Remove documentation for longer needed samsung thermal properties.
Signed-off-by: NBartlomiej Zolnierkiewicz <b.zolnierkie@samsung.com>
Reviewed-by: NRob Herring <robh@kernel.org>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>

Due to the old method has already been marked as deprecated in binding
doc, so obviously it's better to update the example to new bindings
as well.

Cc: Shawn Guo <shawn.guo@linaro.org>
Cc: Leonard Crestez <leonard.crestez@nxp.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: Rob Herring <robh+dt@kernel.org>
Cc: Mark Rutland <mark.rutland@arm.com>
Signed-off-by: NDong Aisheng <aisheng.dong@nxp.com>
Acked-by: NShawn Guo <shawnguo@kernel.org>
Signed-off-by: NRob Herring <robh@kernel.org>

Add compatible strings for AP806 and CP110 that are part of the Armada
8k/7k line of SoCs.

Add a note on the differences in the size of the control area in
different bindings. This is an existing difference between the Armada
375 binding and the other boards already supported. The new AP806 and
CP110 bindings are similar to the existing Armada 375 in this regard.
Signed-off-by: NBaruch Siach <baruch@tkos.co.il>
[<miquel.raynal@free-electrons.com>: reword, additional details]
Signed-off-by: NMiquel Raynal <miquel.raynal@free-electrons.com>
Reviewed-by: NRob Herring <robh@kernel.org>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>

Add thermal sensor support for r8a7743 SoC. The Renesas RZ/G1M
(r8a7743) thermal sensor module is identical to the R-Car Gen2 family.

No driver change is needed due to the fallback compatible value
"renesas,rcar-gen2-thermal".
Signed-off-by: NBiju Das <biju.das@bp.renesas.com>
Reviewed-by: NFabrizio Castro <fabrizio.castro@bp.renesas.com>
Reviewed-by: NGeert Uytterhoeven <geert+renesas@glider.be>
Reviewed-by: NRob Herring <robh@kernel.org>
Reviewed-by: NSimon Horman <simon.horman@netronome.com>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>

DT unit addresses should be lower case hex. Fix all the
binding examples.

Converted with the following command from Krzysztof Kozlowski:

sed -e 's/@\([a-fA-F0-9_-]*\) {/@\L\1 {/' -i $(find Documentation/devicetree/bindings -name '*.txt')
Signed-off-by: NRob Herring <robh@kernel.org>

Improve the binding example by removing all the leading 0x to fix the
following dtc warnings:

Warning (unit_address_format): Node /XXX unit name should not have leading "0x"

Converted using the following command:

find Documentation/devicetree/bindings -name "*.txt" -exec sed -i -e 's/([^ ])\@0x([0-9a-f])/$1\@$2/g' {} +

This is a follow up to commit 48c926cdSigned-off-by: NMathieu Malaterre <malat@debian.org>
Signed-off-by: NRob Herring <robh@kernel.org>

Add binding for Broadcom STB thermal.
Signed-off-by: NBrian Norris <computersforpeace@gmail.com>
Acked-by: NRob Herring <robh@kernel.org>
Signed-off-by: NMarkus Mayer <mmayer@broadcom.com>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>

Add a new compatible for thermal founding on RV1108 SoCs.
Acked-by: NRob Herring <robh@kernel.org>
Signed-off-by: NRocky Hao <rocky.hao@rock-chips.com>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>

In Tegra186, the BPMP (Boot and Power Management Processor) implements
an interface that is used to read system temperatures, including CPU
cluster and GPU temperatures. This binding describes the thermal sensor
that is exposed by BPMP.
Signed-off-by: NMikko Perttunen <mperttunen@nvidia.com>
Acked-by: NRob Herring <robh@kernel.org>
Signed-off-by: NThierry Reding <treding@nvidia.com>

This adds documentation of device tree bindings for the
thermal sensor controller of hi3660 SoC.
Signed-off-by: NKevin Wangtao <kevin.wangtao@linaro.org>
Signed-off-by: NDaniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: NRob Herring <robh@kernel.org>
Signed-off-by: NWei Xu <xuwei5@hisilicon.com>

On newer imx SOCs accessing OCOTP directly is wrong because the ocotp
clock needs to be enabled first. Add a binding for accessing the same
values through the imx-ocotp nvmem driver using nvmem-cells. This is
similar to other thermal drivers.

The old binding is preserved for compatibility and because it still
works fine on imx6qdl series chips.

In theory this problem could be solved by adding a reference to the
OCOTP clock instead but it is better to hide such details in a specific
nvmem driver.
Signed-off-by: NLeonard Crestez <leonard.crestez@nxp.com>
Acked-by: NRob Herring <robh@kernel.org>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

Pretty much any node can have a status property, so it doesn't need to
be in examples.

