Here we have a simple code organization. This patch moves
functions that do not need to handle thermal core internal
data structure to thermal_helpers.c file.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

This is a code reorganization, simply to concentrate
the code handling sysfs in a specific file: thermal_sysfs.c.

Right now, moving only the sysfs entries of thermal_zone_device.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

Maxim Semiconductor Max77620 supports alarm interrupts when
its die temperature crosses 120C and 140C. These threshold
temperatures are not configurable.

Add thermal driver to register PMIC die temperature as thermal
zone sensor and capture the die temperature warning interrupts
to notifying the client.
Signed-off-by: NLaxman Dewangan <ldewangan@nvidia.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

This driver add thermal management support by enabling TMU (Thermal
Monitoring Unit) on QorIQ platform.

It's based on thermal of framework:
- Trip points defined in device tree.
- Cpufreq as cooling device registered in qoriq cpufreq driver.
Signed-off-by: NJia Hongtao <hongtao.jia@nxp.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

TSENS is Qualcomms' thermal temperature sensor device. It
supports reading temperatures from multiple thermal sensors
present on various QCOM SoCs.
Calibration data is generally read from a non-volatile memory
(eeprom) device.

Add a skeleton driver with all the necessary abstractions so
a variety of qcom device families which support TSENS can
add driver extensions.

Also add the required device tree bindings which can be used
to describe the TSENS device in DT.
Signed-off-by: NRajendra Nayak <rnayak@codeaurora.org>
Reviewed-by: NLina Iyer <lina.iyer@linaro.org>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

This change adds support for Intel BXT Whiskey Cove PMIC thermal
driver which is intended to handle the alert interrupts triggered
upon thermal trip point cross and notify the thermal framework
appropriately with the zone, temp, crossed trip and event details.
Signed-off-by: NYegnesh S Iyer <yegnesh.s.iyer@intel.com>
Signed-off-by: NBin Gao <bin.gao@intel.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

In some of platform, thermal sensors like NCT thermistors are
connected to the one of ADC channel. The temperature is read by
reading the voltage across the sensor resistance via ADC. Lookup
table for ADC read value to temperature is referred to get
temperature. ADC is read via IIO framework.

Add support for thermal sensor driver which read the voltage across
sensor resistance from ADC through IIO framework.
Acked-by: NJonathan Cameron <jic23@kernel.org>
Signed-off-by: NLaxman Dewangan <ldewangan@nvidia.com>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>

The Tango thermal driver provides support for the primitive temperature
sensor embedded in Tango chips since the SMP8758.

This sensor only generates a 1-bit signal to indicate whether the die
temperature exceeds a programmable threshold.
Signed-off-by: NMarc Gonzalez <marc_gonzalez@sigmadesigns.com>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>

Move Tegra soctherm driver to tegra directory, it's easy to maintain
and add more new function support for Tegra platforms.
This will also help to split soctherm driver into common parts and
chip specific data related parts.
Signed-off-by: NWei Ni <wni@nvidia.com>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>

This adds support for the Mediatek thermal controller found on MT8173
and likely other SoCs.
The controller is a bit special. It does not have its own ADC, instead
it controls the on-SoC AUXADC via AHB bus accesses. For this reason
we need the physical address of the AUXADC. Also it controls a mux
using AHB bus accesses, so we need the APMIXEDSYS physical address aswell.
Signed-off-by: NSascha Hauer <s.hauer@pengutronix.de>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>

Add a generic thermal cooling device for devfreq, that is similar to
cpu_cooling.

The device must use devfreq.  In order to use the power extension of the
cooling device, it must have registered its OPPs using the OPP library.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: NJavi Merino <javi.merino@arm.com>
Signed-off-by: NØrjan Eide <orjan.eide@arm.com>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>

This change adds a thermal driver for Wildcat Point platform controller
hub. This driver register PCH thermal sensor as a thermal zone and
associate critical and hot trips if present.
Signed-off-by: NTushar Dave <tushar.n.dave@intel.com>
Reviewed-by: NPandruvada, Srinivas <srinivas.pandruvada@intel.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

This patch adds the support for hisilicon thermal sensor, within
hisilicon SoC. there will register sensors for thermal framework
and use device tree to bind cooling device.
Signed-off-by: NLeo Yan <leo.yan@linaro.org>
Signed-off-by: Nkongxinwei <kong.kongxinwei@hisilicon.com>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>

The power allocator governor is a thermal governor that controls system
and device power allocation to control temperature.  Conceptually, the
implementation divides the sustainable power of a thermal zone among
all the heat sources in that zone.

This governor relies on "power actors", entities that represent heat
sources.  They can report current and maximum power consumption and
can set a given maximum power consumption, usually via a cooling
device.

