Use standard GPIO constants to enhance the readability of DT GPIOs.
Signed-off-by: NFlorian Vaussard <florian.vaussard@epfl.ch>
Acked-by: NSantosh Shilimkar <santosh.shilimkar@ti.com>
Reviewed-by: NStephen Warren <swarren@nvidia.com>
Signed-off-by: NBenoit Cousson <benoit.cousson@linaro.org>

Replace /include/ by #include for OMAP2+ DT, in order to use the
C pre-processor, making use of #define features possible.
Signed-off-by: NFlorian Vaussard <florian.vaussard@epfl.ch>
Acked-by: NSantosh Shilimkar <santosh.shilimkar@ti.com>
Reviewed-by: NStephen Warren <swarren@nvidia.com>
Signed-off-by: NBenoit Cousson <benoit.cousson@linaro.org>

The IGEP COM Module has an 512MB NAND flash memory.

Add a device node for this NAND and its partition layout.
Signed-off-by: NJavier Martinez Canillas <javier.martinez@collabora.co.uk>
Signed-off-by: NBenoit Cousson <benoit.cousson@linaro.org>

ISEE IGEP COM Module is an TI OMAP3 SoC computer on module.

This patch adds an initial device tree support to boot an
IGEP COM Module from the MMC/SD.
Signed-off-by: NJavier Martinez Canillas <javier.martinez@collabora.co.uk>
Tested-by: NEnric Balletbo i Serra <eballetbo@gmail.com>
[b-cousson@ti.com: Update the Makefile for 3.8-rc2]
Signed-off-by: NBenoit Cousson <benoit.cousson@linaro.org>

ISEE IGEPv2 is an TI OMAP3 SoC based embedded board.

This patch adds an initial device tree support to boot
an IGEPv2 from the MMC/SD.

Currently is working everything that is supported by DT
on OMAP3 SoCs (MMC/SD, GPIO LEDs, EEPROM, TWL4030 audio).
Signed-off-by: NJavier Martinez Canillas <javier.martinez@collabora.co.uk>
Tested-by: NEnric Balletbo i Serra <eballetbo@gmail.com>
[benoit.cousson@linaro.org: Update the Makefile for 3.8-rc2]
Signed-off-by: NBenoit Cousson <benoit.cousson@linaro.org>