Converted with the following command and removed examples with SoC and
board specific splits:

git grep -l -E 'status.*=.*' Documentation/devicetree/ | xargs sed -i -E '/\sstatus.*=.*"(disabled|ok|okay)/d'
Acked-by: NMark Rutland <mark.rutland@arm.com>
Signed-off-by: NRob Herring <robh@kernel.org>

This adds the device tree binding documentation for the mediatek thermal
controller found on Mediatek MT2712.
Signed-off-by: NLouis Yu <louis.yu@mediatek.com>
Reviewed-by: NDawei Chien <dawei.chien@mediatek.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

attempt to new compatible for thermal founding on RK3328 SoC.
Signed-off-by: NRocky Hao <rocky.hao@rock-chips.com>
Acked-by: NRob Herring <robh@kernel.org>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

Add devicetree binding documentation for thermal monitor implemented on
Socionext UniPhier SoCs.
Signed-off-by: NKunihiko Hayashi <hayashi.kunihiko@socionext.com>
Acked-by: NRob Herring <robh@kernel.org>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

Add the missing .txt extension to the Broadcom Northstar binding document.
Signed-off-by: NMarkus Mayer <mmayer@broadcom.com>
Signed-off-by: NRob Herring <robh@kernel.org>

Device tree binding information for DA9062 and DA9061 thermal junction
temperature monitor.

Binding descriptions for the DA9061 and DA9062 thermal TJUNC supervisor
device driver, using a single THERMAL_TRIP_HOT trip-wire and allowing for
a configurable polling period for over-temperature polling.

This patch also adds two examples, one for DA9062 and one for DA9061. The
DA9061 example uses a fall-back compatible string for the DA9062.
Acked-by: NRob Herring <robh@kernel.org>
Signed-off-by: NSteve Twiss <stwiss.opensource@diasemi.com>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>

This commit documents binding for thermal used in Northstar family SoCs.

There isn't any known Northstar device with active cooling system so DT
example has empty cooling-maps node. There is also no support for CPU
frequency throttling so I put only a critical trip in the example.
Signed-off-by: NRafał Miłecki <rafal@milecki.pl>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>

Add a thermal zone in order to make the example complete.
Signed-off-by: NStefan Wahren <stefan.wahren@i2se.com>
Acked-by: NRob Herring <robh@kernel.org>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>

For different types of SoC the sensor id and endianness may vary.
"#thermal-sensor-cells" is used to provide sensor id information.
"little-endian" property is to tell the endianness of TMU.
Signed-off-by: NJia Hongtao <hongtao.jia@nxp.com>
Acked-by: NRob Herring <robh@kernel.org>
Acked-by: NScott Wood <scottwood@freescale.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

This patch adds dt-binding documentation for zx2967 family thermal sensor.
Signed-off-by: NBaoyou Xie <baoyou.xie@linaro.org>
Acked-by: NRob Herring <robh@kernel.org>
Reviewed-by: NShawn Guo <shawnguo@kernel.org>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>

Signed-off-by: NHien Dang <hien.dang.eb@renesas.com>
Signed-off-by: NKhiem Nguyen <khiem.nguyen.xt@renesas.com>
Signed-off-by: NWolfram Sang <wsa+renesas@sang-engineering.com>
Signed-off-by: NNiklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>

"rockchip,hw-tshut-temp", "rockchip,hw-tshut-mode" and
"rockchip,hw-tshut-polarity" are not a required properties
actually as the code could also work by loading the default
settings there. So it is apprently misleading, although we
prefer to get these from DT. And it seems we miss the 'rockchip,grf'
here which should also be an optional property.
Acked-by: NRob Herring <robh@kernel.org>
Reviewed-by: NHeiko Stuebner <heiko@sntech.de>
Signed-off-by: NShawn Lin <shawn.lin@rock-chips.com>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>

Add dt-binding documentation for bcm2835 SOC thermal sensor.
Signed-off-by: NMartin Sperl <kernel@martin.sperl.org>
Acked-by: NEric Anholt <eric@anholt.net>
Acked-by: NRob Herring <robh@kernel.org>

Changelog:
 V1 -> V2: renamed file to follow naming conventions
 V2 -> V3: removed 0x in node name
Signed-off-by: NEric Anholt <eric@anholt.net>

STiH415/6 SoC's are being removed from the kernel. This
patch removes the compatibles from the dt doc and also
updates the example to a supported platform.
Signed-off-by: NPeter Griffin <peter.griffin@linaro.org>
Cc: <rui.zhang@intel.com>
Cc: <edubezval@gmail.com>
Cc: <robh+dt@kernel.org>
Acked-by: NRob Herring <robh@kernel.org>

Add HW throttle configuration sub-node for soctherm, which
is used to describe the throttle event, and worked as a
cooling device. The "hot" type trip in thermal zone can
be bound to this cooling device, and trigger the throttle
function.
Signed-off-by: NWei Ni <wni@nvidia.com>
Acked-by: NRob Herring <robh@kernel.org>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

This adds the device tree binding documentation for the mediatek thermal
controller found on Mediatek MT2701.
Signed-off-by: NDawei Chien <dawei.chien@mediatek.com>
Reviewed-by: NKeerthy <j-keerthy@ti.com>
Acked-by: NRob Herring <robh@kernel.org>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

Maxim Semiconductor MAX77620 supports alarm interrupts when
its die temperature crosses 120C and 140C. These threshold
temperatures are not configurable.