The governor uses a Proportional Integral Derivative (PID) controller
driven by the temperature of the thermal zone.  The output of the
controller is a power budget that is then allocated to each power
actor that can have bearing on the temperature we are trying to
control.  It decides how much power to give each cooling device based
on the performance they are requesting.  The PID controller ensures
that the total power budget does not exceed the control temperature.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: NPunit Agrawal <punit.agrawal@arm.com>
Signed-off-by: NJavi Merino <javi.merino@arm.com>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>

Add support for the temperature alarm peripheral found inside
Qualcomm plug-and-play (QPNP) PMIC chips. The temperature alarm
peripheral outputs a pulse on an interrupt line whenever the
thermal over temperature stage value changes.

Register a thermal sensor. The temperature reported by this thermal
sensor device should reflect the actual PMIC die temperature if an
ADC is present on the given PMIC. If no ADC is present, then the
reported temperature should be estimated from the over temperature
stage value.

Cc: David Collins <collinsd@codeaurora.org>
Signed-off-by: NIvan T. Ivanov <iivanov@mm-sol.com>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>

In Intel Quark SoC X1000, there is one on-die digital temperature sensor(DTS).
The DTS offers both hot & critical trip points.

However, in current distribution of UEFI BIOS for Quark platform, only
critical trip point is configured to be 105 degree Celsius (based on Quark
SW ver1.0.1 and hot trip point is not used due to lack of IRQ.

There is no active cooling device for Quark SoC, so Quark SoC thermal
management logic expects Linux distro to orderly power-off when temperature
of the DTS exceeds the configured critical trip point.

Kernel param "polling_delay" in milliseconds is used to control the frequency
the DTS temperature is read by thermal framework. It defaults to 2-second.
To change it, use kernel boot param "intel_quark_dts_thermal.polling_delay=X".

User interacts with Quark SoC DTS thermal driver through sysfs via:
/sys/class/thermal/thermal_zone0/

For example:
 - to read DTS temperature
   $ cat temp
 - to read critical trip point
   $ cat trip_point_0_temp
 - to read trip point type
   $ cat trip_point_0_type
 - to emulate temperature raise to test orderly shutdown by Linux distro
   $ echo 105 > emul_temp
Tested-by: NBryan O'Donoghue <pure.logic@nexus-software.ie>
Signed-off-by: NOng Boon Leong <boon.leong.ong@intel.com>
Reviewed-by: NBryan O'Donoghue <pure.logic@nexus-software.ie>
Reviewed-by: NKweh, Hock Leong <hock.leong.kweh@intel.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

This is becoming a common feature for Intel SoCs to expose the additional
digital temperature sensors (DTSs) using side band interface (IOSF). This
change remove common IOSF DTS handler function from the existing driver
intel_soc_dts_thermal.c and creates a stand alone module, which can
be selected from the SoC specific drivers. In this way there is less
code duplication.
Signed-off-by: NSrinivas Pandruvada <srinivas.pandruvada@linux.intel.com>

Thermal is TS-ADC Controller module supports
user-defined mode and automatic mode.

User-defined mode refers,TSADC all the control signals entirely by
software writing to register for direct control.

Automaic mode refers to the module automatically poll TSADC output,
and the results were checked.If you find that the temperature High
in a period of time,an interrupt is generated to the processor
down-measures taken;If the temperature over a period of time High,
the resulting TSHUT gave CRU module,let it reset the entire chip,
or via GPIO give PMIC.
Signed-off-by: Nzhaoyifeng <zyf@rock-chips.com>
Signed-off-by: NCaesar Wang <caesar.wang@rock-chips.com>
Reviewed-by: NDmitry Torokhov <dmitry.torokhov@gmail.com>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>

This adds support for the Tegra SOCTHERM thermal sensing and management
system found in the Tegra124 system-on-chip. This initial driver supports
temperature polling for four thermal zones.
Signed-off-by: NMikko Perttunen <mperttunen@nvidia.com>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>

This patch introduces a new thermal cooling device based on common clock
framework. The original motivation to write this cooling device is to be
able to cool down thermal zones using clocks that feed co-processors, such
as GPUs, DSPs, Image Processing Co-processors, etc. But it is written
in a way that it can be used on top of any clock.

The implementation is pretty straight forward. The code creates
a thermal cooling device based on a pair of a struct device and a clock name.
The struct device is assumed to be usable by the OPP layer. The OPP layer
is used as source of the list of possible frequencies. The (cpufreq) frequency
table is then used as a map from frequencies to cooling states. Cooling
states are indexes to the frequency table.

The logic sits on top of common clock framework, specifically on clock
pre notifications. Any PRE_RATE_CHANGE is hijacked, and the transition is
only allowed when the new rate is within the thermal limit (cooling state -> freq).

