1. 27 12月, 2017 1 次提交
  2. 07 12月, 2017 1 次提交
  3. 19 8月, 2016 1 次提交
  4. 18 9月, 2015 2 次提交
    • P
      of: thermal: Mark cooling-*-level properties optional · 9fa04fbe
      Punit Agrawal 提交于
      The cooling-{min,max}-level properties are marked as optional in
      Documentation/devicetree/bindings/cpufreq/cpufreq-dt.txt and the usage
      in various device tree matches this, i.e., some cooling device in the
      device trees provide these properties while others do not.
      
      Make the bindings in
      Documentation/devicetree/bindings/thermal/thermal.txt consistent with
      the cpufreq-dt bindings by marking the cooling-*-level properties as
      optional.
      Signed-off-by: NPunit Agrawal <punit.agrawal@arm.com>
      Cc: Eduardo Valentin <edubezval@gmail.com>
      Cc: Rob Herring <robh+dt@kernel.org>
      Cc: Mark Rutland <mark.rutland@arm.com>
      Cc: Ian Campbell <ijc+devicetree@hellion.org.uk>
      Cc: Kumar Gala <galak@codeaurora.org>
      Signed-off-by: NRob Herring <robh@kernel.org>
      9fa04fbe
    • P
      of: thermal: Fix inconsitency between cooling-*-state and cooling-*-level · eb168b70
      Punit Agrawal 提交于
      The device trees in the kernel as well as the binding description in
      Documentation/devicetree/bindings/cpufreq/cpufreq-dt.txt use the
      cooling-{min,max}-level property.
      
      Fix the inconsistency with the binding description in
      Documentation/devicetree/bindings/thermal/thermal.txt by changing
      cooling-*-state properties to cooling-*-level.
      Signed-off-by: NPunit Agrawal <punit.agrawal@arm.com>
      Cc: Eduardo Valentin <edubezval@gmail.com>
      Cc: Rob Herring <robh+dt@kernel.org>
      Cc: Mark Rutland <mark.rutland@arm.com>
      Cc: Ian Campbell <ijc+devicetree@hellion.org.uk>
      Cc: Kumar Gala <galak@codeaurora.org>
      Signed-off-by: NRob Herring <robh@kernel.org>
      eb168b70
  5. 05 5月, 2015 1 次提交
  6. 29 1月, 2015 1 次提交
  7. 04 12月, 2013 1 次提交
    • E
      thermal: introduce device tree parser · 4e5e4705
      Eduardo Valentin 提交于
      This patch introduces a device tree bindings for
      describing the hardware thermal behavior and limits.
      Also a parser to read and interpret the data and feed
      it in the thermal framework is presented.
      
      This patch introduces a thermal data parser for device
      tree. The parsed data is used to build thermal zones
      and thermal binding parameters. The output data
      can then be used to deploy thermal policies.
      
      This patch adds also documentation regarding this
      API and how to define tree nodes to use
      this infrastructure.
      
      Note that, in order to be able to have control
      on the sensor registration on the DT thermal zone,
      it was required to allow changing the thermal zone
      .get_temp callback. For this reason, this patch
      also removes the 'const' modifier from the .ops
      field of thermal zone devices.
      
      Cc: Zhang Rui <rui.zhang@intel.com>
      Cc: linux-pm@vger.kernel.org
      Cc: linux-kernel@vger.kernel.org
      Acked-by: NMark Rutland <mark.rutland@arm.com>
      Signed-off-by: NEduardo Valentin <eduardo.valentin@ti.com>
      4e5e4705