- 25 1月, 2015 1 次提交
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由 Lukasz Majewski 提交于
Properties necessary for providing Exynos thermal configuration via device tree. Signed-off-by: NLukasz Majewski <l.majewski@samsung.com> Signed-off-by: NEduardo Valentin <edubezval@gmail.com>
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- 25 11月, 2014 2 次提交
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由 Ezequiel Garcia 提交于
The Armada 375 Z1 SoC revision is no longer supported. This commit removes the quirk needed for the thermal sensor. Acked-by: NJason Cooper <jason@lakedaemon.net> Signed-off-by: NEzequiel Garcia <ezequiel.garcia@free-electrons.com> Signed-off-by: NEduardo Valentin <edubezval@gmail.com>
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由 Caesar Wang 提交于
This add the necessary binding documentation for the thermal found on Rockchip SoCs Signed-off-by: Nzhaoyifeng <zyf@rock-chips.com> Signed-off-by: NCaesar Wang <caesar.wang@rock-chips.com> Reviewed-by: NDmitry Torokhov <dmitry.torokhov@gmail.com> Signed-off-by: NEduardo Valentin <edubezval@gmail.com>
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- 20 11月, 2014 1 次提交
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由 Mikko Perttunen 提交于
This adds binding documentation and headers for the Tegra124 SOCTHERM device tree node. Signed-off-by: NMikko Perttunen <mperttunen@nvidia.com> Acked-by: NStephen Warren <swarren@nvidia.com> Acked-by: NEduardo Valentin <edubezval@gmail.com> Signed-off-by: NEduardo Valentin <edubezval@gmail.com>
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- 03 11月, 2014 1 次提交
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由 Geert Uytterhoeven 提交于
- r8a7792 (R-Car V2H) - r8a7793 (R-Car M2-N) - r8a7794 (R-Car E2) r8a7791 is now called "R-Car M2-W". Signed-off-by: NGeert Uytterhoeven <geert+renesas@glider.be> Signed-off-by: NEduardo Valentin <edubezval@gmail.com>
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- 09 8月, 2014 1 次提交
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由 Anson Huang 提交于
i.MX6SX has some new features of thermal interrupt function, there are LOW, HIGH and PANIC irq for thermal sensor, so add platform data to separate different thermal version; The reset value of LOW ALARM is 0 which means the highest temp, so the LOW ALARM will be triggered once irq is enabled, so we need to correct it before enabling thermal irq; Enable PANIC ALARM as critical trip point, it will trigger system reset via SRC module once PANIC IRQ is triggered, it is pure hardware function, so use it instead of software reset by cooling device. Signed-off-by: NAnson Huang <b20788@freescale.com> Tested-by: NShawn Guo <shawn.guo@linaro.org> Signed-off-by: NEduardo Valentin <edubezval@gmail.com>
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- 15 7月, 2014 3 次提交
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由 Geert Uytterhoeven 提交于
The documentation only mentioned the generic fallback compatible property. Add the missing SoC-specific compatible properties, some of which are already in use. Signed-off-by: NGeert Uytterhoeven <geert+renesas@glider.be> Cc: Zhang Rui <rui.zhang@intel.com> Cc: Eduardo Valentin <eduardo.valentin@ti.com> Cc: linux-pm@vger.kernel.org Acked-by: NSimon Horman <horms+renesas@verge.net.au> Signed-off-by: NZhang Rui <rui.zhang@intel.com>
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由 Chanwoo Choi 提交于
This patch add registers, bit fields and compatible strings for Exynos3250 TMU (Thermal Management Unit). Exynos3250 uses the Cortex-A7 dual cores and has a target speed of 1.0 GHz. Signed-off-by: NChanwoo Choi <cw00.choi@samsung.com> [Add MUX address setting bits by Jonghwa Lee] Signed-off-by: NJonghwa Lee <jonghwa3.lee@samsung.com> Acked-by: NKyungmin Park <kyungmin.park@samsung.com> Reviewed-by: Amit Daniel Kachhap<amit.daniel@samsung.com> Signed-off-by: NZhang Rui <rui.zhang@intel.com>
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由 Lee Jones 提交于
Signed-off-by: NAjit Pal Singh <ajitpal.singh@st.com> Acked-by: NPeter Griffin <peter.griffin@linaro.org> Signed-off-by: NLee Jones <lee.jones@linaro.org> Signed-off-by: NZhang Rui <rui.zhang@intel.com>
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- 15 5月, 2014 2 次提交
