@samsung.com> Signed-off-by: NEduardo Valentin <edubezval@gmail.com>
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由 Lukasz Majewski 提交于
Properties necessary for providing Exynos thermal configuration via device tree. Signed-off-by: NLukasz Majewski <l.majewski@samsung.com> Signed-off-by: NEduardo Valentin <edubezval@gmail.com>
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- 25 11月, 2014 2 次提交
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由 Ezequiel Garcia 提交于
The Armada 375 Z1 SoC revision is no longer supported. This commit removes the quirk needed for the thermal sensor. Acked-by: NJason Cooper <jason@lakedaemon.net> Signed-off-by: NEzequiel Garcia <ezequiel.garcia@free-electrons.com> Signed-off-by: NEduardo Valentin <edubezval@gmail.com>
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由 Caesar Wang 提交于
This add the necessary binding documentation for the thermal found on Rockchip SoCs Signed-off-by: Nzhaoyifeng <zyf@rock-chips.com> Signed-off-by: NCaesar Wang <caesar.wang@rock-chips.com> Reviewed-by: NDmitry Torokhov <dmitry.torokhov@gmail.com> Signed-off-by: NEduardo Valentin <edubezval@gmail.com>
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- 20 11月, 2014 1 次提交
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由 Mikko Perttunen 提交于
This adds binding documentation and headers for the Tegra124 SOCTHERM device tree node. Signed-off-by: NMikko Perttunen <mperttunen@nvidia.com> Acked-by: NStephen Warren <swarren@nvidia.com> Acked-by: NEduardo Valentin <edubezval@gmail.com> Signed-off-by: NEduardo Valentin <edubezval@gmail.com>
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- 03 11月, 2014 1 次提交
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由 Geert Uytterhoeven 提交于
- r8a7792 (R-Car V2H) - r8a7793 (R-Car M2-N) - r8a7794 (R-Car E2) r8a7791 is now called "R-Car M2-W". Signed-off-by: NGeert Uytterhoeven <geert+renesas@glider.be> Signed-off-by: NEduardo Valentin <edubezval@gmail.com>
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- 09 8月, 2014 1 次提交
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由 Anson Huang 提交于
i.MX6SX has some new features of thermal interrupt function, there are LOW, HIGH and PANIC irq for thermal sensor, so add platform data to separate different thermal version; The reset value of LOW ALARM is 0 which means the highest temp, so the LOW ALARM will be triggered once irq is enabled, so we need to correct it before enabling thermal irq; Enable PANIC ALARM as critical trip point, it will trigger system reset via SRC module once PANIC IRQ is triggered, it is pure hardware function, so use it instead of software reset by cooling device. Signed-off-by: NAnson Huang <b20788@freescale.com> Tested-by: NShawn Guo <shawn.guo@linaro.org> Signed-off-by: NEduardo Valentin <edubezval@gmail.com>
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