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由 Haim Dreyfuss 提交于
Integrated chip may have different HW and RF steps. Currently, the driver supports only different HW steps. Add logic to support different RF steps enables combining different HW and RF steps. Signed-off-by: NHaim Dreyfuss <haim.dreyfuss@intel.com> Signed-off-by: NLuca Coelho <luciano.coelho@intel.com>
0705b953