- 25 9月, 2010 4 次提交
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由 Jan Beulich 提交于
Other than coretemp, from which this code was apparently derived, there is no PCI specific code in this driver. Signed-off-by: NJan Beulich <jbeulich@novell.com> Cc: Fenghua Yu <fenghua.yu@intel.com> Signed-off-by: NGuenter Roeck <guenter.roeck@ericsson.com>
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由 Jan Beulich 提交于
Feature availability should also be checked in the hotplug code path. Signed-off-by: NJan Beulich <jbeulich@novell.com> Cc: Fenghua Yu <fenghua.yu@intel.com> Signed-off-by: NGuenter Roeck <guenter.roeck@ericsson.com>
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由 Jan Beulich 提交于
While apparently inherited from coretemp source, this particular error handling cleanup and exit path wasn't copied properly (or perhaps got discarded intermediately and not re-added properly later). Signed-off-by: NJan Beulich <jbeulich@novell.com> Cc: Fenghua Yu <fenghua.yu@intel.com> Signed-off-by: NGuenter Roeck <guenter.roeck@ericsson.com> (added device file removal in pkgtemp_remove)
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由 Jan Beulich 提交于
pkgtemp_device_remove(), holding the list protecting mutex, calls pkgtemp_device_add(), which itself wants to acquire the same mutex. Holding the mutex over the entire loop body in pkgtemp_device_remove() isn't really necessary, as long as the loop gets exited after processing the matched CPU. Once exiting the loop after removing an eventual match, there's no need for using the "safe" list iterator anymore. Signed-off-by: NJan Beulich <jbeulich@novell.com> Cc: Fenghua Yu <fenghua.yu@intel.com> Signed-off-by: NGuenter Roeck <guenter.roeck@ericsson.com>
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- 04 8月, 2010 1 次提交
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由 Fenghua Yu 提交于
This patch adds a hwmon driver for package level thermal control. The driver dumps package level thermal information through sysfs interface so that upper level application (e.g. lm_sensor) can retrive the information. Instead of having the package level hwmon code in coretemp, I write a seperate driver pkgtemp because: First, package level thermal sensors include not only sensors for each core, but also sensors for uncore, memory controller or other components in the package. Logically it will be clear to have a seperate hwmon driver for package level hwmon to monitor wider range of sensors in a package. Merging package thermal driver into core thermal driver doesn't make sense and may mislead. Secondly, merging the two drivers together may cause coding mess. It's easier to include various package level sensors info if more sensor information is implemented. Coretemp code needs to consider a lot of legacy machine cases. Pkgtemp code only considers platform starting from Sandy Bridge. On a 1Sx4Cx2T Sandy Bridge platform, lm-sensors dumps the pkgtemp and coretemp: pkgtemp-isa-0000 Adapter: ISA adapter physical id 0: +33.0°C (high = +79.0°C, crit = +99.0°C) coretemp-isa-0000 Adapter: ISA adapter Core 0: +32.0°C (high = +79.0°C, crit = +99.0°C) coretemp-isa-0001 Adapter: ISA adapter Core 1: +32.0°C (high = +79.0°C, crit = +99.0°C) coretemp-isa-0002 Adapter: ISA adapter Core 2: +32.0°C (high = +79.0°C, crit = +99.0°C) coretemp-isa-0003 Adapter: ISA adapter Core 3: +32.0°C (high = +79.0°C, crit = +99.0°C) [ hpa: folded v3 patch removing improper global variable "SHOW" ] Signed-off-by: NFenghua Yu <fenghua.yu@intel.com> LKML-Reference: <1280448826-12004-3-git-send-email-fenghua.yu@intel.com> Reviewed-by: NLen Brown <len.brown@intel.com> Signed-off-by: NH. Peter Anvin <hpa@linux.intel.com>
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