Thermal: rename structure thermal_cooling_device_instance to thermal_instance
This struct is used to describe the behavior for a thermal cooling device on a certain trip point for a certain thremal zone. thermal_cooling_device_instance is not accurate, as a cooling device can be used for more than one trip point in one thermal zone device. Signed-off-by: NZhang Rui <rui.zhang@intel.com> Reviewed-by: NRafael J. Wysocki <rjw@sisk.pl> Reviewed-by: NEduardo Valentin <eduardo.valentin@ti.com>
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