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由 Ezequiel Garcia 提交于
Now that a generic infrastructure is in place, it's possible to support the Armada 380 SoC thermal sensor. This sensor is similar to the one available in the already supported SoCs, with its specific temperature formula and specific sensor initialization. Acked-by: NJason Cooper <jason@lakedaemon.net> Signed-off-by: NEzequiel Garcia <ezequiel.garcia@free-electrons.com> Signed-off-by: NZhang Rui <rui.zhang@intel.com>
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由 Ezequiel Garcia 提交于
Now that a generic infrastructure is in place, it's possible to support the new Armada 375 SoC thermal sensor. This sensor is similar to the one available in the already supported SoCs, with its specific temperature formula and specific sensor initialization. In addition, we also add support for the Z1 SoC stepping, which needs an initialization-quirk to work properly. Acked-by: NJason Cooper <jason@lakedaemon.net> Signed-off-by: NEzequiel Garcia <ezequiel.garcia@free-electrons.com> Signed-off-by: NZhang Rui <rui.zhang@intel.com>
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- 07 5月, 2014 3 次提交
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由 Naveen Krishna Chatradhi 提交于
This patch adds the registers, bit fields and compatible strings required to support for the 5 TMU channels on Exynos5260. Signed-off-by: NNaveen Krishna Chatradhi <ch.naveen@samsung.com> Signed-off-by: NEduardo Valentin <edubezval@gmail.com>
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由 Naveen Krishna Chatradhi 提交于
Exynos5420 has 5 TMU channels, the TRIMINFO register is misplaced for TMU channels 2, 3 and 4 TRIMINFO at 0x1006c000 contains data for TMU channel 3 TRIMINFO at 0x100a0000 contains data for TMU channel 4 TRIMINFO at 0x10068000 contains data for TMU channel 2 This patch 1 Adds the neccessary register changes and arch information to support Exynos5420 SoCs. 2. Handles the gate clock for misplaced TRIMINFO register 3. Updates the Documentation at Documentation/devicetree/bindings/thermal/exynos-thermal.txt Signed-off-by: NNaveen Krishna Chatradhi <ch.naveen@samsung.com> Signed-off-by: NAndrew Bresticker <abrestic@chromium.org> Acked-by: NAmit Daniel Kachhap <amit.daniel@samsung.com> Reviewed-by: NBartlomiej Zolnierkiewicz <b.zolnierkie@samsung.com> Reviewed-by: NTomasz Figa <t.figa@samsung.com> Signed-off-by: NEduardo Valentin <edubezval@gmail.com>
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由 Naveen Krishna Chatradhi 提交于
On Exynos5440 and Exynos5420 there are registers common across the TMU channels. To support that, we introduced a ADDRESS_MULTIPLE flag in the driver and the 2nd set of register base and size are provided in the "reg" property of the node. As per Amit's suggestion, this patch changes the base_common to base_second and SHARED_MEMORY to ADDRESS_MULTIPLE. Signed-off-by: NNaveen Krishna Chatradhi <ch.naveen@samsung.com> Acked-by: NAmit Daniel Kachhap <amit.daniel@samsung.com> Reviewed-by: NBartlomiej Zolnierkiewicz <b.zolnierkie@samsung.com> Reviewed-by: NTomasz Figa <t.figa@samsung.com> Signed-off-by: NEduardo Valentin <edubezval@gmail.com>
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- 03 1月, 2014 1 次提交
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由 Anson Huang 提交于
Thermal sensor needs pll3_usb_otg when measuring temperature, otherwise the temperature read will be incorrect, so need to enable this clk before sensor working, for alarm function, as hardware will take measurement periodically, so we should keep this clk always on once alarm function is enabled. Signed-off-by: NAnson Huang <b20788@freescale.com> Acked-by: NShawn Guo <shawn.guo@linaro.org> Signed-off-by: NZhang Rui <rui.zhang@intel.com>
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- 04 12月, 2013 1 次提交
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由 Eduardo Valentin 提交于