Add DT binding document to details out the DT property related
to MAX77620 thermal functionality.
Signed-off-by: NLaxman Dewangan <ldewangan@nvidia.com>
Acked-by: NRob Herring <robh@kernel.org>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

TSENS is Qualcomms' thermal temperature sensor device. It
supports reading temperatures from multiple thermal sensors
present on various QCOM SoCs.
Calibration data is generally read from a non-volatile memory
(eeprom) device.

Add a skeleton driver with all the necessary abstractions so
a variety of qcom device families which support TSENS can
add driver extensions.

Also add the required device tree bindings which can be used
to describe the TSENS device in DT.
Signed-off-by: NRajendra Nayak <rnayak@codeaurora.org>
Reviewed-by: NLina Iyer <lina.iyer@linaro.org>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

See the thermal code, the obvious typo from my editor.
Signed-off-by: NCaesar Wang <wxt@rock-chips.com>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>
Signed-off-by: NZhang Rui <rui.zhang@intel.com>

Sometimes, thermal sensors like NCT thermistors are connected to
the ADC channel. The temperature is read by reading the voltage
across the sensor resistance via ADC and referring the lookup
table for ADC value to temperature.

Add DT binding doc for the ADC based thermal sensor driver to
detail the DT property and provide the example for how to use it.
Signed-off-by: NLaxman Dewangan <ldewangan@nvidia.com>
Acked-by: NRob Herring <rob@kernel.org>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>

The Tango thermal driver provides support for the primitive temperature
sensor embedded in Tango chips since the SMP8758.

This sensor only generates a 1-bit signal to indicate whether the die
temperature exceeds a programmable threshold.
Signed-off-by: NMarc Gonzalez <marc_gonzalez@sigmadesigns.com>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>

The latest information that I have is that there is no thermal IP
block present on the r8a7794 SoC so remove the corresponding binding.

Cc: Geert Uytterhoeven <geert+renesas@glider.be>
Acked-by: NGeert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: NSimon Horman <horms+renesas@verge.net.au>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>

The "critical" type trip in thermal zone can be
set to SOC_THERM hardware, it can trigger shut down
or reset event from hardware.
Signed-off-by: NWei Ni <wni@nvidia.com>
Acked-by: NRob Herring <robh@kernel.org>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>

Device tree binding for NVIDIA Tegra have traditionally carried the
"nvidia," vendor prefix in the filename. A couple of odd ones don't, so
fix them up for consistency.

Also rename existing bindings to reflect the first compatible value that
they document. This wasn't done consistently either.
Acked-by: NStephen Warren <swarren@nvidia.com>
Signed-off-by: NThierry Reding <treding@nvidia.com>
Signed-off-by: NRob Herring <robh@kernel.org>

When Tegra124 support was first merged the unit-addresses of all devices
were listed with a "0," prefix to encode the reg property's second cell.
It turns out that this notation is not correct, and the "," separator is
only used to separate fields in the unit address (such as the device and
function number in PCI devices), not individual cells for addresses
with more than one cell.
Acked-by: NStephen Warren <swarren@nvidia.com>
Signed-off-by: NThierry Reding <treding@nvidia.com>
Signed-off-by: NRob Herring <robh@kernel.org>

The Exynos Thermal Management Unit binding says that the vtmu-supply
is optional but is listed in the required properties section. Add an
optional properties section and move the regulator property there.
Acked-by: NRob Herring <robh@kernel.org>
Reviewed-by: NKrzysztof Kozlowski <k.kozlowski@samsung.com>
Reviewed-by: NAndi Shyti <andi.shyti@samsung.com>
Signed-off-by: NJavier Martinez Canillas <javier@osg.samsung.com>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>

Document the number of configurable temperature thresholds (for
trip-points in interrupt-driven mode).
Acked-by: NRob Herring <robh@kernel.org>
Reviewed-by: NChanwoo Choi <cw00.choi@samsung.com>
Signed-off-by: NKrzysztof Kozlowski <k.kozlowski@samsung.com>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>

Commit 488c7455 ("thermal: exynos: Add the support for Exynos5433
TMU") added new compatible but forgot to update documentation.
Acked-by: NRob Herring <robh@kernel.org>
Reviewed-by: NChanwoo Choi <cw00.choi@samsung.com>
Signed-off-by: NKrzysztof Kozlowski <k.kozlowski@samsung.com>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>

This adds the device tree binding documentation for the mediatek thermal
controller found on Mediatek MT8173 and other SoCs.
Signed-off-by: NSascha Hauer <s.hauer@pengutronix.de>
Reviewed-by: NDaniel Kurtz <djkurtz@chromium.org>
Acked-by: NRob Herring <robh@kernel.org>
Signed-off-by: NEduardo Valentin <edubezval@gmail.com>