When a thermal cooling device state transition is requested, the clock
is also checked to verify if the current clock rate is within the new
thermal limit.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Mike Turquette <mturquette@linaro.org>
Cc: Nishanth Menon <nm@ti.com>
Cc: Pavel Machek <pavel@ucw.cz>
Cc: "Rafael J. Wysocki" <rjw@sisk.pl>
Cc: Len Brown <len.brown@intel.com>
Cc: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
Cc: linux-pm@vger.kernel.org
Cc: linux-arm-kernel@lists.infradead.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: NEduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>

ACPI INT3403 device object can be used to retrieve temperature date
from temperature sensors present in the system, and to expose
device' performance control.

The previous INT3403 thermal driver supports temperature reporting only,
thus remove it and introduce this new & enhanced one.
Signed-off-by: NLan Tianyu <tianyu.lan@intel.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

Introduce int3400 thermal driver. And make INT3400 driver
enumerate the other int340x thermal components shown in _ART/_TRT.
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

The bang-bang thermal governor uses a hysteresis to switch abruptly on
or off a cooling device.  It is intended to control fans, which can
not be throttled but just switched on or off.
Bang-bang cannot be set as default governor as it is intended for
special devices only.  For those special devices the driver needs to
explicitely request it.

Cc: Andrew Morton <akpm@linux-foundation.org>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Andreas Mohr <andi@lisas.de>
Cc: Borislav Petkov <bp@suse.de>
Cc: Javi Merino <javi.merino@arm.com>
Cc: linux-pm@vger.kernel.org
Signed-off-by: NPeter Feuerer <peter@piie.net>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

This core is shared by both ST's 'memory mapped' and
'system configuration register' based Thermal controllers.
Signed-off-by: NAjit Pal Singh <ajitpal.singh@st.com>
Signed-off-by: NLee Jones <lee.jones@linaro.org>
Acked-by: NPavel Machek <pavel@ucw.cz>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

In the Intel SoCs like Bay Trail, there are 2 additional digital temperature
sensors(DTS), in addition to the standard DTSs in the core. Also they support
4 programmable thresholds, out of which two can be used by OSPM. These
thresholds can be used by OSPM thermal control. Out of these two thresholds,
one is used by driver and one user mode can change via thermal sysfs to get
notifications on threshold violations.

The driver defines one critical trip points, which is set to TJ MAX - offset.
The offset can be changed via module parameter (default 5C). Also it uses
one of the thresholds to get notification for this temperature violation.
This is very important for orderly shutdown as the many of these devices don't
have ACPI thermal zone, and expects that there is some other thermal control
mechanism present in OSPM. When a Linux distro is used without additional
specialized thermal control program, BIOS can do force shutdown when thermals
are not under control. When temperature reaches critical, the Linux thermal
core will initiate an orderly shutdown.
Signed-off-by: NSrinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

The ACPI INT3403 device objects present on some systems can be used to retrieve
temperature data from thermal sensors. Add a driver registering each INT3403
device object as a thermal zone device and exposing its _TMP, PATx and GTSH
method via the standard thermal control interface under /sys/class/thermal/.
Signed-off-by: NSrinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

This patch introduces a device tree bindings for
describing the hardware thermal behavior and limits.
Also a parser to read and interpret the data and feed
it in the thermal framework is presented.

This patch introduces a thermal data parser for device
tree. The parsed data is used to build thermal zones
and thermal binding parameters. The output data
can then be used to deploy thermal policies.

This patch adds also documentation regarding this
API and how to define tree nodes to use
this infrastructure.

Note that, in order to be able to have control
on the sensor registration on the DT thermal zone,
it was required to allow changing the thermal zone
.get_temp callback. For this reason, this patch
also removes the 'const' modifier from the .ops
field of thermal zone devices.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Acked-by: NMark Rutland <mark.rutland@arm.com>
Signed-off-by: NEduardo Valentin <eduardo.valentin@ti.com>

In order to improve code organization, this patch
moves the hwmon sysfs support to a file named
thermal_hwmon. This helps to add extra support
for hwmon without scrambling the code.

In order to do this move, the hwmon list head is now
using its own locking. Before, the list used
the global thermal locking. Also, some minor changes
in the code were required, as recommended by checkpatch.pl.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Acked-by: NDurgadoss R <durgadoss.r@intel.com>
Signed-off-by: NEduardo Valentin <eduardo.valentin@ti.com>

This movement of files is done for easy maintenance and adding more
new sensor's support for exynos platform easily . This will also help in
bifurcating exynos common, sensor driver and sensor data related parts.
Acked-by: NKukjin Kim <kgene.kim@samsung.com>
Acked-by: NJonghwa Lee <jonghwa3.lee@samsung.com>
Acked-by: NEduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: NAmit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: NEduardo Valentin <eduardo.valentin@ti.com>

This is based on the initial imx thermal work done by
Rob Lee <rob.lee@linaro.org> (Not sure if the email address is still
valid).  Since he is no longer interested in the work and I have
rewritten a significant amount of the code, I just took the authorship
over from him.