This patch introduces a device tree bindings for describing the hardware thermal behavior and limits. Also a parser to read and interpret the data and feed it in the thermal framework is presented. This patch introduces a thermal data parser for device tree. The parsed data is used to build thermal zones and thermal binding parameters. The output data can then be used to deploy thermal policies. This patch adds also documentation regarding this API and how to define tree nodes to use this infrastructure. Note that, in order to be able to have control on the sensor registration on the DT thermal zone, it was required to allow changing the thermal zone .get_temp callback. For this reason, this patch also removes the 'const' modifier from the .ops field of thermal zone devices. Cc: Zhang Rui <rui.zhang@intel.com> Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Acked-by: NMark Rutland <mark.rutland@arm.com> Signed-off-by: NEduardo Valentin <eduardo.valentin@ti.com>
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- 13 8月, 2013 2 次提交
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由 Amit Daniel Kachhap 提交于
Proper description for Exynos4 bindings added to Documentation/devicetree/ bindings. It adds description to use multiple TMU instances, optional voltage supply node and optional shared register across multiple TMU's. Acked-by: NJonghwa Lee <jonghwa3.lee@samsung.com> Signed-off-by: NLukasz Majewski <l.majewski@samsung.com> Signed-off-by: NKyungmin Park <kyungmin.park@samsung.com> Signed-off-by: NAmit Daniel Kachhap <amit.daniel@samsung.com> Acked-by: NEduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: NEduardo Valentin <eduardo.valentin@ti.com>
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由 Shawn Guo 提交于
This is based on the initial imx thermal work done by Rob Lee <rob.lee@linaro.org> (Not sure if the email address is still valid). Since he is no longer interested in the work and I have rewritten a significant amount of the code, I just took the authorship over from him. It adds the imx thermal support using Temperature Monitor (TEMPMON) block found on some Freescale i.MX SoCs. The driver uses syscon regmap interface to access TEMPMON control registers and calibration data, and supports cpufreq as the cooling device. Signed-off-by: NShawn Guo <shawn.guo@linaro.org> Signed-off-by: NEduardo Valentin <eduardo.valentin@ti.com>
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- 08 7月, 2013 1 次提交
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由 Eduardo Valentin 提交于
This change updates the ti-soc-thermal driver to use standard GPIO DT bindings to read the GPIO number associated to thermal shutdown IRQ, in case the device features it. Previously, the code was using a specific DT bindings. As now OMAP supports the standard way to model GPIOs, there is no point in having a ti specific binding. Cc: Zhang Rui <rui.zhang@intel.com> Cc: Grant Likely <grant.likely@linaro.org> Cc: Rob Herring <rob.herring@calxeda.com> Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Cc: devicetree-discuss@lists.ozlabs.org Signed-off-by: NEduardo Valentin <eduardo.valentin@ti.com>
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- 13 6月, 2013 2 次提交
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由 Eduardo Valentin 提交于
Update documentation by adding an example for DRA752 on DT description. Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Cc: Grant Likely <grant.likely@linaro.org> Cc: Rob Herring <rob.herring@calxeda.com> Cc: Rob Landley <rob@landley.net> Cc: Greg Kroah-Hartman <gregkh@linuxfoundation.org> Cc: Zhang Rui <rui.zhang@intel.com> Cc: J Keerthy <j-keerthy@ti.com> Cc: devicetree-discuss@lists.ozlabs.org Cc: linux-doc@vger.kernel.org Cc: linux-kernel@vger.kernel.org Signed-off-by: NEduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: NZhang Rui <rui.zhang@intel.com>
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由 Eduardo Valentin 提交于
Add missing irq line for TALERT on DT entry for OMAP5430. Cc: linux-pm@vger.kernel.org Cc: Grant Likely <grant.likely@linaro.org> Cc: Rob Herring <rob.herring@calxeda.com> Cc: Rob Landley <rob@landley.net> Cc: Greg Kroah-Hartman <gregkh@linuxfoundation.org> Cc: Zhang Rui <rui.zhang@intel.com> Cc: J Keerthy <j-keerthy@ti.com> Cc: devicetree-discuss@lists.ozlabs.org Cc: linux-doc@vger.kernel.org Cc: linux-kernel@vger.kernel.org Signed-off-by: NEduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: NZhang Rui <rui.zhang@intel.com>
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- 28 5月, 2013 1 次提交
