that's not used anymore. So let's drop it.
Signed-off-by: NFelipe Balbi <balbi@ti.com>

instead of using musb_platform_suspend_resume,
we can use dev_pm_ops and let platform_device
core handle when to call musb_core's suspend and
glue layer's suspend.
Signed-off-by: NFelipe Balbi <balbi@ti.com>

... that can be easily folded into the
musb_platform_suspend/resume calls.
Signed-off-by: NFelipe Balbi <balbi@ti.com>

musb core doesn't need to know about platform
specific details. So start moving clock
handling to platform glue layer and make
musb core agnostic about that.
Signed-off-by: NFelipe Balbi <balbi@ti.com>

... then we don't need to export any symbols
from glue layer to musb_core.
Signed-off-by: NFelipe Balbi <balbi@ti.com>

that structure currently only holds a device
pointer to our own platform_device and musb's
platform_device, but soon it will hold pointers
to our clock structures and glue-specific bits
and pieces.
Signed-off-by: NFelipe Balbi <balbi@ti.com>

Just adding its own platform_driver, not really
using it yet.

When all HW glue layers are converted, more patches
will come to split power management code from musb_core
and move it completely to HW glue layer.
Signed-off-by: NFelipe Balbi <balbi@ti.com>

preparing to a big refactor on musb code. We need
to be able to compile in all glue layers (or at
least all ARM-based ones) together and have a
working binary.

While preparing for that, we move every glue
layer to export only one symbol, which is
a struct musb_platform_ops, and make all
other functions static.

Later patches will come to allow for compiling
all glue layers together and have a working
binary.
Signed-off-by: NFelipe Balbi <balbi@ti.com>

AM35x supports only 32bit read operations so we need to have
workaround for 8bit and 16bit read operations.
Signed-off-by: NAjay Kumar Gupta <ajay.gupta@ti.com>
Signed-off-by: NFelipe Balbi <balbi@ti.com>
Signed-off-by: NGreg Kroah-Hartman <gregkh@suse.de>

AM35x has musb interface and uses CPPI4.1 DMA engine.
Current patch supports only PIO mode. DMA support can be
added later once basic CPPI4.1 DMA patch is accepted.

Also added USB_MUSB_AM35X which is required to differentiate musb ips
between OMAP3x and AM35x. This config would be used to for below
purposes,
        - Select am35x.c instead of omap2430.c for compilation
          at drivers/usb/musb directory. Please note there are
          significant differneces in these two files as musb ip
          in quite different on AM35x.

	  Please note that in multi omap configuration only omap2430.c
	  file will get compiled and we would require to select only
	  AM35x based board config to compile am35x.c

        - Select workaround codes applicable for AM35x musb issues.
          one such workaround is for bytewise read issue on AM35x.
Signed-off-by: NAjay Kumar Gupta <ajay.gupta@ti.com>
Signed-off-by: NFelipe Balbi <balbi@ti.com>
Signed-off-by: NGreg Kroah-Hartman <gregkh@suse.de>

Texas Instruments DA8xx/OMAP-L1x glue layer for the
MUSBMHRDC driver.
Signed-off-by: NSergei Shtylyov <sshtylyov@ru.mvista.com>
Signed-off-by: NYadviga Grigorieva <yadviga@ru.mvista.com>
Signed-off-by: NFelipe Balbi <balbi@ti.com>
Signed-off-by: NGreg Kroah-Hartman <gregkh@suse.de>