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  1. 23 11月, 2016 1 次提交
  3. 27 9月, 2016 2 次提交
  5. 17 5月, 2016 1 次提交
  7. 09 3月, 2016 1 次提交
  9. 30 9月, 2015 2 次提交
  11. 14 9月, 2015 2 次提交
  13. 03 8月, 2015 1 次提交
    • S
      thermal: consistently use int for temperatures · 17e8351a
      由 Sascha Hauer 提交于 
      The thermal code uses int, long and unsigned long for temperatures
in different places.

Using an unsigned type limits the thermal framework to positive
temperatures without need. Also several drivers currently will report
temperatures near UINT_MAX for temperatures below 0°C. This will probably
immediately shut the machine down due to overtemperature if started below
0°C.

'long' is 64bit on several architectures. This is not needed since INT_MAX °mC
is above the melting point of all known materials.

Consistently use a plain 'int' for temperatures throughout the thermal code and
the drivers. This only changes the places in the drivers where the temperature
is passed around as pointer, when drivers internally use another type this is
not changed.
Signed-off-by: NSascha Hauer <s.hauer@pengutronix.de>
Acked-by: NGeert Uytterhoeven <geert+renesas@glider.be>
Reviewed-by: NJean Delvare <jdelvare@suse.de>
Reviewed-by: NLukasz Majewski <l.majewski@samsung.com>
Reviewed-by: NDarren Hart <dvhart@linux.intel.com>
Reviewed-by: NHeiko Stuebner <heiko@sntech.de>
Reviewed-by: NPeter Feuerer <peter@piie.net>
Cc: Punit Agrawal <punit.agrawal@arm.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Cc: Jean Delvare <jdelvare@suse.de>
Cc: Peter Feuerer <peter@piie.net>
Cc: Heiko Stuebner <heiko@sntech.de>
Cc: Lukasz Majewski <l.majewski@samsung.com>
Cc: Stephen Warren <swarren@wwwdotorg.org>
Cc: Thierry Reding <thierry.reding@gmail.com>
Cc: linux-acpi@vger.kernel.org
Cc: platform-driver-x86@vger.kernel.org
Cc: linux-arm-kernel@lists.infradead.org
Cc: linux-omap@vger.kernel.org
Cc: linux-samsung-soc@vger.kernel.org
Cc: Guenter Roeck <linux@roeck-us.net>
Cc: Rafael J. Wysocki <rjw@rjwysocki.net>
Cc: Maxime Ripard <maxime.ripard@free-electrons.com>
Cc: Darren Hart <dvhart@infradead.org>
Cc: lm-sensors@lm-sensors.org
Signed-off-by: NZhang Rui <rui.zhang@intel.com>
      17e8351a
  15. 09 5月, 2015 2 次提交
    • K
      thermal: ti-soc-thermal: OMAP5: Implement Workaround for Errata i813 · e9a90d04
      由 Keerthy 提交于 
      DESCRIPTION

Spurious Thermal Alert: Talert can happen randomly while the device remains
under the temperature limit defined for this event to trig. This spurious
event is caused by a incorrect re-synchronization between clock domains.
The comparison between configured threshold and current temperature value
can happen while the value is transitioning (metastable), thus causing
inappropriate event generation. No spurious event occurs as long as the
threshold value stays unchanged. Spurious event can be generated while a
thermal alert threshold is modified in
CONTROL_BANDGAP_THRESHOLD_MPU/GPU/CORE/DSPEVE/IVA_n.

WORKAROUND

Spurious event generation can be avoided by performing following sequence
when the threshold is modified:
1. Mask the hot/cold events at the thermal IP level.
2. Modify Threshold.
3. Unmask the hot/cold events at the thermal IP level.
Signed-off-by: NKeerthy <j-keerthy@ti.com>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>
      e9a90d04
    • K
      thermal: ti-soc-thermal: dra7: Implement Workaround for Errata i814 · 79010636
      由 Keerthy 提交于 
      Bandgap Temperature read Dtemp can be corrupted

DESCRIPTION
        Read accesses to registers listed below can be corrupted due to
	incorrect resynchronization between clock domains.

