ICX: powercap/intel_rapl: Support multi-die/package
commit 32fb480e0a2cf1f71e4174d6477198c94dbc746c upstream. RAPL "package" domains are actually implemented in hardware per-die. Thus, the new multi-die/package systems have mulitple domains within each physical package. Update the intel_rapl driver to be "die aware" -- exporting multiple domains within a single package, when present. No change on single die/package systems. Signed-off-by: NZhang Rui <rui.zhang@intel.com> Signed-off-by: NLen Brown <len.brown@intel.com> Signed-off-by: NThomas Gleixner <tglx@linutronix.de> Reviewed-by: NIngo Molnar <mingo@kernel.org> Acked-by: NRafael J. Wysocki <rafael.j.wysocki@intel.com> Acked-by: NPeter Zijlstra (Intel) <peterz@infradead.org> Cc: linux-pm@vger.kernel.org Link: https://lkml.kernel.org/r/9fcb4719aeb7efccf3bc75ed8dd559e46121649f.1557769318.git.len.brown@intel.comSigned-off-by: NYouquan Song <youquan.song@intel.com> Signed-off-by: NJeffle Xu <jefflexu@linux.alibaba.com> Acked-by: NJoseph Qi <joseph.qi@linux.alibaba.com> Acked-by: NCaspar Zhang <caspar@linux.alibaba.com>
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