1. 15 3月, 2011 2 次提交
  2. 10 1月, 2011 1 次提交
  3. 09 1月, 2011 1 次提交
  4. 29 10月, 2010 2 次提交
    • J
      Move ams driver to macintosh · bd5f47ec
      Jean Delvare 提交于
      The ams driver isn't a hardware monitoring driver, so it shouldn't
      live under driver/hwmon. drivers/macintosh seems much more
      appropriate, as the driver is only useful on PowerBooks and iBooks.
      Signed-off-by: NJean Delvare <khali@linux-fr.org>
      Cc: Guenter Roeck <guenter.roeck@ericsson.com>
      Cc: Stelian Pop <stelian@popies.net>
      Cc: Michael Hanselmann <linux-kernel@hansmi.ch>
      Cc: Benjamin Herrenschmidt <benh@kernel.crashing.org>
      Cc: Grant Likely <grant.likely@secretlab.ca>
      bd5f47ec
    • W
      hwmon: New driver for the W83795G/ADG monitoring chips · 792d376b
      Wei Song 提交于
      There is still much work needed, but I wanted to give Wei the credit
      he deserves. I've merged some of my own fixes already, to make
      gcc and checkpatch happy. Individual fixes and improvements from me
      will follow.
      
      [JD: Fix build errors]
      [JD: Coding style cleanups]
      [JD: Get rid of forward declarations]
      [JD: Drop VID support]
      [JD: Drop fault output control feature]
      [JD: Use lowercase for inline function names]
      [JD: Use strict variants of the strtol/ul functions]
      [JD: Shorten the read and write function names]
      Signed-off-by: NJean Delvare <khali@linux-fr.org>
      792d376b
  5. 26 10月, 2010 2 次提交
  6. 21 10月, 2010 1 次提交
  7. 15 8月, 2010 1 次提交
  8. 10 8月, 2010 2 次提交
  9. 05 8月, 2010 1 次提交
  10. 04 8月, 2010 1 次提交
    • F
      x86, hwmon: Package Level Thermal/Power: pkgtemp hwmon driver · cb84b194
      Fenghua Yu 提交于
      This patch adds a hwmon driver for package level thermal control. The driver
      dumps package level thermal information through sysfs interface so that upper
      level application (e.g. lm_sensor) can retrive the information.
      
      Instead of having the package level hwmon code in coretemp, I write a seperate
      driver pkgtemp because:
      
      First, package level thermal sensors include not only sensors for each core,
      but also sensors for uncore, memory controller or other components in the
      package. Logically it will be clear to have a seperate hwmon driver for package
      level hwmon to monitor wider range of sensors in a package. Merging package
      thermal driver into core thermal driver doesn't make sense and may mislead.
      
      Secondly, merging the two drivers together may cause coding mess. It's easier
      to include various package level sensors info if more sensor information is
      implemented. Coretemp code needs to consider a lot of legacy machine cases.
      Pkgtemp code only considers platform starting from Sandy Bridge.
      
      On a 1Sx4Cx2T Sandy Bridge platform, lm-sensors dumps the pkgtemp and coretemp:
      
      pkgtemp-isa-0000
      Adapter: ISA adapter
      physical id 0: +33.0°C  (high = +79.0°C, crit = +99.0°C)
      
      coretemp-isa-0000
      Adapter: ISA adapter
      Core 0:      +32.0°C  (high = +79.0°C, crit = +99.0°C)
      
      coretemp-isa-0001
      Adapter: ISA adapter
      Core 1:      +32.0°C  (high = +79.0°C, crit = +99.0°C)
      
      coretemp-isa-0002
      Adapter: ISA adapter
      Core 2:      +32.0°C  (high = +79.0°C, crit = +99.0°C)
      
      coretemp-isa-0003
      Adapter: ISA adapter
      Core 3:      +32.0°C  (high = +79.0°C, crit = +99.0°C)
      
      [ hpa: folded v3 patch removing improper global variable "SHOW" ]
      Signed-off-by: NFenghua Yu <fenghua.yu@intel.com>
      LKML-Reference: <1280448826-12004-3-git-send-email-fenghua.yu@intel.com>
      Reviewed-by: NLen Brown <len.brown@intel.com>
      Signed-off-by: NH. Peter Anvin <hpa@linux.intel.com>
      cb84b194
  11. 28 5月, 2010 2 次提交
  12. 25 5月, 2010 1 次提交
  13. 06 3月, 2010 3 次提交
  14. 12 1月, 2010 1 次提交
  15. 18 12月, 2009 1 次提交
  16. 17 12月, 2009 2 次提交
  17. 10 12月, 2009 2 次提交
  18. 24 9月, 2009 1 次提交
  19. 17 9月, 2009 2 次提交
  20. 15 9月, 2009 2 次提交
  21. 18 7月, 2009 1 次提交
  22. 16 6月, 2009 1 次提交
  23. 14 4月, 2009 1 次提交
    • J
      hwmon: sht15 humidity sensor driver · 251eb40f
      Jonathan Cameron 提交于
      Data sheet at:
      http://www.sensirion.ch/en/pdf/product_information/Datasheet-humidity-sensor-SHT1x.pdf
      
      These sensors communicate over a 2 wire bus running a device specific
      protocol.  The complexity of the driver is mainly due to handling the
      substantial delays between requesting a reading and the device pulling the
      data line low to indicate that the data is available.  This is handled by
      an interrupt that is disabled under all other conditions.
      
      I wasn't terribly clear on the best way to handle this, so comments on
      that aspect would be particularly welcome!
      
      Interpretation of the temperature depends on knowing the supply voltage.
      If configured in a board config as a regulator consumer this is obtained
      from the regulator subsystem.  If not it should be provided in the
      platform data.
      
      I've placed this driver in the hwmon subsystem as it is definitely a
      device that may be used for hardware monitoring and with it's relatively
      slow response times (up to 120 millisecs to get a reading) a caching
      strategy certainly seems to make sense!
      Signed-off-by: NJonathan Cameron <jic23@cam.ac.uk>
      Signed-off-by: NAndrew Morton <akpm@linux-foundation.org>
      Signed-off-by: NLinus Torvalds <torvalds@linux-foundation.org>
      251eb40f
  24. 07 4月, 2009 2 次提交
  25. 01 4月, 2009 3 次提交
  26. 31 3月, 2009 1 次提交
    • J
      Move the pcf8591 driver to hwmon · fb4504fe
      Jean Delvare 提交于
      Directory drivers/i2c/chips is going away, so drivers there must find
      new homes. For the pcf8591 driver, the best choice seems to be the
      hwmon subsystem. While the Philips PCF8591 device isn't a typical
      hardware monitoring chip, its DAC interface is compatible with the
      hwmon one, so it fits somewhat.
      
      If a better subsystem is ever created for ADC/DAC chips, the driver
      could be moved there.
      Signed-off-by: NJean Delvare <khali@linux-fr.org>
      Cc: Aurelien Jarno <aurelien@aurel32.net>
      fb4504fe