It adds the imx thermal support using Temperature Monitor (TEMPMON)
block found on some Freescale i.MX SoCs.  The driver uses syscon regmap
interface to access TEMPMON control registers and calibration data, and
supports cpufreq as the cooling device.
Signed-off-by: NShawn Guo <shawn.guo@linaro.org>
Signed-off-by: NEduardo Valentin <eduardo.valentin@ti.com>

This driver register CPU digital temperature sensor as a thermal
zone at package level.
Each package will show up as one zone with at max two trip points.
These trip points can be both read and updated. Once a non zero
value is set in the trip point, if the package package temperature
goes above or below this setting, a thermal notification is
generated.
Signed-off-by: NSrinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

This patch moves the ti-soc-thermal driver out of
the staging tree to the thermal tree.

Cc: Grant Likely <grant.likely@linaro.org>
Cc: Rob Herring <rob.herring@calxeda.com>
Cc: Rob Landley <rob@landley.net>
Cc: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <eduardo.valentin@ti.com>
Cc: J Keerthy <j-keerthy@ti.com>
Cc: Radhesh Fadnis <radhesh.fadnis@ti.com>
Cc: Cyril Roelandt <tipecaml@gmail.com>
Cc: devicetree-discuss@lists.ozlabs.org
Cc: linux-doc@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Cc: devel@driverdev.osuosl.org
Cc: linux-pm@vger.kernel.org
Signed-off-by: NEduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

Signed-off-by: NZhang Rui <rui.zhang@intel.com>
Acked-by: NEduardo Valentin <eduardo.valentin@ti.com>
Acked-by: NDurgadoss R <durgadoss.r@intel.com>

The thermal governors are part of the thermal framework,
rather than a seperate feature/module.
Because the generic thermal layer can not work without
thermal governors, and it must load the thermal governors
during its initialization.

Build them into one module in this patch.

This also fix a problem that the generic thermal layer does not
work when CONFIG_THERMAL=m and CONFIG_THERMAL_GOV_XXX=y.
Signed-off-by: NZhang Rui <rui.zhang@intel.com>
Acked-by: NEduardo Valentin <eduardo.valentin@ti.com>
Acked-by: NDurgadoss R <durgadoss.r@intel.com>

this is the preparation work to build all the thermal core framework
source file, like governors, cpu cooling, etc, into one module.

No functional change in this patch.
Signed-off-by: NZhang Rui <rui.zhang@intel.com>
Acked-by: NEduardo Valentin <eduardo.valentin@ti.com>
Acked-by: NDurgadoss R <durgadoss.r@intel.com>

This driver supports both Armada 370 and Armada XP SoC
thermal management controllers.

Armada 370 has a register to check a valid temperature, whereas
Armada XP does not. Each has a different initialization (i.e. calibration)
function. The temperature conversion formula is the same for both.

The controller present in each SoC have a very similar feature set,
so it corresponds to have one driver to support both of them.

Although this driver may present similarities to Dove and Kirkwood
thermal driver, the exact differences and coincidences are not fully
known. For this reason, support is given through a separate driver.
Signed-off-by: NEzequiel Garcia <ezequiel.garcia@free-electrons.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

Currently, we have three Kconfig options for thermal governors, aka,
CONFIG_FAIR_SHARE, CONFIG_USER_SPACE and CONFIG_STEP_WISE.
But these names are too generic that may bring confusion to users.

Rename them to CONFIG_THERMAL_GOV_FAIR_SHARE,
CONFIG_THERMAL_GOV_USER_SPACE, CONFIG_THERMAL_GOV_STEP_WISE
to avoid the generic naming.
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

The Marvell Dove SoC has a thermal sensor. Add a driver using the
thermal framework.
Signed-off-by: NAndrew Lunn <andrew@lunn.ch>
Signed-off-by: NSebastian Hesselbarth <sebastian.hesselbarth@gmail.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

This patch adds support for Kirkwood 88F6282 and 88F6283 thermal sensor.
Signed-off-by: NNobuhiro Iwamatsu <iwamatsu@nigauri.org>
Signed-off-by: NAndrew Lunn <andrew@lunn.ch>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

Intel PowerClamp driver performs synchronized idle injection across
all online CPUs. The goal is to maintain a given package level C-state
ratio.

Compared to other throttling methods already exist in the kernel,
such as ACPI PAD (taking CPUs offline) and clock modulation, this is often
more efficient in terms of performance per watt.

Please refer to Documentation/thermal/intel_powerclamp.txt for more details.
Signed-off-by: NArjan van de Ven <arjan@linux.intel.com>
Signed-off-by: NJacob Pan <jacob.jun.pan@linux.intel.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>