DT bindings for hisilicon HI655x PMIC chip.
Signed-off-by: NChen Feng <puck.chen@hisilicon.com>
Signed-off-by: NFei Wang <w.f@huawei.com>
Signed-off-by: NXinwei Kong <kong.kongxinwei@hisilicon.com>
Reviewed-by: NHaojian Zhuang <haojian.zhuang@linaro.org>
Signed-off-by: NLee Jones <lee.jones@linaro.org>