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由 Eduardo Valentin 提交于
This patch moves the ti-soc-thermal driver out of the staging tree to the thermal tree. Cc: Grant Likely <grant.likely@linaro.org> Cc: Rob Herring <rob.herring@calxeda.com> Cc: Rob Landley <rob@landley.net> Cc: Greg Kroah-Hartman <gregkh@linuxfoundation.org> Cc: Zhang Rui <rui.zhang@intel.com> Cc: Eduardo Valentin <eduardo.valentin@ti.com> Cc: J Keerthy <j-keerthy@ti.com> Cc: Radhesh Fadnis <radhesh.fadnis@ti.com> Cc: Cyril Roelandt <tipecaml@gmail.com> Cc: devicetree-discuss@lists.ozlabs.org Cc: linux-doc@vger.kernel.org Cc: linux-kernel@vger.kernel.org Cc: devel@driverdev.osuosl.org Cc: linux-pm@vger.kernel.org Signed-off-by: NEduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: NZhang Rui <rui.zhang@intel.com>
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- 02 4月, 2013 1 次提交
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由 Ezequiel Garcia 提交于
This driver supports both Armada 370 and Armada XP SoC thermal management controllers. Armada 370 has a register to check a valid temperature, whereas Armada XP does not. Each has a different initialization (i.e. calibration) function. The temperature conversion formula is the same for both. The controller present in each SoC have a very similar feature set, so it corresponds to have one driver to support both of them. Although this driver may present similarities to Dove and Kirkwood thermal driver, the exact differences and coincidences are not fully known. For this reason, support is given through a separate driver. Signed-off-by: NEzequiel Garcia <ezequiel.garcia@free-electrons.com> Signed-off-by: NZhang Rui <rui.zhang@intel.com>
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- 08 2月, 2013 3 次提交
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由 Andrew Lunn 提交于
The Marvell Dove SoC has a thermal sensor. Add a driver using the thermal framework. Signed-off-by: NAndrew Lunn <andrew@lunn.ch> Signed-off-by: NSebastian Hesselbarth <sebastian.hesselbarth@gmail.com> Signed-off-by: NZhang Rui <rui.zhang@intel.com>
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由 Nobuhiro Iwamatsu 提交于
This patch adds support for Kirkwood 88F6282 and 88F6283 thermal sensor. Signed-off-by: NNobuhiro Iwamatsu <iwamatsu@nigauri.org> Signed-off-by: NAndrew Lunn <andrew@lunn.ch> Signed-off-by: NZhang Rui <rui.zhang@intel.com>
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由 Kuninori Morimoto 提交于
Support for loading the Renesas R-Car thermal module via devicetree. Signed-off-by: NKuninori Morimoto <kuninori.morimoto.gx@renesas.com> Signed-off-by: NZhang Rui <rui.zhang@intel.com>
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- 15 11月, 2012 1 次提交
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由 hongbo.zhang 提交于
This driver is based on the thermal management framework in thermal_sys.c. A thermal zone device is created with the trip points to which cooling devices can be bound, the current cooling device is cpufreq, e.g. CPU frequency is clipped down to cool the CPU, and other cooling devices can be added and bound to the trip points dynamically. The platform specific PRCMU interrupts are used to active thermal update when trip points are reached. Signed-off-by: Nhongbo.zhang <hongbo.zhang@linaro.com> Reviewed-by: NViresh Kumar <viresh.kumar@linaro.org> Reviewed-by: NFrancesco Lavra <francescolavra.fl@gmail.com> Signed-off-by: NZhang Rui <rui.zhang@intel.com>
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- 02 6月, 2012 1 次提交
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由 Viresh Kumar 提交于
SPEAr platforms now support DT and so must convert all drivers to support DT. This patch adds DT probing support for SPEAr thermal sensor driver and updates its documentation too. Also, as SPEAr is the only user of this driver and is only available with DT, make this an only DT driver. So, platform_data is completely removed and passed via DT now. Signed-off-by: NViresh Kumar <viresh.kumar@st.com> Cc: Dan Carpenter <dan.carpenter@oracle.com> Reviewed-by: NVincenzo Frascino <vincenzo.frascino@st.com> Signed-off-by: NAndrew Morton <akpm@linux-foundation.org> Signed-off-by: NLen Brown <len.brown@intel.com>
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