1. 03 3月, 2012 2 次提交
    • P
      usb: cp210x: Update to support CP2105 and multiple interface devices · a5360a53
      Preston Fick 提交于
      This patch updates the cp210x driver to support CP210x multiple
      interface devices devices from Silicon Labs. The existing driver
      always sends control requests to interface 0, which is hardcoded in
      the usb_control_msg function calls. This only allows for single
      interface devices to be used, and causes a bug when using ports on an
      interface other than 0 in the multiple interface devices.
      
      Here are the changes included in this patch:
      - Updated the device list to contain the Silicon Labs factory default
        VID/PID for multiple interface CP210x devices
      - Created a cp210x_port_private struct created for each port on
        startup, this struct holds the interface number
      - Added a cp210x_release function to clean up the cp210x_port_private
        memory created on startup
      - Modified usb_get_config and usb_set_config to get a pointer to the
        cp210x_port_private struct, and use the interface number there in the
        usb_control_message wIndex param
      Signed-off-by: NPreston Fick <preston.fick@silabs.com>
      Cc: stable <stable@vger.kernel.org>
      Signed-off-by: NGreg Kroah-Hartman <gregkh@linuxfoundation.org>
      a5360a53
    • G
      Merge tag 'dwc3-for-v3.4' of git://git.kernel.org/pub/scm/linux/kernel/git/balbi/usb into usb-next · 3d717690
      Greg Kroah-Hartman 提交于
      usb: dwc3: changes for v3.4 merge window
      
      Here are the changes for v3.4 merge window.
      
      It includes a new glue layer for Samsung's Exynos platform, a simplification of
      memory management on DWC3 driver by using dev_xxx functions, a few
      optimizations to IRQ handling by dropping memcpy() and using bitshifts, a fix
      for TI's OMAP5430 TX Fifo Allocation, two fixes on USB2 test mode
      implementation (one on debugfs and one on ep0), and several minor changes such
      as whitespace cleanups, simplification of a few parts of the code, decreasing a
      long delay to something a bit saner, dropping a header which was included twice
      and so on.
      
      The highlight on this merge is the support for Samsung's Exynos platform,
      increasing the number of different users for this driver to three.
      
      Note that Samsung Exynos glue layer will only compile on platforms which
      provide implementation for the clk API for now. Once Samsung supports
      pm_runtime, that limitation can be dropped from the Makefile.
      
      Conflicts:
      	drivers/usb/dwc3/gadget.c
      3d717690
  2. 02 3月, 2012 19 次提交
  3. 01 3月, 2012 1 次提交
  4. 29 2月, 2012 18 次提交