        Read access to registers below can be corrupted :
                • CTRL_CORE_DTEMP_MPU/GPU/CORE/DSPEVE/IVA_n (n = 0 to 4)
        • CTRL_CORE_TEMP_SENSOR_MPU/GPU/CORE/DSPEVE/IVA_n

WORKAROUND
    Multiple reads to CTRL_CORE_TEMP_SENSOR_MPU/GPU/CORE/DSPEVE/IVA[9:0]:
    BGAP_DTEMPMPU/GPU/CORE/DSPEVE/IVA is needed to discard false value and
    read right value:
       1. Perform two successive reads to BGAP_DTEMP bit field.
               (a) If read1 returns Val1 and read2 returns Val1, then
       	right value is Val1.
               (b) If read1 returns Val1, read 2 returns Val2, a third
       	read is needed.
       2. Perform third read
               (a) If read3 returns Val2 then right value is Val2.
               (b) If read3 returns Val3, then right value is Val3.

    The above in gist means if val1 and val2 are the same then we can go
    ahead with that value else we need a third read which will be right
    since synchronization will be complete by then.
Signed-off-by: NKeerthy <j-keerthy@ti.com>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>
      79010636
  17. 05 5月, 2015 4 次提交
  19. 25 2月, 2015 2 次提交
  21. 12 12月, 2014 1 次提交
  23. 09 12月, 2014 1 次提交
    • E
      thermal: cpu_cooling: check for the readiness of cpufreq layer · 0f1be51c
      由 Eduardo Valentin 提交于 
      In this patch, the cpu_cooling code checks for the usability of cpufreq
layer before proceeding with the CPU cooling device registration. The
main reason is: CPU cooling device is not usable if cpufreq cannot
switch frequencies.

Similar checks are spread in thermal drivers. Thus, the advantage now
is to have the check in a single place: cpu cooling device registration.
For this reason, this patch also updates the existing drivers that
depend on CPU cooling to simply propagate the error code of the cpu
cooling registration call. Therefore, in case cpufreq is not ready, the
thermal drivers will still return -EPROBE_DEFER, in an attempt to try
again when cpufreq layer gets ready.

Cc: devicetree@vger.kernel.org
Cc: Grant Likely <grant.likely@linaro.org>
Cc: Kukjin Kim <kgene.kim@samsung.com>
Cc: linux-arm-kernel@lists.infradead.org
Cc: linux-kernel@vger.kernel.org
Cc: linux-pm@vger.kernel.org
Cc: linux-samsung-soc@vger.kernel.org
Cc: Naveen Krishna Chatradhi <ch.naveen@samsung.com>
Cc: Rob Herring <robh+dt@kernel.org>
Cc: Zhang Rui <rui.zhang@intel.com>
Acked-by: NViresh Kumar <viresh.kumar@linaro.org>
Signed-off-by: NViresh Kumar <viresh.kumar@linaro.org>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>
      0f1be51c
  25. 20 11月, 2014 1 次提交
    • E
      thermal: of: improve of-thermal sensor registration API · 2251aef6
      由 Eduardo Valentin 提交于 
      Different drivers request API extensions in of-thermal. For this reason,
additional callbacks are required to fit the new drivers needs.

The current API implementation expects the registering sensor driver
to provide a get_temp and get_trend callbacks as function parameters.
As the amount of callbacks is growing, this patch changes the existing
implementation to use a .ops field to hold all the of thermal callbacks
to sensor drivers.

This patch also changes the existing of-thermal users to fit the new
API design. No functional change is introduced in this patch.

