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由 Erik Stromdahl 提交于
Added support for extended ready message. The extended ready message contains the maximum bundle count supported by SDIO chipsets. It is transmitted by SDIO chipset only and replaces the "standard" ready message in this case. Signed-off-by: NErik Stromdahl <erik.stromdahl@gmail.com> Signed-off-by: NKalle Valo <kvalo@qca.qualcomm.com>
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