Cc: Alexandre Courbot <gnurou@gmail.com>
Cc: devicetree@vger.kernel.org
Cc: Grant Likely <grant.likely@linaro.org>
Cc: Guenter Roeck <linux@roeck-us.net>
Cc: Jean Delvare <jdelvare@suse.de>
Cc: linux-kernel@vger.kernel.org
Cc: linux-pm@vger.kernel.org
Cc: linux-tegra@vger.kernel.org
Cc: lm-sensors@lm-sensors.org
Cc: Rob Herring <robh+dt@kernel.org>
Cc: Stephen Warren <swarren@wwwdotorg.org>
Cc: Thierry Reding <thierry.reding@gmail.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Acked-by: NGuenter Roeck <linux@roeck-us.net>
Tested-by: NMikko Perttunen <mikko.perttunen@kapsi.fi>
Reviewed-by: NMikko Perttunen <mikko.perttunen@kapsi.fi>
Reviewed-by: NAlexandre Courbot <acourbot@nvidia.com>
Reviewed-by: NLukasz Majewski <l.majewski@samsung.com>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>
      2251aef6
  27. 01 7月, 2014 1 次提交
  29. 07 5月, 2014 1 次提交
    • P
      thermal: ti-soc-thermal: clk_round_rate() can return a zero upon error · c68789e5
      由 Paul Walmsley 提交于 
      Treat both negative and zero return values from clk_round_rate() as
errors.  This is needed since subsequent patches will convert
clk_round_rate()'s return value to be an unsigned type, rather than a
signed type, since some clock sources can generate rates higher than
(2^31)-1 Hz.

Eventually, when calling clk_round_rate(), only a return value of zero
will be considered a error.  All other values will be considered valid
rates.  The comparison against values less than 0 is kept to preserve
the correct behavior in the meantime.

This patch also gets rid of a comparison between unsigned and signed
values; a side-benefit.
Signed-off-by: NPaul Walmsley <pwalmsley@nvidia.com>
Cc: Eduardo Valentin <eduardo.valentin@ti.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>
      c68789e5
  31. 08 4月, 2014 1 次提交
  33. 04 12月, 2013 1 次提交
    • E
      thermal: ti-soc-thermal: use thermal DT infrastructure · 26d9cc65
      由 Eduardo Valentin 提交于 
      This patch improves the ti-soc-thermal driver by adding the
support to build the thermal zones based on DT nodes.

The driver will have two options now to build the thermal
zones. The first option is the zones originally coded
in this driver. So, the driver behavior will be same
if there is no DT node describing the zones. The second
option, when it is found a DT node with thermal data,
will used the common infrastructure to build the thermal
zone and bind its cooling devices.

In case the driver loads thermal data using the legacy
mode, this driver still adds to the system
a cpufreq cooling device. Loading the thermal data from
DT, the driver assumes someone else will add the cpufreq
cooling device, like the cpufreq driver.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: NEduardo Valentin <eduardo.valentin@ti.com>
      26d9cc65
  35. 15 10月, 2013 1 次提交
  37. 29 8月, 2013 3 次提交
  39. 08 7月, 2013 1 次提交
    • E
      thermal: ti-soc-thermal: use standard GPIO DT bindings · 57d16171
      由 Eduardo Valentin 提交于 
      This change updates the ti-soc-thermal driver to use
standard GPIO DT bindings to read the GPIO number associated
to thermal shutdown IRQ, in case the device features it.

Previously, the code was using a specific DT bindings.
As now OMAP supports the standard way to model GPIOs,
there is no point in having a ti specific binding.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Grant Likely <grant.likely@linaro.org>
Cc: Rob Herring <rob.herring@calxeda.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Cc: devicetree-discuss@lists.ozlabs.org
Signed-off-by: NEduardo Valentin <eduardo.valentin@ti.com>
      57d16171
  41. 13 6月, 2013 5 次提交
  43. 28 5月, 2013 1 次提交
    • E
      thermal: introduce TI SoC thermal driver · eb982001
      由 Eduardo Valentin 提交于 
      This patch moves the ti-soc-thermal driver out of
the staging tree to the thermal tree.

Cc: Grant Likely <grant.likely@linaro.org>
Cc: Rob Herring <rob.herring@calxeda.com>
Cc: Rob Landley <rob@landley.net>
Cc: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <eduardo.valentin@ti.com>
Cc: J Keerthy <j-keerthy@ti.com>
Cc: Radhesh Fadnis <radhesh.fadnis@ti.com>
Cc: Cyril Roelandt <tipecaml@gmail.com>
Cc: devicetree-discuss@lists.ozlabs.org
Cc: linux-doc@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Cc: devel@driverdev.osuosl.org
Cc: linux-pm@vger.kernel.org
Signed-off-by: NEduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>
      eb982001